conga-TCRP1 COM® Express 3.1 Type 6 Modules

congatec conga-TCRP1 COM® Express 3.1 Type 6 Modules are ideal for cost-sensitive designs that require a highly flexible and scalable embedded computing platform. These AMD Ryzen™ Artificial Intelligence (AI) Embedded P100 COM Express 3.1 Type 6 compact modules allow users to seamlessly scale from 4 to 12 CPU cores and from 2 to 16 graphics compute units. These performance features allow the conga-TCRP1 to balance CPU, graphics processing unit (GPU), and neural processing unit (NPU) resources. One module variant can be used for various designs, ranging from passively cooled, fully enclosed designs for robust handheld devices and hygienic medical PCs to mission computers for harsh environments and high-performance system designs. These congtec COM Express compact modules leverage AMD Zen 5 and Zen 5c CPU architecture with 4nm technology, delivering enhanced determinism for real-time and latency-sensitive workloads. A Radeon RDNA 3.5™ GPU and the XDNA2™ NPU contribute up to 50TOPS of AI compute capability. This computing architecture accelerates performance-intensive and deterministic edge AI applications, including transportation, medical technology, smart city infrastructures, gaming, robotics, and industrial automation.

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congatec 模块化计算机 - COM COM Express Compact module based on AMD Ryzen AI Embedded P185 processor with 12Cores Integrated XDNA 2 NPU Integrated RDNA 3.5 Graphics with 16 CUs Dual channelSODIMM DDR5 5600 MT/s memory interface Commercial grade temperature range from 0Cto +
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congatec 模块化计算机 - COM COM Express Compact module based on AMD Ryzen AI Embedded P174 processor with 10Cores Integrated XDNA 2 NPU Integrated RDNA 3.5 Graphics with 12 CUs Dual channelSODIMM DDR5 5600 MT/s memory interface Commercial grade temperature range from 0Cto +
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congatec 模块化计算机 - COM COM Express Compact module based on AMD Ryzen AI Embedded P164 processor with 8Cores Integrated XDNA 2 NPU Integrated RDNA 3.5 Graphics with 12 CUs Dual channelSODIMM DDR5 5600 MT/s memory interface Commercial grade temperature range from 0Cto +6
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congatec 模块化计算机 - COM COM Express Compact module based on AMD Ryzen AI Embedded P132 processor with 6Cores Integrated XDNA 2 NPU Integrated RDNA 3.5 Graphics with 4 CUs Dual channelSODIMM DDR5 5600 MT/s memory interface Commercial grade temperature range from 0Cto +60
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congatec 模块化计算机 - COM COM Express Compact module based on AMD Ryzen AI Embedded P121 processor with 4Cores Integrated XDNA 2 NPU Integrated RDNA 3.5 Graphics with 2 CUs Dual channelSODIMM DDR5 5600 MT/s memory interface Commercial grade temperature range from 0Cto +60
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congatec 模块化计算机 - COM PTT: COM Express Type 6 Compact module based on AMD Ryzen Embedded xxxxx with 12 cores 2.0GHz up to 5.1GHz (boost) Integrated XDNA2 NPU Integrated RDNA 3.5 Graphics 24MB cache Dual channel SODIMM DDR5 5600 MT/s memory interface Commercial tempe
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congatec 模块化计算机 - COM PTT: COM Express Type 6 Compact module based on AMD Ryzen AI Embedded xxxxx with 10 cores 2.0GHz up to 5.0GHz (boost) Integrated XDNA2 NPU Integrated RDNA 3.5 Graphics 24MB cache Dual channel SODIMM DDR5 5600 MT/s memory interface Commercial te
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congatec 模块化计算机 - COM PTT: COM Express Type 6 Compact module based on AMD Ryzen AI Embedded xxxxx with 8 cores 2.0GHz up to 5.0GHz (boost) Integrated XDNA2 NPU Integrated RDNA 3.5 Graphics 16MB cache Dual channel SODIMM DDR5 5600 MT/s memory interface Commercial tem
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congatec 模块化计算机 - COM PTT: COM Express Type 6 Compact module based on AMD Ryzen AI Embedded P132 with 6 cores 2.0GHz up to TBDGHz (boost) Integrated XDNA2 NPU Integrated RDNA 3.5 Graphics 8MB cache Dual channel SODIMM DDR5 5600 MT/s memory interface Commercial tempe
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congatec conga-TCRP1/CSA-HP-B
congatec CPU与芯片冷却器 Standard active cooling solution for high performance COM Express module conga-TCRP1 with integrated heat pipes and 12V fan. All standoffs are with 2.7mm bore hole.
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congatec conga-TCRP1/CSA-HP-T
congatec CPU与芯片冷却器 Standard active cooling solution for high performance COM Express module conga-TCRP1 with integrated heat pipes and 12V fan. All standoffs are M2.5mm threaded.
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congatec conga-TCRP1/CSP-HP-B
congatec CPU与芯片冷却器 Standard passive cooling solution for high performance COM Express module conga-TCRP1 with integrated heat pipes. All standoffs are with 2.7mm bore hole.
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congatec conga-TCRP1/CSP-HP-T
congatec CPU与芯片冷却器 Standard passive cooling solution for high performance COM Express module conga-TCRP1 with integrated heat pipes. All standoffs are M2.5mm threaded.
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congatec conga-TCRP1/HSP-HP-B
congatec 散热片 Standard heatspreader for high performance COM Express module conga-TCRP1 with integrated heat pipes. All standoffs are with 2.7mm bore hole.
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congatec conga-TCRP1/HSP-HP-T
congatec 散热片 Standard heatspreader for high performance COM Express module conga-TCRP1 with integrated heat pipes. All standoffs are M2.5mm threaded.
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