FS3L50R07W2H3FB11BPSA1
图像仅供参考
请参阅产品规格
请参阅产品规格
726-FS3L50R07W2H3FB1
FS3L50R07W2H3FB11BPSA1
制造商：
说明：
IGBT 模块 650 V, 50 A 3-level IGBT module
IGBT 模块 650 V, 50 A 3-level IGBT module
库存量: 14
-
库存：
-
14 可立即发货出现意外错误。请稍候重试。
-
生产周期：
-
10 周 大于所示数量的预计工厂生产时间。
定价 (含13% 增值税)
| 数量 | 单价 |
总价
|
|---|---|---|
| ¥507.3022 | ¥507.30 | |
| ¥418.3825 | ¥4,183.83 | |
| ¥330.2877 | ¥34,680.21 | |
| 2,505 | 报价 |
数据表
Application Notes
- Aging stability of various heatconducting pastes for use with modules without baseplates (PDF)
- Application Note IGBT Definition of Junction Temperature (PDF)
- Application of screen print templates to paste thermal grease within IGBT modules (PDF)
- Assembly Instructions - Easy-PressFIT Modules (PDF)
- Deadtime calculation for IGBT Modules (PDF)
- Driving IGBTs with unipolar gate voltage (PDF)
- Industrial IGBT Modules Explanation of Technical Information (PDF)
- Transient Thermal Measurements and thermal equivalent circuit models (PDF)
- Using the NTC inside a power module (PDF)
Other
Product Catalogs
- 3-Level Inverter Modules (PDF)
- Easy & Econo Power Modules (PDF)
- Easy B-series and Easy750 Power modules (PDF)
- Infineon's Latest Power and Sensing Guide (PDF)
- Modules for Photovoltaic String and Multi-String Inverters (PDF)
- PressFIT - Our established, reliable mounting technology (PDF)
- Solutions for Industrial Drives (PDF)
- Solutions for Uninterruptible Power Supply (UPS) Systems (PDF)
Technical Resources
- Correlating NTC-Reading and Chip-Temperature in Power Electronic Modules (PDF)
- Impact of module parasitics on the performance of fast-switching devices (PDF)
- PressFIT Technology, a Solderless Method for Mounting Power Modules (PDF)
- Reliability of PressFIT connections (PDF)
- The challenge of accurately analyzing thermal resistances (PDF)
- Thermal Heat Sink Interface of IGBT Modules w/o Base Plate (PDF)
- Using 650-V High Speed 3 IGBTs in Power Modules for Solar Inverter Performance Improvement (PDF)
Test/Quality Data
- USHTS:
- 8541210095
- TARIC:
- 8541290000
- ECCN:
- EAR99
