AD7 Thermoset Chip Bonding Epoxy

Chip Quik AD7 Thermoset Chip Bonding Epoxy is designed to bond surface-mount chips and ICs to printed circuit boards (PCBs). The AD7 epoxy has low viscosity and is designed to be dot/line dispensed, allowing large and heavy surface-mount components to be permanently bonded to a PCB during reflow. This application enables two-sided mount reflow without larger chips or ICs coming loose. Curing time ranges from 120 to 180 seconds at the recommended curing temperature range of +190°C to +260°C. The maximum recommended dot size for Chip Quik AD7 Epoxy is 10mm x 10mm x 1mm.

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Chip Quik 液体分配器和瓶子 Thermoset Chip Bonding Epoxy (Red) 10g/10cc syringe (Thermal (Heat) Cure Adhesive/Glue)
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Syringes Red
Chip Quik 液体分配器和瓶子 Thermoset Chip Bonding Epoxy (Red) 30g/30cc syringe (Thermal (Heat) Cure Adhesive/Glue)
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Syringes Red
Chip Quik 液体分配器和瓶子 Thermoset Chip Bonding Epoxy (Red) 5g/5cc syringe (Thermal (Heat) Cure Adhesive/Glue)
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Syringes Red
Chip Quik 液体分配器和瓶子 Thermoset Chip Bonding Epoxy (Red) 200g/6oz cartridge (Thermal (Heat) Cure Adhesive/Glue)
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Cartridge Red