XCede® HD High-Density Backplane Systems

Samtec XCede® HD High-Density Backplane Systems combine a small form factor with incredible design flexibility for system and board space savings. These backplane systems allow for creating a fully custom backplane solution with guidance and keying, power modules, and sidewalls for increased durability. Samtec XCede HD backplane systems help prevent system downtime by implementing a staggered differential pin design where the ground pins mate first for hot-plugging. These backplane systems feature a 1.8mm column pitch, up to 3mm contact wipe on signal pins, and multiple signal/ground pin staging options. 

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选择 图像 零件编号 制造商 描述 数据表 供货情况 单价(含13%增值税) 根据您的数量,按照单价筛选表格中的结果。 数量 RoHS
Samtec HDTM-6-08-1-S-VT-4-L-1-B
Samtec 高速/模块连接器 XCede(R) HD 1.80 mm High-Density Backplane Vertical Header
Samtec HDTM-6-08-1-S-VT-4-L-1-G
Samtec 高速/模块连接器 XCede(R) HD 1.80 mm High-Density Backplane Vertical Header
Samtec HDTM-6-08-1-S-VT-4-L-2-A
Samtec 高速/模块连接器 XCede(R) HD 1.80 mm High-Density Backplane Vertical Header
Samtec HDTM-6-08-1-S-VT-5-R-2-A
Samtec 集管和线壳 XCede(R) HD 1.80 mm High-Density Backplane Vertical Header
Samtec HPTT-4-S-6-6-6-D-RA
Samtec Samtec XCede HD Power Module