路由器交换机和网络应用

Bergquist Company的路由器交换机和网络应用包括相变材料和导热粘合剂,用于促进热敏元件散热。在服务器主板以及路由器和交换机的线卡中使用先进材料可带来诸多优势,例如降低规模和成本。单次性能的少量提升,在重复数千次后将能为路由器和交换机的性能带来显著影响。Bergquist Company的散热产品可帮助元件正常工作,实现最佳运行。

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选择 图像 零件编号 制造商 描述 数据表 供货情况 单价(含13%增值税) 根据您的数量,按照单价筛选表格中的结果。 数量 RoHS ECAD模型 产品 类型 封装 / 箱体 材料 导热性 击穿电压 颜色 最小工作温度 最大工作温度 长度 宽度 厚度 抗拉强度 可燃性等级 系列 封装
Bergquist Company 2746202
Bergquist Company 导热接口产品 Gap Filler, Thermally Conductive, Liquid Gap Filler, Dual Cartridge

4000 / TGF 4000
Bergquist Company 2763082
Bergquist Company 导热接口产品 Gap Filler, Thermally Conductive, Liquid Gap Filler, Dual Cartridge

3500LV / TGF 3500LVO
Bergquist Company 2796659
Bergquist Company 导热接口产品 Conductive Gel Interface for Data/Telecom, 10 W/m-K, 1 Gallon Pail, Liqui-Form

TLF 10000
Bergquist Company 2166562
Bergquist Company 导热接口产品 Thermally Conductive, Liquid Gap Filler, Gap Filler TGF 1500 / 1500

1500 / TGF 1500
Bergquist Company 2191820
Bergquist Company 导热接口产品 Gap Filler (2-Part), No Spacer Beads, Pot Life=60m, 3.6 W/m-K, Dual Cartridge

3500S35 / TGF 3600
Bergquist Company 2194283
Bergquist Company 导热接口产品 Thermally Conductive, Liquid Gap Filler, Gap Filler TGF 1500 / 1500

1500 / TGF 1500
Bergquist Company 2196643
Bergquist Company 导热接口产品 Thermally Conductive, Liquid Gap Filler, Gap Filler TGF 4000 / 4000

4000 / TGF 4000
Bergquist Company 2360801
Bergquist Company 导热接口产品 Gap Filler (2-Part), No Spacer Beads, Pot Life=60m, 3.6 W/m-K, Dual Cartridge

3500S35 / TGF 3600
Bergquist Company 2456488
Bergquist Company 导热接口产品 Thermally Conductive, Liquid Gap Filler, Tube, Gap Filler TGF 3500LVO / 3500LV

3500LV / TGF 3500LVO
Bergquist Company 2478317
Bergquist Company 导热接口产品 Gap Filler, Thermally Conductive, Liquid Gap Filler, Dual Cartridge

3500LV / TGF 3500LVO
Bergquist Company 2763109
Bergquist Company 导热接口产品 Thermally Conductive, Liquid Gap Filler, Gap Filler TGF 3500LVO / 3500LV

3500LV / TGF 3500LVO
Bergquist Company 2763110
Bergquist Company 导热接口产品 Thermally Conductive, Liquid Gap Filler, Gap Filler TGF 3500LVO / 3500LV

3500LV / TGF 3500LVO
Bergquist Company 3041247
Bergquist Company 导热接口产品 GAP PAD, Silicone, 10 W/m-K, Ultra-Low Modulus, Cartridge(Cardboard), Industrial

TGP 10000ULM
Bergquist Company 3041248
Bergquist Company 导热接口产品 GAP PAD, Silicone, 10 W/m-K, Ultra-Low Modulus, Cartridge(Cardboard), Industrial

TGP 10000ULM
Bergquist Company 导热接口产品 Thermally Conductive, Liquid Gap Filler, 400CC Kit, IDH 2550920, 2166520

Gap Fillers / Gap Pads / Sheets Liquid Gap Filler Silicone Elastomer 3.6 W/m-K Blue - 60 C + 200 C UL 94 V-0 3500S35 / TGF 3600
Bergquist Company 导热接口产品 Phase Change Material, Thin Bond, 8.5 W/m-K, 800W, 0.008" Thick, 11"x75' Roll

Phase Change Materials Phase Change Material Non-standard 5.3 W/m-K - 40 C + 150 C 0.203 mm UL 94 V-0 THF 5000UT
Bergquist Company 导热接口产品 Phase Change Material, Thin Bond, 8.5 W/m-K, 800W, 0.010" Thick, 11"x75' Roll

Phase Change Materials Phase Change Material Non-standard 5.3 W/m-K - 40 C + 150 C 0.254 mm UL 94 V-0 THF 5000UT
Bergquist Company 导热接口产品 Phase Change Material, Thin Bond, 8.5 W/m-K, 800W, 0.012" Thick, 11"x75' Roll

Phase Change Materials Phase Change Material Non-standard 5.3 W/m-K - 40 C + 150 C 3.07 mm UL 94 V-0 THF 5000UT
Bergquist Company 导热接口产品 Conductive, 1-Part, Liquid Formable, 1 Gallon Pail, 6 W/m-K, Liqui-Form

Thermal Interface Materials Thermal Conductive Gel Paste Silicone Elastomer 6 W/m-K Gray - 60 C + 200 C 90 psi UL 94 V-0 TLF 6000HG
Bergquist Company 导热接口产品 GAP PAD, Conformable, Ultra-Low Modulus, TGP3500ULM/3500ULM, L8INW16INH0.1
Gap Fillers / Gap Pads / Sheets Thermal Pad Non-standard Silicone Elastomer 3.5 W/m-K 5 kVAC Gray - 60 C + 200 C 2.54 mm UL 94 V-0 3500ULM / TGP 3500ULM
Bergquist Company 导热接口产品 Conductive, 1-Part, Liquid Formable Material, 150CC, 3.5 W/m-K, Liqui-Form
Thermal Interface Materials Liquid Form 3.5 W/m-K Gray - 60 C + 200 C UL 94 V-0 3500 / TLF LF3500
Bergquist Company 导热接口产品 Conductive, 1-Part, Liquid Formable, 1 Gallon, 6.0 W/m-K, Liqui-Form TLF 6000HG
Thermal Interface Materials Thermal Conductive Gel Paste Silicone Elastomer 6 W/m-K Gray - 60 C + 200 C 90 psi UL 94 V-0 TLF 6000HG
Bergquist Company 导热接口产品 GAP PAD, Conformable, Ultra-Low Modulus, TGP3500ULM/3500ULM

Gap Fillers / Gap Pads / Sheets Thermal Pad Non-standard Silicone Elastomer 3.5 W/m-K 5 kVAC Gray - 60 C + 200 C 406.4 mm 203.2 mm 1.016 mm 4 psi UL 94 V-0 3500ULM / TGP 3500ULM
Bergquist Company 导热接口产品 Conductive, 1-Part, Liquid Formable, 180ml Cartridge, 6 W/m-K, Liqui-Form

Thermal Interface Materials Thermally Conductive Liquid Formable Material TLF 6000HG
Bergquist Company 导热接口产品 Liquid Gap Filler, 200CC Dual Cartridge, Gap Filler TGF 1500/1500, IDH 2233096

Gap Fillers / Gap Pads / Sheets Liquid Gap Filler Non-standard Silicone Elastomer 1.8 W/m-K Yellow, White - 60 C + 200 C UL 94 V-0 1500 / TGF 1500