存储应用

Bergquist Company存储应用采用专用于存储硬件的先进材料，可提高可靠性、稳定性和传输速率。可靠性和性能的每次提升都可以降低成本，同时满足用户不断提高的期望。Bergquist Company的热管理材料包括多种类型的产品，以满足各种应用需求。

结果: 83
选择 图像 零件编号
 制造商
描述 数据表 供货情况 单价（含13%增值税） 根据您的数量，按照单价筛选表格中的结果。
数量 RoHS ECAD模型 产品
类型
封装 / 箱体
材料
导热性
击穿电压
颜色
最小工作温度
最大工作温度
长度
宽度
厚度
抗拉强度
可燃性等级
系列
封装
Bergquist Company 导热接口产品 1-Part, Liquid Formable Material, 150CC Cartridge, 3.5 W/m-K, Liqui-Form
数据表

Thermal Interface Materials Thermal Conductive Gel Paste Silicone Elastomer 3.5 W/m-K Gray - 60 C + 200 C UL 94 V-0 3500 / TLF LF3500
Bergquist Company 导热接口产品 1-Part, Liquid Formable Material, 300CC Cartridge, 3.5 W/m-K, Liqui-Form
数据表

Thermal Interface Materials Thermally Conductive Liquid Formable Material Silicone Elastomer Gray - 60 C + 200 C UL 94 V-0 3500 / TLF LF3500
Bergquist Company 导热接口产品 1-Part, Liquid Formable Material, 4.33 Gallon Pail, 3.5 W/m-K, Liqui-Form
数据表

Thermal Interface Materials Thermal Conductive Gel Paste Silicone Elastomer 3.5 W/m-K Gray - 60 C + 200 C 330.2 mm 330.2 mm UL 94 V-0 3500 / TLF LF3500
Bergquist Company 导热接口产品 GAP PAD, 10W/m-K, 8" x 8" Sheet, 0.080" Thickness, TGP10000ULM, IDH 2591010
数据表

Gap Fillers / Gap Pads / Sheets Thermal Pad Non-standard Silicone 10 W/m-K 3.2 kVAC Gray - 60 C + 200 C 203.2 mm 203.2 mm 2.032 mm 25 psi UL 94 V-0 TGP 10000ULM
Bergquist Company 导热接口产品 GAP PAD, 10W/m-K, 8" x 8" Sheet, 0.125" Thickness, TGP10000ULM, IDH 2599713
数据表
直接发货交货期 8 周
最低： 2
倍数： 1

Gap Fillers / Gap Pads / Sheets Thermal Pad Non-standard Silicone 10 W/m-K 3.2 kVAC Gray - 60 C + 200 C 203.2 mm 203.2 mm 3.175 mm 25 psi UL 94 V-0 TGP 10000ULM
Bergquist Company 导热接口产品 GAP PAD, 7W/m-K, 8" x 8" Sheet, 0.125" Thickness, TGP7000ULM, IDH 2474886
数据表

Gap Fillers / Gap Pads / Sheets Thermal Pad Non-standard Silicone 7 W/m-K 5 kVAC Gray - 60 C + 200 C 203.2 mm 203.2 mm 3.175 mm 22 psi UL 94 V-0 TGP 7000ULM
Bergquist Company 导热接口产品 Thermally Conductive Gel Interface Material, 10 W/m-K, 0.8 Gallon Pail
数据表

Gap Fillers / Gap Pads / Sheets Thermal Gel Silicone Elastomer 10 W/m-K Red - 60 C + 200 C UL 94 V-0 TLF 10000
Bergquist Company 导热接口产品 Thermally Conductive Gel for Data & Telecom Market, 10 W/m-K, 30CC Syringe
数据表

TLF 10000
Bergquist Company 导热接口产品 GAP PAD, Conformable, Ultra-Low Modulus, TGP3500ULM/3500ULM
数据表
Gap Fillers / Gap Pads / Sheets Thermal Pad Non-standard Silicone Elastomer 3.5 W/m-K 5 kVAC Gray - 60 C + 200 C 406.4 mm 203.2 mm UL 94 V-0 3500ULM / TGP 3500ULM
Bergquist Company 导热接口产品 GAP PAD, 12 W/m-K, Ultra-Low Modulus, 8" x 8" Sheet, 0.060" Thickness
数据表

Gap Fillers / Gap Pads / Sheets Gap Filler Silicone 12 W/m-K 6.2 kVAC Gray - 60 C + 200 C 8 in 8 in 0.157 in UL 94 V-0 TGP 12000ULM
Bergquist Company 导热接口产品 GAP PAD, 12 W/m-K, Ultra-Low Modulus, 8" x 8" Sheet, 0.080" Thickness
数据表

Gap Fillers / Gap Pads / Sheets Gap Filler Silicone 12 W/m-K 6.2 kVAC Gray - 60 C + 200 C 8 in 8 in 0.157 in UL 94 V-0 TGP 12000ULM
Bergquist Company 导热接口产品 GAP PAD, 12 W/m-K, Ultra-Low Modulus, 8" x 8" Sheet, 0.100" Thickness
数据表

Gap Fillers / Gap Pads / Sheets Gap Filler Silicone 12 W/m-K 6.2 kVAC Gray - 60 C + 200 C 8 in 8 in 0.157 in UL 94 V-0 TGP 12000ULM
Bergquist Company 导热接口产品 GAP PAD, 12 W/m-K, Ultra-Low Modulus, 8" x 8" Sheet, 0.120" Thickness
数据表

Gap Fillers / Gap Pads / Sheets Gap Filler Silicone 12 W/m-K 6.2 kVAC Gray - 60 C + 200 C 8 in 8 in 0.157 in UL 94 V-0 TGP 12000ULM
Bergquist Company 导热接口产品 GAP PAD, 12 W/m-K, Ultra-Low Modulus, 8" x 8" Sheet, 0.160" Thickness
数据表

Gap Fillers / Gap Pads / Sheets Gap Filler Silicone 12 W/m-K 6.2 kVAC Gray - 60 C + 200 C 8 in 8 in 0.157 in UL 94 V-0 TGP 12000ULM
Bergquist Company 导热接口产品 1-Part, Liquid Formable Material, 600CC Cartridge, 3.5 W/m-K, Liqui-Form
数据表

Thermal Interface Materials Thermally Conductive Liquid Formable Material Silicone Elastomer Gray - 60 C + 200 C UL 94 V-0 3500 / TLF LF3500
Bergquist Company 2796659
Bergquist Company 导热接口产品 Conductive Gel Interface for Data/Telecom, 10 W/m-K, 1 Gallon Pail, Liqui-Form
数据表

TLF 10000
Bergquist Company 3041247
Bergquist Company 导热接口产品 GAP PAD, Silicone, 10 W/m-K, Ultra-Low Modulus, Cartridge(Cardboard), Industrial

TGP 10000ULM
Bergquist Company 3041248
Bergquist Company 导热接口产品 GAP PAD, Silicone, 10 W/m-K, Ultra-Low Modulus, Cartridge(Cardboard), Industrial

TGP 10000ULM
Bergquist Company 导热接口产品 Phase Change Material, Thin Bond, 8.5 W/m-K, 800W, 0.008" Thick, 11"x75' Roll
数据表

Phase Change Materials Phase Change Material Non-standard 5.3 W/m-K - 40 C + 150 C 0.203 mm UL 94 V-0 THF 5000UT
Bergquist Company 导热接口产品 Phase Change Material, Thin Bond, 8.5 W/m-K, 800W, 0.010" Thick, 11"x75' Roll
数据表

Phase Change Materials Phase Change Material Non-standard 5.3 W/m-K - 40 C + 150 C 0.254 mm UL 94 V-0 THF 5000UT
Bergquist Company 导热接口产品 Phase Change Material, Thin Bond, 8.5 W/m-K, 800W, 0.012" Thick, 11"x75' Roll
数据表

Phase Change Materials Phase Change Material Non-standard 5.3 W/m-K - 40 C + 150 C 3.07 mm UL 94 V-0 THF 5000UT
Bergquist Company 导热接口产品 Conductive, 1-Part, Liquid Formable, 1 Gallon Pail, 6 W/m-K, Liqui-Form
数据表

Thermal Interface Materials Thermal Conductive Gel Paste Silicone Elastomer 6 W/m-K Gray - 60 C + 200 C 90 psi UL 94 V-0 TLF 6000HG
Bergquist Company 导热接口产品 GAP PAD, Conformable, Ultra-Low Modulus, TGP3500ULM/3500ULM, L8INW16INH0.1
数据表
Gap Fillers / Gap Pads / Sheets Thermal Pad Non-standard Silicone Elastomer 3.5 W/m-K 5 kVAC Gray - 60 C + 200 C 2.54 mm UL 94 V-0 3500ULM / TGP 3500ULM
Bergquist Company 导热接口产品 Conductive, 1-Part, Liquid Formable Material, 150CC, 3.5 W/m-K, Liqui-Form
数据表
Thermal Interface Materials Liquid Form 3.5 W/m-K Gray - 60 C + 200 C UL 94 V-0 3500 / TLF LF3500
Bergquist Company 导热接口产品 Conductive, 1-Part, Liquid Formable, 1 Gallon, 6.0 W/m-K, Liqui-Form TLF 6000HG
数据表
Thermal Interface Materials Thermal Conductive Gel Paste Silicone Elastomer 6 W/m-K Gray - 60 C + 200 C 90 psi UL 94 V-0 TLF 6000HG