存储应用

Bergquist Company存储应用采用专用于存储硬件的先进材料,可提高可靠性、稳定性和传输速率。可靠性和性能的每次提升都可以降低成本,同时满足用户不断提高的期望。Bergquist Company的热管理材料包括多种类型的产品,以满足各种应用需求。

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选择 图像 零件编号 制造商 描述 数据表 供货情况 单价(含13%增值税) 根据您的数量,按照单价筛选表格中的结果。 数量 RoHS ECAD模型 产品 类型 封装 / 箱体 材料 导热性 击穿电压 颜色 最小工作温度 最大工作温度 长度 宽度 厚度 抗拉强度 可燃性等级 系列 封装
Bergquist Company 导热接口产品 Conductive, 1-Part, Liquid Formable, 1 Gallon, 6.0 W/m-K, Liqui-Form TLF 6000HG
Thermal Interface Materials Thermal Conductive Gel Paste Silicone Elastomer 6 W/m-K Gray - 60 C + 200 C 90 psi UL 94 V-0 TLF 6000HG
Bergquist Company 导热接口产品 GAP PAD, Conformable, Ultra-Low Modulus, TGP3500ULM/3500ULM

Gap Fillers / Gap Pads / Sheets Thermal Pad Non-standard Silicone Elastomer 3.5 W/m-K 5 kVAC Gray - 60 C + 200 C 406.4 mm 203.2 mm 1.016 mm 4 psi UL 94 V-0 3500ULM / TGP 3500ULM
Bergquist Company 导热接口产品 GAP PAD, 12 W/m-K, Ultra-Low Modulus, 8" x 8" Sheet, 0.140" Thickness

Gap Fillers / Gap Pads / Sheets Gap Filler Silicone 12 W/m-K 6.2 kVAC Gray - 60 C + 200 C 8 in 8 in 0.157 in UL 94 V-0 TGP 12000ULM
Bergquist Company 导热接口产品 Conductive, 1-Part, Liquid Formable, 180ml Cartridge, 6 W/m-K, Liqui-Form

Thermal Interface Materials Thermally Conductive Liquid Formable Material TLF 6000HG
Bergquist Company 导热接口产品 1-Part, Liquid Formable Material, 150CC Cartridge, 3.5 W/m-K, Liqui-Form

Thermal Interface Materials Thermal Conductive Gel Paste Silicone Elastomer 3.5 W/m-K Gray - 60 C + 200 C UL 94 V-0 3500 / TLF LF3500
Bergquist Company 导热接口产品 1-Part, Liquid Formable Material, 300CC Cartridge, 3.5 W/m-K, Liqui-Form

Thermal Interface Materials Thermally Conductive Liquid Formable Material Silicone Elastomer Gray - 60 C + 200 C UL 94 V-0 3500 / TLF LF3500
Bergquist Company 导热接口产品 GAP PAD, Conformable, Ultra-Low Modulus, TGP3500ULM/3500ULM, L8INW16INH0.1
Gap Fillers / Gap Pads / Sheets Thermal Pad Non-standard Silicone Elastomer 3.5 W/m-K 5 kVAC Gray - 60 C + 200 C 2.54 mm UL 94 V-0 3500ULM / TGP 3500ULM
Bergquist Company 导热接口产品 GAP PAD, Conformable, Ultra-Low Modulus, TGP3500ULM/3500ULM
Gap Fillers / Gap Pads / Sheets Thermal Pad Non-standard Silicone Elastomer 3.5 W/m-K 5 kVAC Gray - 60 C + 200 C 406.4 mm 203.2 mm UL 94 V-0 3500ULM / TGP 3500ULM
Bergquist Company 导热接口产品 Conductive, 1-Part, Liquid Formable Material, 150CC, 3.5 W/m-K, Liqui-Form
Thermal Interface Materials Liquid Form 3.5 W/m-K Gray - 60 C + 200 C UL 94 V-0 3500 / TLF LF3500
Bergquist Company 导热接口产品 GAP PAD, 12 W/m-K, Ultra-Low Modulus, 8" x 8" Sheet, 0.040" Thickness

Gap Fillers / Gap Pads / Sheets Gap Filler Silicone 12 W/m-K 6.2 kVAC Gray - 60 C + 200 C 8 in 8 in 0.157 in UL 94 V-0 TGP 12000ULM
Bergquist Company 导热接口产品 GAP PAD, 12 W/m-K, Ultra-Low Modulus, 8" x 8" Sheet, 0.060" Thickness

Gap Fillers / Gap Pads / Sheets Gap Filler Silicone 12 W/m-K 6.2 kVAC Gray - 60 C + 200 C 8 in 8 in 0.157 in UL 94 V-0 TGP 12000ULM
Bergquist Company 导热接口产品 GAP PAD, 12 W/m-K, Ultra-Low Modulus, 8" x 8" Sheet, 0.080" Thickness

Gap Fillers / Gap Pads / Sheets Gap Filler Silicone 12 W/m-K 6.2 kVAC Gray - 60 C + 200 C 8 in 8 in 0.157 in UL 94 V-0 TGP 12000ULM
Bergquist Company 导热接口产品 GAP PAD, 12 W/m-K, Ultra-Low Modulus, 8" x 8" Sheet, 0.100" Thickness

Gap Fillers / Gap Pads / Sheets Gap Filler Silicone 12 W/m-K 6.2 kVAC Gray - 60 C + 200 C 8 in 8 in 0.157 in UL 94 V-0 TGP 12000ULM
Bergquist Company 导热接口产品 GAP PAD, 12 W/m-K, Ultra-Low Modulus, 8" x 8" Sheet, 0.120" Thickness

Gap Fillers / Gap Pads / Sheets Gap Filler Silicone 12 W/m-K 6.2 kVAC Gray - 60 C + 200 C 8 in 8 in 0.157 in UL 94 V-0 TGP 12000ULM
Bergquist Company 导热接口产品 GAP PAD, 12 W/m-K, Ultra-Low Modulus, 8" x 8" Sheet, 0.160" Thickness

Gap Fillers / Gap Pads / Sheets Gap Filler Silicone 12 W/m-K 6.2 kVAC Gray - 60 C + 200 C 8 in 8 in 0.157 in UL 94 V-0 TGP 12000ULM
Bergquist Company 导热接口产品 GAP PAD, Ultra-Low Modulus, 8"x16" Sheet, 0.040" Thickness, 2 Side Tack

Gap Fillers / Gap Pads / Sheets Thermal Pad Non-standard Silicone Elastomer 3.5 W/m-K 5 kVAC Gray - 60 C + 200 C 406.4 mm 203.2 mm 1.016 mm UL 94 V-0 3500ULM / TGP 3500ULM
Bergquist Company 导热接口产品 GAP PAD, 7W/m-K, Ultra-Low Modulus, GAP PAD TGP 7000ULM

Gap Fillers / Gap Pads / Sheets Thermal Pad Non-standard Silicone 7 W/m-K 5 kVAC Gray - 60 C + 200 C 203.2 mm 203.2 mm 0.762 mm UL 94 V-0 TGP 7000ULM
Bergquist Company 导热接口产品

Non-standard 300G / THF 1600G
Bergquist Company 导热接口产品 1-Part, Liquid Formable Material, 600CC Cartridge, 3.5 W/m-K, Liqui-Form

Thermal Interface Materials Thermally Conductive Liquid Formable Material Silicone Elastomer Gray - 60 C + 200 C UL 94 V-0 3500 / TLF LF3500
Bergquist Company 导热接口产品 Phase Change Material, Thin Bond, 8.5 W/m-K, 800W, 0.008" Thick, 11"x75' Roll

Phase Change Materials Phase Change Material Non-standard 5.3 W/m-K - 40 C + 150 C 0.203 mm UL 94 V-0 THF 5000UT
Bergquist Company 导热接口产品 Phase Change Material, Thin Bond, 8.5 W/m-K, 800W, 0.010" Thick, 11"x75' Roll

Phase Change Materials Phase Change Material Non-standard 5.3 W/m-K - 40 C + 150 C 0.254 mm UL 94 V-0 THF 5000UT
Bergquist Company 导热接口产品 Phase Change Material, Thin Bond, 8.5 W/m-K, 800W, 0.012" Thick, 11"x75' Roll

Phase Change Materials Phase Change Material Non-standard 5.3 W/m-K - 40 C + 150 C 3.07 mm UL 94 V-0 THF 5000UT
Bergquist Company 导热接口产品 Thermally Conductive Gel Interface Material, 10 W/m-K, 0.8 Gallon Pail

Gap Fillers / Gap Pads / Sheets Thermal Gel Silicone Elastomer 10 W/m-K Red - 60 C + 200 C UL 94 V-0 TLF 10000
Bergquist Company 导热接口产品 Thermally Conductive Gel for Data & Telecom Market, 10 W/m-K, 30CC Syringe

TLF 10000
Bergquist Company 导热接口产品 Conductive, 1-Part, Liquid Formable, 1 Gallon Pail, 6 W/m-K, Liqui-Form

Thermal Interface Materials Thermal Conductive Gel Paste Silicone Elastomer 6 W/m-K Gray - 60 C + 200 C 90 psi UL 94 V-0 TLF 6000HG