ATS-HK379-R0

Advanced Thermal Solutions
984-ATS-HK379-R0
ATS-HK379-R0

制造商:

说明:
散热片 Cooler Backing Plate, High Performance, 96x96x6mm, 80mm Hole to Hole, Aluminum

ECAD模型:
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库存量: 649

库存:
649 可立即发货
生产周期:
13 周 大于所示数量的预计工厂生产时间。
最少: 1   倍数: 1
单价:
¥-.--
总价:
¥-.--
预估关税:

定价 (含13% 增值税)

数量 单价
总价
¥32.0129 ¥32.01
¥29.945 ¥299.45
¥29.1201 ¥728.00
¥27.459 ¥1,372.95
¥25.8883 ¥2,588.83
¥24.2385 ¥6,059.63
¥23.4136 ¥11,706.80
¥22.1706 ¥22,170.60

产品属性 属性值 选择属性
Advanced Thermal Solutions
产品种类: 散热片
RoHS:  
Accessories and Hardware
96 mm
96 mm
商标: Advanced Thermal Solutions
产品类型: Heat Sinks
系列: ATS-HK
工厂包装数量: 1
子类别: Heat Sinks
类型: Backing Plate
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已选择的属性: 0

CAHTS:
8473309000
USHTS:
8473305100
JPHTS:
847330090
MXHTS:
8473300499
ECCN:
EAR99

ATS-HK379-R0 High-Performance Cooler Backing Plate

Advanced Thermal Solutions ATS-HK379-R0 High-Performance Cooler Backing Plate is an optional backing plate that connects CPUs and other high-powered processors to the Ultra-Cool family of high-performance passive and active thermal solutions, including dual-FLOW™ and quadFLOW™. The ATS-HK379-R0 is designed for CPUs, processors, GPUs, AI processors, and FPGAs that fit sockets other than the Intel™ LGA2011 square and LGA2066 (Socket R). This plate comes with an unattached die-cut Formex GK-10 insulator to provide electrical insulation between the board and the backing plate. ATS High-Performance Cooler Backing Plate measures 96mm x 96mm with 70mm x 70mm inner dimensions and is intended for use with 1.57mm thick PCB. The ATS-HK379-R0 easily attaches beneath the PCB for even pressure across the board to prevent cracking or other damage.