Stamp-S3A Multiprotocol Modules

M5Stack Stamp-S3A Multiprotocol Modules are highly integrated embedded modules based on the Espressif ESP32-S3FN8. The devices feature a 240MHz Xtensa® 32-bit LX7 dual-core processor, integrating 8MB flash, a user button, and a programmable RGB LED. The deeply optimized 3D antenna design delivers stronger wireless communication performance, while 23 GPIOs are broken out and provided via pin headers or sockets, allowing developers to quickly build applications. M5Stack Stamp-S3A Multiprotocol Modules are available in three variants and are ideal for smart homes, industrial control terminals, wearables, and intelligent IoT devices.

结果: 3
选择 图像 零件编号 制造商 描述 数据表 供货情况 单价(含13%增值税) 根据您的数量,按照单价筛选表格中的结果。 数量 RoHS ECAD模型 频率 接口类型 最小工作温度 最大工作温度 尺寸
M5Stack 多协议模块 a highly integrated embedded module based on the Espressif ESP32-S3FN8, equipped with a 240MHz Xtensa 32-bit LX7 dual-core processor, integrated 8MB Flash 10库存量
最低: 1
倍数: 1

I2C 25.93 mm x 18 mm x 4.7 mm
M5Stack 多协议模块 M5stamps3A with 1.27 Header Pin 226库存量
最低: 1
倍数: 1

2.4 GHz GPIO, I2C, I2S, SPI, UART 0 C + 40 C
M5Stack 多协议模块 M5stamp EsP32s3A Module 40库存量
10预期 2026/2/18
最低: 1
倍数: 1