IT8高速56Gbps BGA夹层连接器

hirose Electric IT8高速56Gbps BGA夹层连接器在X和Y方向上,插配时允许自对准,容差可达±1.5mm。这些连接器有两件或三件类型可供选择,堆叠高度分别为10 mm至13 mm和14 mm至46 mm。两件式设计采用焊接工艺友好型BGA插头和插座,而三件式则有两个插头组装到PWB上,另一个可配置内插器完成电路和电路板之间的连接。

结果: 39
选择 图像 零件编号 制造商 描述 数据表 供货情况 单价(含13%增值税) 根据您的数量,按照单价筛选表格中的结果。 数量 RoHS ECAD模型 产品 位置数量 节距 端接类型 安装角 叠放高度 电流额定值 电压额定值 最大数据速率 最小工作温度 最大工作温度 触点电镀 触点材料 外壳材料 系列 封装
Hirose Connector 板对板与夹层连接器 288 position interposer for 32mm height

Interposers 288 Position Solder Balls Straight 32 mm 500 mA 50 V 56 Gb/s - 55 C + 85 C Gold Copper Alloy Polyphenylene Sulfide (PPS) IT8 Tray
Hirose Connector 板对板与夹层连接器 288 position interposer for 41mm height

Interposers 288 Position Solder Balls Straight 41 mm 500 mA 50 V 56 Gb/s - 55 C + 85 C Gold Copper Alloy Polyphenylene Sulfide (PPS) IT8 Tray
Hirose Connector 板对板与夹层连接器

Plugs 120 Position 1 mm (0.039 in) Solder Balls Straight 500 mA 50 V 56 Gb/s - 55 C + 85 C Gold Copper Alloy Liquid Crystal Polymer (LCP) IT8 Tray
Hirose Connector 板对板与夹层连接器

Plugs 192 Position 1 mm (0.039 in) Solder Balls Straight 500 mA 50 V 56 Gb/s - 55 C + 85 C Gold Copper Alloy Liquid Crystal Polymer (LCP) IT8 Tray
Hirose Connector 板对板与夹层连接器

Plugs 192 Position 1 mm (0.039 in) Solder Balls Straight 500 mA 50 V 56 Gb/s - 55 C + 85 C Gold Copper Alloy Liquid Crystal Polymer (LCP) IT8 Tray
Hirose Connector 板对板与夹层连接器

Plugs 288 Position 1 mm (0.039 in) Solder Balls Straight 500 mA 50 V 56 Gb/s - 55 C + 85 C Gold Copper Alloy Liquid Crystal Polymer (LCP) IT8 Tray
Hirose Connector 板对板与夹层连接器

Plugs 288 Position 1 mm (0.039 in) Solder Balls Straight 500 mA 50 V 56 Gb/s - 55 C + 85 C Gold Copper Alloy Liquid Crystal Polymer (LCP) IT8 Tray
Hirose Connector 板对板与夹层连接器

Plugs 120 Position 1 mm (0.039 in) Solder Balls Straight 500 mA 50 V 56 Gb/s - 55 C + 85 C Gold Copper Alloy Liquid Crystal Polymer (LCP) IT8 Tray
Hirose Connector 板对板与夹层连接器

Plugs 192 Position 1 mm (0.039 in) Solder Balls Straight 500 mA 50 V 56 Gb/s - 55 C + 85 C Gold Copper Alloy Liquid Crystal Polymer (LCP) IT8 Tray
Hirose Connector 板对板与夹层连接器

Plugs 288 Position 1 mm (0.039 in) Solder Balls Straight 500 mA 50 V 56 Gb/s - 55 C + 85 C Gold Copper Alloy Liquid Crystal Polymer (LCP) IT8 Tray
Hirose Connector 板对板与夹层连接器

Plugs 288 Position 1 mm (0.039 in) Solder Balls Straight 500 mA 50 V 56 Gb/s - 55 C + 85 C Gold Copper Alloy Liquid Crystal Polymer (LCP) IT8 Tray
Hirose Connector 板对板与夹层连接器

Receptacles 192 Position 1 mm (0.039 in) BGA Straight 12 mm 500 mA 50 VAC 56 Gb/s - 55 C + 85 C Gold Copper Alloy Polyphenylene Sulfide (PPS) IT8 Tray
Hirose Connector 板对板与夹层连接器

Receptacles 288 Position BGA Straight 10 mm 500 mA 50 VAC 56 Gb/s - 55 C + 85 C Gold Copper Alloy Polyphenylene Sulfide (PPS) IT8 Tray
Hirose Connector 板对板与夹层连接器
Receptacles 120 Position BGA Straight 10 mm 500 mA 50 VAC 56 Gb/s - 55 C + 85 C Gold Copper Alloy Polyphenylene Sulfide (PPS) IT8 Tray