MicroSpeed Triple High-Speed Connectors

TE Connectivity's ERNI MicroSpeed Triple High-Speed Connectors are ideally suited for next-generation communication standards such as Next Generation Ethernet 100Gbit/s (IEEE 802.3ba), optical internetworking forum (OIF), and the Internet of Things (loT). These shielded, high-density connectors utilize three rows to enable data rates of up to 25Gbit/s. They have SMT terminals that provide a high contact density with 3 x 25 positions in a 1mm pitch. Applications for TE Connectivity's ERNI MicroSpeed Triple High-Speed Connectors include data communication and telecommunication, high-end computing, medical technology, and industrial automation.

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选择 图像 零件编号 制造商 描述 数据表 供货情况 单价(含13%增值税) 根据您的数量,按照单价筛选表格中的结果。 数量 RoHS ECAD模型 产品 位置数量 节距 排数 端接类型 安装角 叠放高度 电流额定值 触点电镀 系列 封装
TE Connectivity / ERNI 板对板与夹层连接器 MSPEED 75 M SMD M1 BE ABC VVV 137 176 *

Connectors 75 Position 1 mm (0.039 in) 3 Row Solder Vertical 1 mm 1 A Gold MicroSpeed Reel
TE Connectivity / ERNI 板对板与夹层连接器 MSPEED 75 F SMD F4 BE ABC VVV 137 176 *

Connectors 75 Position 1 mm (0.039 in) 3 Row Solder Vertical 4 mm 1 A Gold MicroSpeed Reel