M Series D-Sub & Micro-D Connectors

AirBorn M Series D-Sub and Micro-D Connectors are designed for mission-critical applications where high density and high reliability are required. These connectors feature a rugged and reliable design as well as easy customization. AirBorn M Series interconnects are offered in I/O, straight, right-angle, and connector saver models. One-, two-, three-, and four-row options are available with 9 to 128 contacts and 0.050" (1.27mm) contact spacing. AirBorn M Series D-Sub Connectors are qualified to MIL-DTL-83513 requirements. Typical applications include navigation, radar, communications, avionics, medical devices, engine control, and more.

结果: 104
选择 图像 零件编号 制造商 描述 数据表 供货情况 单价(含13%增值税) 根据您的数量,按照单价筛选表格中的结果。 数量 RoHS ECAD模型 类型 外壳大小 电缆引入角 电缆引入数量 外壳材质 外壳电镀 位置数量
AirBorn D-Sub后壳 Rugged Backshell 2 Row NIC 2库存量
最低: 1
倍数: 1

EMI/RFI Backshell 21 Straight 1 Entry Aluminum Nickel 21 Position
AirBorn D-Sub后壳 Rugged Backshell 3 Row NIC 3库存量
最低: 1
倍数: 1

EMI/RFI Backshell 69 Straight 1 Entry Aluminum Electroless Nickel
AirBorn D-Sub后壳 Rugged Backshell 3 Row NIC 7库存量
最低: 1
倍数: 1

EMI/RFI Backshell 51 45 deg 1 Entry Aluminum Electroless Nickel
AirBorn D-Sub后壳 Rugged Backshell 3 Row NIC 1库存量
40在途量
最低: 1
倍数: 1

EMI/RFI Backshell 51 Straight 1 Entry Aluminum Nickel 51 Position
AirBorn D-Sub后壳 CONNECTOR, M SERIES 6库存量
最低: 1
倍数: 1

EMI/RFI Backshell Straight 1 Entry Aluminum Nickel 25 Position
AirBorn D-Sub后壳 Rugged Backshell 4 Row CAD 1库存量
最低: 1
倍数: 1
EMI/RFI Backshell 100 Straight 1 Entry Aluminum Cadmium
AirBorn D-Sub后壳 Rugged Backshell 2 Row NIC 5库存量
最低: 1
倍数: 1

EMI/RFI Backshell 15 45 deg 1 Entry Aluminum Electroless Nickel
AirBorn D-Sub后壳 Rugged Backshell 2 Row CAD 6库存量
最低: 1
倍数: 1
EMI/RFI Backshell 9 Straight 1 Entry Aluminum Cadmium
AirBorn D-Sub后壳 Rugged Backshell 4 Row NIC
8预期 2026/2/24
最低: 1
倍数: 1

EMI/RFI Backshell Straight 1 Entry Aluminum Nickel 100 Position
AirBorn D-Sub后壳 BACKSHELL, M SERIES
12预期 2026/3/30
最低: 1
倍数: 1

EMI/RFI Backshell 31 Straight 1 Entry Aluminum Electroless Nickel
AirBorn D-Sub后壳 EMI/RFI Backshell 无库存交货期 15 周
最低: 10
倍数: 1

EMI/RFI Backshell 2 (A) Straight 1 Entry Aluminum 15 Position
AirBorn D-Sub后壳 Rugged Backshell 2 Row NIC 无库存交货期 3 周
最低: 10
倍数: 1

EMI/RFI Backshell 37 45 deg 1 Entry Aluminum Electroless Nickel
AirBorn D-Sub后壳 Rugged Backshell 2 Row NIC 无库存交货期 9 周
最低: 10
倍数: 1

EMI/RFI Backshell 15 45 deg 1 Entry Aluminum Electroless Nickel
AirBorn D-Sub后壳 .050" Rugged Metal I/O Connector, 2 Row, Str RECPT, Sz 9 无库存交货期 20 周
最低: 10
倍数: 1

EMI/RFI Backshell 9 Straight 1 Entry Aluminum Electroless Nickel
AirBorn D-Sub后壳 Rugged Backshell 2 Row NIC 无库存
最低: 10
倍数: 1

EMI/RFI Backshell 9 Straight 1 Entry Aluminum Electroless Nickel
AirBorn D-Sub后壳 Rugged Backshell 2 Row NIC 无库存
最低: 10
倍数: 1

EMI/RFI Backshell 4 (C) Straight 1 Entry Aluminum Nickel 37 Position
AirBorn D-Sub后壳 Microminiature Series .050 无库存
最低: 10
倍数: 1

EMI/RFI Backshell Straight 1 Entry Aluminum Nickel 21 Position
AirBorn D-Sub后壳 .050" Low Profile Backshell Metal 无库存
最低: 10
倍数: 1

EMI/RFI Backshell 21 Straight 1 Entry Aluminum Nickel 21 Position
AirBorn D-Sub后壳 CONNECTOR, M SERIES 无库存
最低: 10
倍数: 1

EMI/RFI Backshell Straight 1 Entry Aluminum Electroless Nickel 25 Position
AirBorn D-Sub后壳 Rugged Backshell 2 Row CAD 无库存
最低: 10
倍数: 1
EMI/RFI Backshell 21 45 deg 1 Entry Aluminum Cadmium 21 Position
AirBorn D-Sub后壳 Rugged Backshell 2 Row CAD 无库存
最低: 10
倍数: 1
EMI/RFI Backshell 31 45 deg 1 Entry Aluminum Cadmium 31 Position
AirBorn D-Sub后壳 CONNECTOR, M SERIES 无库存交货期 21 周
最低: 10
倍数: 1
EMI/RFI Backshell 45 deg 1 Entry Aluminum Cadmium 25 Position
AirBorn D-Sub后壳 Rugged Backshell 2 Row CAD
EMI/RFI Backshell 31 Straight 1 Entry Aluminum Cadmium
AirBorn D-Sub后壳 Rugged Backshell 2 Row NIC

EMI/RFI Backshell 9 Straight 1 Entry Aluminum Electroless Nickel
AirBorn D-Sub后壳 Rugged Backshell 2 Row NIC

EMI/RFI Backshell 15 Straight 1 Entry Aluminum Electroless Nickel