ADLINK Technology 嵌入式解决方案

存储卡 6U 4HP cPCI-6636 with Intel Skylake Core i3-6100E processor, 4GB DDR4-2133 SODIMM memory, with GbE x2, COM x1, DVI-I x1, USB 3.0 x3, 2.5" SATA and CFAST; with J1, J2 only

存储器模块 DDR3-1333, 4GB, 512Mx64, SO-DIMM 204P, 1.5V, Rank:2, CL9, Non-ECC, OP Temp:0 85, Fix Die:No, Chip(256Mx8)

存储器模块 DDR4-3200, 16GB, 2Gx64, SO-DIMM 260P, 1.2V, Rank:2, CL22, Non-ECC, OP Temp:-40-85, Fix Die:No, Chip(1Gx8)

存储器模块 DDR4-3200, 4GB, 512x16, SO-DIMM 260P, 1.2V, Rank:1, CL22, non-ECC, OP Temp:0-85, Fix Die:No(C-die), Samsung Chip(512x16) height:30mm

存储器模块 DDR5-4800, 16GB, 2Gx72, SO-DIMM 262P, 1.1V, Rank:1, ECC, OP Temp:0 95, Samsung Chip(2Gx8) ,Fix Die:No

存储卡 i7-9700TE, C246, PCIex8*2+PCIex4*2+PCIex1 slots, 2xDP, DVI, VGA, 3xGbE, 4xCOM, 3xUSB2, 3xUSB3, USB2 dongle, 8DI/8DO, line-out/mic-in, mPCIe, M.2, 2xUSIM, TPM2.0, CFast, 4x2.5" SATA drive, AC-DC PSU, 2pcs DDR4 8GB

存储卡 DLAP-8002-AC/M16Gi5-9500TE, C246, PCIex8*2+PCIex4*2+PCIex1 slots, 2xDP, DVI, VGA, 3xGbE, 4xCOM, 3xUSB2, 3xUSB3, USB2 dongle, 8DI/8DO, line-out/mic-in, mPCIe, M.2, 2xUSIM, TPM2.0, CFast, 4x2.5" SATA drive, AC-DC PSU, 2pcs DDR4 8GB

存储卡 Xeon E-2278GE, C246, PCIex8*2+PCIex4*2+PCIex1 slots, 2xDP, DVI, VGA, 3xGbE, 4xCOM, 3xUSB2, 3xUSB3, USB2 dongle, 8DI/8DO, line-out/mic-in, mPCIe, M.2, 2xUSIM, TPM2.0, CFast, 4x2.5" SATA drive, AC-DC PSU,2pcs DDR4 16GB

存储卡 Xeon E-2278GE, C246, PCIex8*2+PCIex4*2+PCIex1 slots, 2xDP, DVI, VGA, 3xGbE, 4xCOM, 3xUSB2, 3xUSB3, USB2 dongle, 8DI/8DO, line-out/mic-in, mPCIe, M.2, 2xUSIM, TPM2.0, CFast, 4x2.5" SATA drive, 2pcs DDR4 8GB

模块配件 PICMG 1.3 9-slot backplanew/1x PCIex16?1x PCIex4?6x PCI 32-bit 33MHzRev:1.0

模块配件 EBP-D3E1PICMG1.3,PCI Express,1U Backplane

接口模块 ISAx7 PCIx4 PICMGx3 BACKPLANE AT/ATX PSU