congatec 嵌入式解决方案

模块化计算机 - COM JUMPtec HSP SMARC-sAMX6 full size

模块化计算机 - COM JUMPtec SMARC Mounting Kit

模块化计算机 - COM JUMPtec HSP COMe-bDV7 (E2) through

单板计算机 HSP-Qseven-Q7ALi2

模块化计算机 - COM JUMPtec COMe RefCarrier-i T10 TNIP

模块化计算机 - COM COM-HPC Mini module based on Intel Core i7-1365URE processor with 2 P-cores 1.7GHz up to 4.9GHz Turbo and 8 E-cores 1.2GHz up to 3.7GHz Turbo 12MB Intel Smart Cache Intel Iris Xe Graphics architecture with 96 EUs 32GB onboard LPDDR5x memor

模块化计算机 - COM COM Express Type 6 Compact module with Intel Celeron 3955U dual core processor with 2.0GHz, 2MB L2 cache, 2133MT/s dual channel DDR4 memory interface

开发板和工具包 - ARM 3.5 Carrier Board for SMARC 2.0 modules with ARMDimensions are 146mm x 102 mm (5.74" x 4.02")Operating Temperature: 0 C to 60 C (commercial)

模块化计算机 - COM COM Express Type 6 Compact module based on Intel Core i7-8665UE 4-core processor with 1.7GHz up to 4.4GHz turbo boost, 8MB L2 cache, Intel UHD Graphics 620 and dual channel DDR4 2400 MT/s memory interface (formerly Whiskey Lake).

模块化计算机 - COM COM Express Type 6 Compact module with Intel Core i7-7600U dual core processor with 2.8GHz up to 3.9GHz, 4MB Intel Smart Cache, GT2 graphics and 2133MT/s dual channel DDR4 memory interface (Intel Kaby Lake-U).

模块化计算机 - COM SMARC 2.0 module with advanced low-power 14nm NXP i.MX 8M Mini Quad processor. Features 4x ARM Cortex-A53 @1.8GHz and 1x ARM Cortex-M4, 2GB onboard LPDDR4 memory and 16GB onboard eMMC. Commercial temperature range.

模块化计算机 - COM COM Express Type 6 Basic module with Skylake-H Intel Core i3-6102E quad core processor with 1.9GHz, 3MB L2 cache, GT2 graphics and 2133MT/s dual channel DDR4 memory interface.