congatec 嵌入式解决方案

模块化计算机 - COM Qseven module with ultra low power Freescale ARM Cortex A9 dual core 1GHz processor with 512kB L2 cache, 1GB onboard DDR3L memory and 4GB onboard eMMC. MAP BGA plastic package.Commercial temperature range.

模块化计算机 - COM Qseven module with ultra low power Freescale ARM Cortex A9 quad core 1GHz processor with 1MB L2 cache, 2GB onboard DDR3L memory and 8GB onboard eMMC. Open silicon FCBGA package. Commercial temperature range.

模块化计算机 - COM Qseven module with ultra low power Freescale ARM Cortex A9 single core 800MHz processor with 512kB L2 cache, 1GB onboard DDR3L memory and 4GB onboard eMMC. MAP BGA plastic package. Industrial grade temperature range from -40 C to 85 C.

模块化计算机 - COM Qseven module with ultra low power Freescale ARM Cortex A9 quad core 800MHz processor with 1MB L2 cache, 1GB onboard DDR3L memory and 4GB onboard eMMC. Lidded FCBGA package. Industrial grade temperature range from -40 C to 85 C.

模块化计算机 - COM COM Express Type 6 Basic module based on AMD embedded R-Series R1505G 2-core processor with 2.4 GHz up to 3.3 GHz turbo boost, 1MB L2 Cache and dual channel DDR4 2400MT/s memory interface (formerly Great Horned Owl). Features AMD Radeon Vega integr

模块化计算机 - COM COM Express Type 6 Compact module with Intel Celeron 3965U dual core processor with 2.2GHz, 2MB Intel Smart Cache, GT1 graphics and 2133MT/s dual channel DDR4 memory interface (Intel Kaby Lake-U).

模块化计算机 - COM COM Express Type 6 Basic module with Skylake-H Intel Celeron G3902E dual core processor with 1.6GHz, 2MB L2 cache, GT1 graphics and 2133MT/s dual channel DDR4 memory interface, Chipset HM170

模块化计算机 - COM Standard heatpipe based passive cooling solution for high performance COM Express Type 6 module conga-TS170, conga-TS175 and conga-TS370 with 15mm high fins and 20mm overall heat sink height. All stand-offs are M2.5 threaded.

模块化计算机 - COM COM Express Type 6 Basic modul Intel Core i5-7440EQ quad core processor with 2.9GHz up to 3.6GHz, 6MB Intel Smart Cache, GT2 graphics and 2400MT/s dual channel DDR4 memory interface (Intel Kaby Lake-H). Chipset QM175 with support for Intel Optan

模块化计算机 - COM COM Express Type 6 Basic module with Intel Core i3-7100E dual core processor with 2.9GHz, 3MB Intel Smart Cache, GT2 graphics and 2400MT/s dual channel DDR4 memory interface (Intel Kaby Lake-H). Chipset HM175 with support for Intel Optane memor

模块化计算机 - COM COM Express Type 6 Basic module with Intel Xeon E3-1505M V6 quad core processor with 3GHz up to 4GHz, 8MB Intel Smart Cache, GT2 graphics and 2400MT/s dual channel DDR4 memory interface (Intel Kaby Lake-H). Chipset CM238 with ECC memory support.

模块化计算机 - COM COM Express Mini Type10 module with Intel Atom x7-E3950 quad core processor with 1.6GHz core frequency up to 2.0GHz 2MB L2 cache 8GB 1866MT/s DDR3L onboard memory and 32GB eMMC onboard flash.