64 GB 嵌入式解决方案

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ADLINK Technology mSATA mini 3ME4 64GB
ADLINK Technology 固态硬盘 - SSD mSATA mini 3ME4 64GBInput voltage : 3.3V +/- 5%Flash Type : Toshiba MLC 15nmInterface : SATA III 6.0GbpsSequential : Read 420MB/s , Write 100MB/sDimension : 26.8*29.85*3.4mmOperating Temperature :-40-85FW:L17606KConformal Coating
ADLINK Technology SSD-2.5 SATA SSD 3MG2-P 64GB
ADLINK Technology 固态硬盘 - SSD SSD, SATA 2.5", SATA 6Gbps, 64GB, 5V, MLC Toshiba, 520MB SR/90MB SW, TBW:170.5TB, MTBF>3MH, OP Temp:0-70
ADLINK Technology SSD-64G 2.5 SATA MLC
ADLINK Technology 固态硬盘 - SSD SSD, SATA 2.5", SATA 6Gbps, 64GB, 5V, MLC Toshiba, 380MB SR/80MB SW, TBW:19.2TB, MTBF>3MH, OP Temp:0-70
ADLINK Technology SSD-64G M.2 2280 SATA III 3D-TLC
ADLINK Technology 固态硬盘 - SSD SSD, M.2 2280 B+M-Key, SATA 6Gbps, 64GB, 3.3V, WD-BICS4 3D TLC, 400MB SR/200MB SW, TBW:110TB, MTBF:3MH, OP Temp:-20-75
Terasic Technologies B0844
Terasic Technologies 存储卡 64GB MicroSDXC card + SD adapter + USB card reader
ATP Electronics eMMC
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ATP Electronics eMMC
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ATP Electronics eMMC Conmercial Temp. -25C to +85C 9x10 TLC eMMC Small Footprint (STD PE)
ATP Electronics eMMC Industrial Temp. -40C to +85C 9x10 TLC eMMC Small Footprint (STD PE)
NexAIoT 单板计算机 Mini-iTX Tiger Lake-UP3 Intel 11th Generation Core i7/i5/i3

NexAIoT 单板计算机 PICMG 1.3 full-size SBC, Q670E, Intel LGA1700
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NexAIoT 单板计算机 PICMG 1.3 full-size SBC, R680E, Intel LGA1700
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NexAIoT 单板计算机 PICMG 1.3 full-size SBC, H610E, Intel LGA1700
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NexCOBOT 嵌入式箱式电脑 Micro-ATX Form Factor, 6th/7th Generation Intel Core LGA1151 Processor, Q170, LGA1151, DDR4 x4 up to 64GB, 2 x HDMI, 1 x DVI-I, 10 x USB3.0 , 4 x USB2.0 ,2 x GbE , 6 x SATAIII 5 x RS232, 1 x RS232/422/485, 1x PCIex16, 1 x PCIe x4, 1 PCI
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NexAIoT 单板计算机 ATX Industrial Motherboard with the 8/9th Generation Intel Core i7/i5/i3
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SECO 模块化计算机 - COM COMe-C08-BT6 w/Intel i7-9850HE Hexa core a.2.6GHz (4.6GHZ in Turbo Boost), 12MB Chace, 45W TDP + ChipsetQM370 (AMT), EDP 2line;VGA; DP++ (DDI1); DP++ (DDI2); HDMI (DDI3) - Comm. Temp
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SECO 模块化计算机 - COM COMe-C08-BT6 w/Intel Core i7-9850HL , Hexa Core a.1.9GHz, 9MB Cache, 25W TDP + Chipset QM370 + EDP 4l; VGA; DP++ (DDI1); DP++ (DDI2); DP++ (DDI3) - Comm.Temp
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SECO 模块化计算机 - COM COMe-C55 w/Intel Whiskey Lake U i7-8665UE Quad Core a. 1.8GHz, 8MB Cache, 15W TDP, 8 PCIE + 0 PEG + 2 SATA, EDP, DP su DDI2, TPMSLB 9670, 3wire FAN, Comm.Temp.
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SECO 模块化计算机 - COM COMe-C55-CT6 w/ Intel i7-8665UE, QC a. 1.7GHz (Turbo Boost 4.4GHz) with HT, 15W TDP (12.5W..25W cTDP), eMMC 32GB, 6 PCIe x1 + 2
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SECO 模块化计算机 - COM COM Express Type 6 - COMe-C55 w/ Intel Whiskey Lake U Celeron 4305UE Dual Core, 5 PCIE + 4 PEG + 2 SATA, LVDS, 4wire Fan, CommTemp
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Alliance Memory eMMC eMMC 64GB, 3V, (TLC Gen5 NAND),Industrial Temp,153ball FBGA (11.5x13mm)-Reel
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ATP Electronics A4B64QB4BVWESO
ATP Electronics 存储器模块
ATP Electronics AF64GUFN2NC-GBAXX
ATP Electronics USB闪存盘 Commercial Temp USB3.1 NanoDura Dual
NexCOBOT 6879G0008130F
NexCOBOT 嵌入式箱式电脑 Micro-ATX Form Factor, 8th/9th Generation Intel Core LGA1151 Processor Supports Power 95W max. DDR4 2666/2400/2133 MHz, max. 64GB . 2 x HDMI, 1 x DP, 1 x VGA, 2 x GbE LAN , 6 x USB 3.2 (Gen 2) , 4 x USB 3.2 (Gen 1), 1x M.2 E-key (PCIe/USB), 1 x M.2 M
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NexCOBOT 6879G0009130F
NexCOBOT 嵌入式箱式电脑 ATX, 8/9th (Coffee Lake-S, Coffee Lake-S Refresh) Intel Core i9/i7/i5/i3/Pentium Processor, Max. 95W, Q370, LGA1151, DDR4 x 4 up to 64GB, VGA, HDMI, DP , 4 x USB 3.1(Gen2), 2 x USB 3.1(Gen1) ,2 x USB2.0, 3 x GbE LAN , 4 x SATAIII, 5 x RS232, 1 x RS23
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