嵌入式解决方案

结果: 283
选择 图像 零件编号 制造商 描述 数据表 供货情况 单价(含13%增值税) 根据您的数量,按照单价筛选表格中的结果。 数量 RoHS
ADLINK Technology 嵌入式箱式电脑 Material:AL6063/CU1100 painting black color include thermal pad & standoff
ADLINK Technology CANbus mPCIe module
ADLINK Technology 接口模块 USB to dual isolated CANbus 2.0B ModulePower Consumption: MAX 3.33WDimension: 30 x 50.9 x 8.35 mmOperating Temperature: -40-85
ADLINK Technology CANBUS M.2 B M MODULE
ADLINK Technology 接口模块 M.2(B+M) to Single Channel CANbus ModulePower Consumption: MAX 1.485WDimension: 30 x 51 x 4 mmOperating Temperature: -40-85
Analog Devices / Maxim Integrated MAX5478EVCMODU
Analog Devices / Maxim Integrated 数字电位计开发工具 Eval Kit/System MAX5477, MAX5478, and MA
Hirschmann MTM8000-ModuleCover
Hirschmann 模块配件 Media module slot cover

Fluke WI-FI/BLE MODULE
Fluke 模块配件 WI-FI/BLE MODULE FOR FLUKE-177X ANALYZERS
ADLINK Technology 模块配件 AVA-RAGX SIMCOM 8202G module kit
Olimex Ltd. MOD-USB3G
Olimex Ltd. 调制解调器
Analog Devices / Maxim Integrated 数字电位计开发工具 Evaluation Kit/Evaluation System for the
HUBER+SUHNER GNSS/GPS模块 Expansion module, RF splitter, L1, 2RU, 1 RF IN, 32 RF OUT
Axiomtek AX92160 Accelerometer module
Axiomtek 接口模块 Full-Size and Half-Size PCI Express Mini Module with Multifunction Sensory Capabilities / Accelerometer /Gyroscopeoperating temperature: -40C to +85C
ADLINK Technology USB Flash Module 4GB
ADLINK Technology USB闪存盘 USB Flash Module, USB2.0, 4GB, 5V, 37.9x26.65x9mm, OP Temp:0-70, UFM connector
Hirschmann GRS1040, COVER PLATE MODULE SLOT
Hirschmann 模块配件 Cover plate to cover empty media slots on Greyhound 1040 switches
ADLINK Technology DLAP-3000 Audio Module (AMP w/Line-in)
ADLINK Technology 音频模块 DLAP-3000 Audio Module (AMP w/Line-in)
Axiomtek ACC129-A2000-WT A2000 MXM MODULE KIT
Axiomtek 模块配件 ACC129-A2000-WT (W.T. NVIDIA RTX A2000 MXM module)(M3A2000-VYW-A1)
Arbor Technology 模块化系统 - SOM

ADLINK Technology PXES-AirInletModule
ADLINK Technology 模块配件 PXES-AirInletModuleAir inlet module for back/top air pull chassis (PXES-2780/PXES-2785/PXES-2590), 1 slot
Onion 模块化系统 - SOM Omega2+ Module

ADLINK Technology DLAP-3000 Audio Module
ADLINK Technology 音频模块 DLAP-3000 Audio Module
ADLINK Technology DLAP-3000 Audio Module (AMP w/MIC)
ADLINK Technology 音频模块 Speaker-R, Speaker-L, Mic-in
Analog Devices / Maxim Integrated 68HC16MODULE-DIP
Analog Devices / Maxim Integrated 界面开发工具 68HC16MODULE-DIP EVAL KIT
ADLINK Technology M.2 B-KEY LTE HSPA MODULE
ADLINK Technology 蜂窝模块 AirPrime EM7565LTE Cat.12CBRS Disable, USB3.0/2.0Max DL/UL, 600/150 MbpsDimension : 42*30*2.3mmFW: Generic SWI9X50C_01.14.02.00 [002.035_000]Disable B30/48
ADLINK Technology DLAP-3100 LAN GF module
ADLINK Technology 以太网模块 DLAP-3100 LAN GF module
Texas Instruments 视频 IC 开发工具 LMH1239 evaluation m odule

Texas Instruments 电源管理IC开发工具 LM74681 evaluation m odule