|
|
输入设备 Magnetic Stripe Reader for AFL2-W21A with bracket,USB interface, R10, RoHS
IEI AFL2P-W21AMSR-U-R10
- AFL2P-W21AMSR-U-R10
- IEI
-
1:
¥1,022.3675
-
无库存
|
Mouser 零件编号
458-AFL2PW21AMSRUR10
|
IEI
|
输入设备 Magnetic Stripe Reader for AFL2-W21A with bracket,USB interface, R10, RoHS
|
|
无库存
|
|
|
¥1,022.3675
|
|
|
¥962.2402
|
|
|
¥932.2952
|
|
|
¥872.0775
|
|
|
¥823.9395
|
|
最低： 1
倍数： 1
|
|
Input Devices
|
|
|
|
|
|
Raspberry Pi配件 Mira220 Raspberry Pi EVK
- Mira220 Raspberry Pi EVK
- ams OSRAM
-
1:
¥7,027.2214
-
无库存交货期 12 周
|
Mouser 零件编号
985-20RASPBERRYPIEVK
|
ams OSRAM
|
Raspberry Pi配件 Mira220 Raspberry Pi EVK
|
|
无库存交货期 12 周
|
|
|
¥7,027.2214
|
|
|
¥6,736.721
|
|
最低： 1
倍数： 1
|
|
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|
|
|
|
|
单板计算机 Intel 8th/9th Gen Core i7/i5/i3 LGA 1151 Desktop Processor with Q370 Chipset, for MXM P1000/2000/T1000/RTX3000 support, with M.2 E/B/M key, with PCIex4 edge connector, WO/AMP for speaker-out, WO/TPM, WO/LVDS
ADLINK Technology AMSTX-CFP12-Q370
- AMSTX-CFP12-Q370
- ADLINK Technology
-
受限供货情况
-
Mouser 的新产品
|
Mouser 零件编号
976-AMSTX-CFP12-Q370
Mouser 的新产品
|
ADLINK Technology
|
单板计算机 Intel 8th/9th Gen Core i7/i5/i3 LGA 1151 Desktop Processor with Q370 Chipset, for MXM P1000/2000/T1000/RTX3000 support, with M.2 E/B/M key, with PCIex4 edge connector, WO/AMP for speaker-out, WO/TPM, WO/LVDS
|
|
|
|
|
|
Single Board Computers
|
Core i3-8100/9100E/9100TE, Core i5-8500/8500T/9500E/9500TE, Core i7-8700/8700T/9700E/9700TE
|
Intel
|
|
|
|
单板计算机 Intel 8th/9th Gen Core i7/i5/i3 LGA 1151 Desktop Processor with H310 Chipset, for MXM P1000/2000/T1000/RTX3000 support, with M.2 E/B key, with PCIex1 edge connector, WO/AMP for speaker-out, WO/TPM, WO/LVDS
ADLINK Technology AMSTX-CFP12-H310
- AMSTX-CFP12-H310
- ADLINK Technology
-
受限供货情况
-
Mouser 的新产品
|
Mouser 零件编号
976-AMSTX-CFP12-H310
Mouser 的新产品
|
ADLINK Technology
|
单板计算机 Intel 8th/9th Gen Core i7/i5/i3 LGA 1151 Desktop Processor with H310 Chipset, for MXM P1000/2000/T1000/RTX3000 support, with M.2 E/B key, with PCIex1 edge connector, WO/AMP for speaker-out, WO/TPM, WO/LVDS
|
|
|
|
|
|
Single Board Computers
|
Core i3-8100/9100E/9100TE, Core i5-8500/8500T/9500E/9500TE, Core i7-8700/8700T/9700E/9700TE
|
Intel
|
|
|
|
单板计算机 Intel 8th/9th Gen Core i7/i5/i3 LGA 1151 Desktop Processor with Q370 Chipset, for MXM P1000/2000/T1000/RTX3000 support, with M.2 E/B/M key, with PCIex4 edge connector, W/AMP for speaker-out, W/TPM, W/LVDS
ADLINK Technology AMSTX-CFP12-Q370, AMP/TPM/LVDS
- AMSTX-CFP12-Q370, AMP/TPM/LVDS
- ADLINK Technology
-
受限供货情况
-
新产品
|
Mouser 零件编号
976-AMSTXCFP12Q370AM
新产品
|
ADLINK Technology
|
单板计算机 Intel 8th/9th Gen Core i7/i5/i3 LGA 1151 Desktop Processor with Q370 Chipset, for MXM P1000/2000/T1000/RTX3000 support, with M.2 E/B/M key, with PCIex4 edge connector, W/AMP for speaker-out, W/TPM, W/LVDS
|
|
|
|
|
|
Single Board Computers
|
Core i3-8100/9100E/9100TE, Core i5-8500/8500T/9500E/9500TE, Core i7-8700/8700T/9700E/9700TE
|
Intel
|
|
|
|
工业主板 Intel 8th/9th Gen Core i7/i5/i3 LGA 1151 Desktop Processor with H310 Chipset, for MXM P1000/2000/T1000/RTX3000 support, with M.2 E/B key, with PCIex1 edge connector, W/AMP for speaker-out, W/TPM, W/LVDS
ADLINK Technology AMSTX-CFP12-H310 AMP TPM LVDS
- AMSTX-CFP12-H310 AMP TPM LVDS
- ADLINK Technology
-
受限供货情况
-
新产品
|
Mouser 零件编号
976-CFP12-H310LVDS
新产品
|
ADLINK Technology
|
工业主板 Intel 8th/9th Gen Core i7/i5/i3 LGA 1151 Desktop Processor with H310 Chipset, for MXM P1000/2000/T1000/RTX3000 support, with M.2 E/B key, with PCIex1 edge connector, W/AMP for speaker-out, W/TPM, W/LVDS
|
|
|
|
|
|
Industrial Motherboards
|
Core i3/i5/i7
|
Intel
|
|
|
|
单板计算机外壳 Size:282x249x138mm;Outer facing: A case, 230g/m2;Medium Paper: 100g/m2;Pressure: 14kgf/cm2
ADLINK Technology AmSTX-CF Cooler Pizza BOX
- AmSTX-CF Cooler Pizza BOX
- ADLINK Technology
-
受限供货情况
-
新产品
|
Mouser 零件编号
976-AMSTXCFCOOLERPIZ
新产品
|
ADLINK Technology
|
单板计算机外壳 Size:282x249x138mm;Outer facing: A case, 230g/m2;Medium Paper: 100g/m2;Pressure: 14kgf/cm2
|
|
|
|
|
|
|
|
|
|
|
|
单板计算机外壳 Size: 256x243x81mm; Material: EPE with ANTI-STATIC; Density: 22.5KG/M3+/-10%; Color: Pink.ESD Dissipative Packaging (Outside) =1.0x104 to <1.0x1011ohms
ADLINK Technology AmSTX-CF Large EPE Bottom
- AmSTX-CF Large EPE Bottom
- ADLINK Technology
-
受限供货情况
-
新产品
|
Mouser 零件编号
976-AMSTXCFLARGEEPEB
新产品
|
ADLINK Technology
|
单板计算机外壳 Size: 256x243x81mm; Material: EPE with ANTI-STATIC; Density: 22.5KG/M3+/-10%; Color: Pink.ESD Dissipative Packaging (Outside) =1.0x104 to <1.0x1011ohms
|
|
|
|
|
|
|
|
|
|
|
|
单板计算机外壳 1.32-50015-0100-A02.Retention, Material=SPCC t=2.0mm,Extrude M3.0xP0.503.Mylar with adhesive4.Backplate_75x75mm5.nut step=6.0mm
ADLINK Technology AMSTX-CF CPU Backing Plate
- AMSTX-CF CPU Backing Plate
- ADLINK Technology
-
受限供货情况
-
新产品
|
Mouser 零件编号
976-AMSTXCFCPUBACKIN
新产品
|
ADLINK Technology
|
单板计算机外壳 1.32-50015-0100-A02.Retention, Material=SPCC t=2.0mm,Extrude M3.0xP0.503.Mylar with adhesive4.Backplate_75x75mm5.nut step=6.0mm
|
|
|
|
|
|
|
|
|
|
|
|
单板计算机外壳 Size: 256x243x50mm; Material: EPE with ANTI-STATIC; Density: 22.5KG/M3+/-10%; Color: PinkESD Dissipative Packaging (Outside) =1.0x104 to <1.0x1011ohms
ADLINK Technology AmSTX-CF Large EPE Top
- AmSTX-CF Large EPE Top
- ADLINK Technology
-
受限供货情况
-
新产品
|
Mouser 零件编号
976-AMSTXCFLARGEEPET
新产品
|
ADLINK Technology
|
单板计算机外壳 Size: 256x243x50mm; Material: EPE with ANTI-STATIC; Density: 22.5KG/M3+/-10%; Color: PinkESD Dissipative Packaging (Outside) =1.0x104 to <1.0x1011ohms
|
|
|
|
|
|
|
|
|
|
|
|
嵌入式箱式电脑 Intel Amston Lake Fanless Embedded Computer with LPDDR5 16GB on board, up to 4Kp60 solutions via HDMI x1, Dual-LAN, Multiple COM, USB3.2, M.2 E key, M.2 B key, 9-36V DC
- EBS-P310W-X7835-16-1G
- Asus
-
受限供货情况
-
新产品
|
Mouser 零件编号
47-EBSP310WX7835161G
新产品
|
Asus
|
嵌入式箱式电脑 Intel Amston Lake Fanless Embedded Computer with LPDDR5 16GB on board, up to 4Kp60 solutions via HDMI x1, Dual-LAN, Multiple COM, USB3.2, M.2 E key, M.2 B key, 9-36V DC
|
|
|
|
|
|
Embedded Box Computers
|
Atom, x7211RE
|
Intel
|
|
|
|
工业箱式电脑 Ruggedized Fanless Embedded System with Intel Amston Lake x74835RE Processor, pre-installed 1x 8GB DDR5, 2.5GbE, RS232/422/485, CAN BUS, GPIO, 10-28V DC, M12 waterproof, Stainless Steel Chassis, Full body IP67, R10
- SWBOX-ASL-R4C-R10
- IEI
-
受限供货情况
-
新产品
|
Mouser 零件编号
458-SWBOXASLR4CR10
新产品
|
IEI
|
工业箱式电脑 Ruggedized Fanless Embedded System with Intel Amston Lake x74835RE Processor, pre-installed 1x 8GB DDR5, 2.5GbE, RS232/422/485, CAN BUS, GPIO, 10-28V DC, M12 waterproof, Stainless Steel Chassis, Full body IP67, R10
|
|
|
|
|
|
Industrial PCs
|
|
|
|
|
|
模块化计算机 - COM SMARC 2.1 COM with Intel Amston Lake x7835RE 8-Core CPU, 8GB LPDDR5, 64GB eMMC, -40 C to 85 C
ADLINK Technology LEC-ASL-x7835RE-8G-64G-ER
- LEC-ASL-x7835RE-8G-64G-ER
- ADLINK Technology
-
受限供货情况
-
新产品
|
Mouser 零件编号
976-LECASL7835RE8GER
新产品
|
ADLINK Technology
|
模块化计算机 - COM SMARC 2.1 COM with Intel Amston Lake x7835RE 8-Core CPU, 8GB LPDDR5, 64GB eMMC, -40 C to 85 C
|
|
|
|
|
|
Computer-On-Modules - COM
|
Atom x7835RE
|
Intel
|
|
|
|
模块化计算机 - COM SMARC 2.1 COM with Intel Amston Lake x7211RE 2-Core CPU, 4GB LPDDR5, 32GB eMMC, -40 C to 85 C
ADLINK Technology LEC-ASL-x7211RE-4G-32G-ER
- LEC-ASL-x7211RE-4G-32G-ER
- ADLINK Technology
-
受限供货情况
-
新产品
|
Mouser 零件编号
976-LECASL7211RE4GER
新产品
|
ADLINK Technology
|
模块化计算机 - COM SMARC 2.1 COM with Intel Amston Lake x7211RE 2-Core CPU, 4GB LPDDR5, 32GB eMMC, -40 C to 85 C
|
|
|
|
|
|
Computer-On-Modules - COM
|
Atom x7211RE
|
Intel
|
|
|
|
模块化计算机 - COM SMARC 2.1 COM with Intel Amston Lake x7433RE 4-Core CPU, 8GB LPDDR5, 64GB eMMC, -40 C to 85 C
ADLINK Technology LEC-ASL-x7433RE-8G-64G-ER
- LEC-ASL-x7433RE-8G-64G-ER
- ADLINK Technology
-
受限供货情况
-
新产品
|
Mouser 零件编号
976-LECASL7433RE8GER
新产品
|
ADLINK Technology
|
模块化计算机 - COM SMARC 2.1 COM with Intel Amston Lake x7433RE 4-Core CPU, 8GB LPDDR5, 64GB eMMC, -40 C to 85 C
|
|
|
|
|
|
Computer-On-Modules - COM
|
Atom x7433RE
|
Intel
|
|
|
|
工业箱式电脑 Ruggedized Fanless Embedded System with Intel Amston Lake x7433RE Processor, pre-installed 1x 8GB DDR5, 2.5GbE, RS232/422/485, CAN BUS, GPIO, 10-28V DC, M12 waterproof, Stainless Steel Chassis, Full body IP67, R10
IEI SWBOX-ASL-R3C-R10
- SWBOX-ASL-R3C-R10
- IEI
-
受限供货情况
-
新产品
|
Mouser 零件编号
458-SWBOXASLR3CR10
新产品
|
IEI
|
工业箱式电脑 Ruggedized Fanless Embedded System with Intel Amston Lake x7433RE Processor, pre-installed 1x 8GB DDR5, 2.5GbE, RS232/422/485, CAN BUS, GPIO, 10-28V DC, M12 waterproof, Stainless Steel Chassis, Full body IP67, R10
|
|
|
|
|
|
Industrial PCs
|
|
|
|
|
|
模块化计算机 - COM Qseven R2.1 Intel Amston Lake ATOM x7433RE CPU Module w/8G memory down, -40-85C
- EmQ-iX702-WT-x7433RE-8G
- Arbor Technology
-
受限供货情况
-
新产品
|
Mouser 零件编号
813-IX702WTX7433RE8G
新产品
|
Arbor Technology
|
模块化计算机 - COM Qseven R2.1 Intel Amston Lake ATOM x7433RE CPU Module w/8G memory down, -40-85C
|
|
|
|
|
|
Computer-On-Modules - COM
|
|
|
|
|
|
模块化计算机 - COM Mini COM Express Type 10 Intel Amston Lake ATOM x7433RE CPU Module w/8G memory down,-40-85C
- EmNANO-iX701-WT-x7433RE-8G
- Arbor Technology
-
受限供货情况
-
新产品
|
Mouser 零件编号
813-IX701WTX7433RE8G
新产品
|
Arbor Technology
|
模块化计算机 - COM Mini COM Express Type 10 Intel Amston Lake ATOM x7433RE CPU Module w/8G memory down,-40-85C
|
|
|
|
|
|
Computer-On-Modules - COM
|
|
|
|
|
|
模块化计算机 - COM Qseven R2.1 Intel Amston Lake ATOM x7211RE CPU Module w/4G memory down, -40-85C
- EmQ-iX702-WT-x7211RE-4G
- Arbor Technology
-
受限供货情况
-
新产品
|
Mouser 零件编号
813-IX702WTX7211RE4G
新产品
|
Arbor Technology
|
模块化计算机 - COM Qseven R2.1 Intel Amston Lake ATOM x7211RE CPU Module w/4G memory down, -40-85C
|
|
|
|
|
|
Computer-On-Modules - COM
|
|
|
|
|
|
模块化计算机 - COM Mini COM Express Type 10 Intel Amston Lake ATOM x7211RE CPU Module w/4G memory down,-40-85C
- EmNANO-iX701-WT-x7211RE-4G
- Arbor Technology
-
受限供货情况
-
新产品
|
Mouser 零件编号
813-IX701WTX7211RE4G
新产品
|
Arbor Technology
|
模块化计算机 - COM Mini COM Express Type 10 Intel Amston Lake ATOM x7211RE CPU Module w/4G memory down,-40-85C
|
|
|
|
|
|
Computer-On-Modules - COM
|
|
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|
