模块化计算机 - COM

 模块化计算机 - COM
模块化计算机(COM),应有尽有。Mouser Electronics(贸泽电子)是众多模块化计算机原厂的授权分销商,提供多家业界顶尖制造商的模块化计算机,包括ADLink、Critical Link、Digi International、Maxim、NXP等多家知名厂商。想了解更多模块化计算机产品,请浏览下列产品分类。
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选择 图像 零件编号 制造商 描述 数据表 供货情况 单价(含13%增值税) 根据您的数量,按照单价筛选表格中的结果。 数量 RoHS ECAD模型 外观尺寸 处理器品牌 处理器类型 芯片组 频率 RAM最大容量 已安装RAM 高速缓冲存储器 工作电源电压 接口类型 最小工作温度 最大工作温度 尺寸
IBASE 模块化计算机 - COM COM Express (Type 10), Intel Atom x7-E3950 (F-1 stepping) QC SoC (1.6GHz/2.0GHz) + LPDDR4 4GB onboard, support LVDS & DDI x 1, Optional heat spreader (RoHS2)

IBASE 模块化计算机 - COM COM Express (Type 6), Intel Atom x6211E DC SoC (1.2GHz/3.0GHz) + DDR4 8GB memory onboard , DDR4 SO-DIMM x1, I226IT x 1, support eDP & DDI x 2, Optional heatsink or heat spreader (RoHS2)

IBASE 模块化计算机 - COM COM Express (Type 6), Intel Atom x6211E DC SoC (1.2GHz/3.0GHz) + DDR4 8GB memory onboard , DDR4 SO-DIMM x1, I226IT x 1, support LVDS & DDI x 2, Optional heatsink or heat spreader (RoHS2)

IBASE 模块化计算机 - COM COM Express (Type 6), Intel Atom x6425E QC SoC (1.8GHz/3.0GHz) + DDR4 8GB memory onboard , DDR4 SO-DIMM x1, I226IT x 1, support eDP & DDI x 2, Optional heatsink or heat spreader (RoHS2)

IBASE 模块化计算机 - COM COM Express (Type 6), Intel Atom x6425E QC SoC (1.8GHz/3.0GHz) + DDR4 8GB memory onboard , DDR4 SO-DIMM x1, I226IT x 1, support LVDS & DDI x 2, Optional heatsink or heat spreader (RoHS2)

IBASE 模块化计算机 - COM COM Express (Type 6), Intel Core i7-6600U (2.8GHz/3.9GHz onboard, DDR4 SO-DIMM x 2, 1x DDI+ 1x VGA, I219LM x1, TPM(2.0), optional heatsink + cooler or heat spreader (RoHS2)

IBASE 模块化计算机 - COM COM Express (Type 6), AMD Ryzen V1605B onboard, I211AT x1, supports 2x DDI and eDP, TPM(2.0), DDR4 8GB Memory on board; optional heatsink + cooler or heat spreader (RoHS2)

IBASE 模块化计算机 - COM COM Express (Type 6), AMD Ryzen V1605B onboard ,DDR4 SO-DIMMx 2, I211AT x1, supports 3x DDI and LVDS, TPM(2.0), optional heatsink + cooler or heat spreader (RoHS)

IBASE 模块化计算机 - COM COM Express (Type 6), Intel Core i3-1220PE(Up to 4.2GHz, 4P+4E Cores) & I226LM onboard, DDR4 SO-DIMM x 2, support eDP + VGA & 3xDDI, TPM(2.0), optional heatsink + cooler or heat spreader (RoHS2)

IBASE 模块化计算机 - COM COM Express (Type 6),Intel Core i5-1245UE(Up to 4.4GHz , 2P+8E Cores) & I226LM onboard, DDR4 SO-DIMM x 2, support eDP + VGA & 3xDDI, TPM(2.0), optional heatsink + cooler or heat spreader (RoHS2)

IBASE 模块化计算机 - COM COM Express (Type 6), Intel Core i3-1220PE(Up to 4.2GHz, 4P+4E Cores) & I226LM onboard, DDR4 SO-DIMM x 2, support LVDS + VGA & 3xDDI, TPM(2.0), optional heatsink + cooler or heat spreader (RoHS2)

IBASE 模块化计算机 - COM COM Express (Type 6), Intel Core i5-1250PE(Up to 4.4GHz, 4P+8E Cores) & I226LM onboard, DDR4 SO-DIMM x 2, support LVDS + VGA & 3xDDI, TPM(2.0), optional heatsink + cooler or heat spreader (RoHS2)

IBASE 模块化计算机 - COM COM Express (Type 6), Intel Core i5-1245UE(Up to 4.4GHz , 2P+8E Cores) & I226LM onboard, DDR4 SO-DIMM x 2, support LVDS + VGA & 3xDDI, TPM(2.0), optional heatsink + cooler or heat spreader (RoHS2)

IBASE 模块化计算机 - COM COM Express (Type 6), Intel Core i7-1270PE(Up to 4.5GHz, 4P+8E Cores) & I226LM onboard, DDR4 SO-DIMM x 2, support LVDS + VGA & 3xDDI, TPM(2.0), optional heatsink + cooler or heat spreader (RoHS2)

IBASE 模块化计算机 - COM COM Express (Type 6), Intel Core i7-1265UE(Up to 4.7GHz , 2P+8E Cores) & I226LM onboard, DDR4 SO-DIMM x 2, support LVDS + VGA & 3xDDI, TPM(2.0), optional heatsink + cooler or heat spreader (RoHS2)

IBASE 模块化计算机 - COM COM Express (Type 6),Intel Core i5-1335UE(Up to 4.6GHz , 2P+8E Cores) & I226LM onboard, DDR4 SO-DIMM x 2, support eDP + VGA & 3xDDI, TPM(2.0), optional heatsink + cooler or heat spreader (RoHS2)

IBASE 模块化计算机 - COM COM Express (Type 6), Intel Core i3-1320PE(Up to 4.5GHz, 4P+4E Cores) & I226LM onboard, DDR4 SO-DIMM x 2, support LVDS + VGA & 3xDDI, TPM(2.0), optional heatsink + cooler or heat spreader (RoHS2)

IBASE 模块化计算机 - COM COM Express (Type 6), Intel Core i5-1340PE(Up to 4.6GHz, 4P+8E Cores) & I226LM onboard, DDR4 SO-DIMM x 2, support LVDS + VGA & 3xDDI, TPM(2.0), optional heatsink + cooler or heat spreader (RoHS2)

IBASE 模块化计算机 - COM COM Express (Type 6), Intel Core i5-1335UE(Up to 4.4GHz , 2P+8E Cores) & I226LM onboard, DDR4 SO-DIMM x 2, support LVDS + VGA & 3xDDI, TPM(2.0), optional heatsink + cooler or heat spreader (RoHS2)

IBASE 模块化计算机 - COM COM Express (Type 6), Intel Core i7-1370PE(Up to 4.8GHz, 6P+8E Cores) & I226LM onboard, DDR4 SO-DIMM x 2, support LVDS + VGA & 3xDDI, TPM(2.0), optional heatsink + cooler or heat spreader (RoHS2)

IBASE 模块化计算机 - COM NXP Cortex -A53 i.MX 8M Quad Industrial grade 1.3GHz, 3GB LPDDR4, 16GB TLC eMMC onboard Support: 1x 18/24bit DSI, 1x HDMI2.0a, 2x CSI, 1x 4bit SDIO, 1x SPI/eSPI, 1x I2S, 4x I2C, 4x Serial Port, 2x USB3, 2x USB2, 2x PCIe(x1) Gen1, 1x GbE, GPIOs
IBASE 模块化计算机 - COM NXP i.MX8M Plus Quad Cortex-A53 processor,3GB LPDDR4, 16GB eMMC on board,1 x HDMI, LVDS and MIPI-DSI 4-lane,2x I2S,2x GbE LAN,2x USB 3.0,2x MIPI-CSI,4x UART, 2x SPI,1x PCI-E interface,12x GPIO,4x I C,2x CAN FD
JUMPtec 模块化计算机 - COM COMe-mRP10 i3-1315UE 16GB

COM Express Mini Pin-out Type 10 Intel Core i3-1315UE Integrated SoC 1.2 GHz 10 MB 4.75 V to 20 V I2C, SPI 0 C + 60 C 84 mm x 55 mm
JUMPtec 模块化计算机 - COM COMe-mRP10 i5-1345UE 16GB

COM Express Mini Pin-out Type 10 Intel Core i5-1345UE Integrated SoC 1.4 GHz 12 MB 4.75 V to 20 V I2C, SPI 0 C + 60 C 84 mm x 55 mm
JUMPtec 模块化计算机 - COM COMe-mRP10 i7-1365UE 16GB

COM Express Mini Pin-out Type 10 Intel Core i7-1365URE Integrated SoC 1.7 GHz 12 MB 4.75 V to 20 V I2C, SPI 0 C + 60 C 84 mm x 55 mm