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STANDOFFS 模块化计算机 - COM

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结果: 2

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库存量

正常库存

在售

新产品

符合RoHS

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选择	图像	零件编号	制造商	描述	数据表	供货情况	单价（含13%增值税）根据您的数量，按照单价筛选表格中的结果。	数量	RoHS	ECAD模型
	模块化计算机 - COM Standard heatpipe based passive cooling solution for high performance COM Express Type 6 module conga-TS170, conga-TS175 and conga-TS370 with 15mm high fins and 20mm overall heat sink height. Stand-offs are with 2.7mm bore hole. conga-TS170/CSP-HP-B congatec 受限供货情况	制造商零件编号 conga-TS170/CSP-HP-B Mouser 零件编号 787-045932	congatec	模块化计算机 - COM Standard heatpipe based passive cooling solution for high performance COM Express Type 6 module conga-TS170, conga-TS175 and conga-TS370 with 15mm high fins and 20mm overall heat sink height. Stand-offs are with 2.7mm bore hole.	数据表			受限供货情况
	模块化计算机 - COM Standard heatpipe based passive cooling solution for high performance COM Express Type 6 module conga-TS170, conga-TS175 and conga-TS370 with 15mm high fins and 20mm overall heat sink height. All stand-offs are M2.5 threaded. conga-TS170/CSP-HP-T congatec 受限供货情况	制造商零件编号 conga-TS170/CSP-HP-T Mouser 零件编号 787-045933	congatec	模块化计算机 - COM Standard heatpipe based passive cooling solution for high performance COM Express Type 6 module conga-TS170, conga-TS175 and conga-TS370 with 15mm high fins and 20mm overall heat sink height. All stand-offs are M2.5 threaded.	数据表			受限供货情况

STANDOFFS 模块化计算机 - COM

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