I2C, SPI, UART 模块化系统 - SOM

结果: 32
选择 图像 零件编号 制造商 描述 数据表 供货情况 单价(含13%增值税) 根据您的数量,按照单价筛选表格中的结果。 数量 RoHS ECAD模型 系列 外观尺寸 处理器品牌 处理器类型 频率 工作电源电压 接口类型 最小工作温度 最大工作温度 尺寸 封装
Digi 模块化系统 - SOM ConnectCore MP15, STM32MP157C, Dual A7, M4, GPU, 512MB SLC NAND, 512MB DDR3, 1xGbE, 802.11a/b/g/n/ac 1x1, Bluetooth 5.2 170库存量
最低: 1
倍数: 1
ConnectCore MP1 STMicroelectronics STM32MP133C 650 MHz I2C, SPI, UART - 40 C + 85 C 29 mm x 29 mm x 3 mm Tray
Digi 模块化系统 - SOM ConnectCore MP255 STM32MP255C, Dual A35 1.2GHz, M33, GPU, ISP, NPU, 8GB eMMC, 1GB DDR4, -40/+85C, Wi-Fi 6 1x1 802.11a/b/g/n/ac/ax, Bluetooth 5.4 4库存量
68在途量
最低: 1
倍数: 1

ConnectCore MP2 30 mm x 30 mm 1.5 GHz I2C, SPI, UART - 40 C + 85 C 30 mm x 30 mm x 3 mm
ReFLEX CES 模块化系统 - SOM Module "Indus 12G" v5 version, new 10库存量
最低: 1
倍数: 1

Arria 10 SoC I2C, SPI, UART 95 mm x 83.1 mm
Digi 模块化系统 - SOM ConnectCore MP15, STM32MP157C, Dual A7, M4, GPU, 512MB SLC NAND, 512MB DDR3, 1xGbE 262库存量
最低: 1
倍数: 1
ConnectCore MP1 STMicroelectronics STM32MP133C 650 MHz I2C, SPI, UART - 40 C + 85 C 29 mm x 29 mm x 3 mm Tray
ReFLEX CES 模块化系统 - SOM Module "Lite 12G" v5 version, new 11库存量
最低: 1
倍数: 1

Arria 10 SoC I2C, SPI, UART 95 mm x 83.1 mm
ReFLEX CES 模块化系统 - SOM Module "Indus" v5 version, new
19预期 2026/7/21
最低: 1
倍数: 1

Arria 10 SoC I2C, SPI, UART 95 mm x 83.1 mm
Digi 模块化系统 - SOM ConnectCore MP255 STM32MP255C, Dual A35 1.2GHz, M33, GPU, ISP, NPU, 8GB eMMC, 1GB DDR4, -40/+85C
41在途量
最低: 1
倍数: 1

ConnectCore MP2 30 mm x 30 mm 1.5 GHz I2C, SPI, UART - 40 C + 85 C 30 mm x 30 mm x 3 mm
iWave Global 模块化系统 - SOM i.MX 9131 (A0 CPU) OSM SOM with 2GB LPDDR4, 16GB eMMC, 802.11ac/ax Wi-Fi + BLE 5.x, Industrial Grade

iW-G50M 5 V I2C, SPI, UART - 40 C + 85 C 82 mm x 50 mm Bulk
iWave Global 模块化系统 - SOM i.MX 9131 (A0 CPU) SMARC SOM with 2GB LPDDR4, 16GB eMMC, 802.11ac/ax Wi-Fi + BLE 5.x, Industrial

iW-G50M 5 V I2C, SPI, UART - 40 C + 85 C 82 mm x 50 mm Bulk
SECO 模块化系统 - SOM Trizeps VIII Plus EC/Quad/IT1600/R2G/EMMC8G/ETH/COD/RoHS

ARM ARM Cortex-A53 1.8 GHz 3.3 VDC I2C, SPI, UART 0 C + 70 C 67.6 mm x 36.7 mm x 6.4 mm
SECO 模块化系统 - SOM Trizeps VIII Plus EC/Quad/IT1600/R2G/EMMC16G/ETH/MCU/COD/RoHS

ARM ARM Cortex-A53 1.8 GHz 3.3 VDC I2C, SPI, UART 0 C + 70 C 67.6 mm x 36.7 mm x 6.4 mm
SECO 模块化系统 - SOM Apollo Lake I - CPU Atom E3930 step F1, LPDDR4 2GB (2 chip da 8Gb), eMMC 16GB, LVDS, Displayport, 1 controller di rete I210, 2 controller di rete I210, no TPM - Ind.Temp.

Intel Atom x5-E3930 1.3 GHz 12 VDC I2C, SPI, UART - 40 C + 85 C 82 mm x 50 mm
SECO 模块化系统 - SOM SM-B69 - Intel Atom E3930, LPDDR4 4GB (4 chip x 8Gb), eMMC 32GB, LVDS, Displayport, 2x Eth ctrl I210, no TPM - Ind.Temp.

Intel Atom x5-E3930 1.3 GHz 12 VDC I2C, SPI, UART - 40 C + 85 C 82 mm x 50 mm
SECO 模块化系统 - SOM Apollo Lake I - CPU Atom E3940 step F1, LPDDR4 4GB (4 chip da 8Gb), eMMC 32GB, LVDS, Displayport, 1 controller di rete I210, 2 controller di rete I210, no TPM - Ind.Temp.

Intel Atom x5-E3940 1.6 GHz 12 VDC I2C, SPI, UART - 40 C + 85 C 82 mm x 50 mm
SECO 模块化系统 - SOM Apollo Lake I - CPU Atom E3940 step F1, LPDDR4 8GB (4 chip da 16Gb), LVDS, HDMI, 1 controller di rete I210, 2 controller di rete I210 - Ind.Temp.

Intel Atom x5-E3940 1.6 GHz 12 VDC I2C, SPI, UART - 40 C + 85 C 82 mm x 50 mm
SECO 模块化系统 - SOM Apollo Lake I - CPU Atom E3950 step F1, LPDDR4 8GB (4 chip da 16Gb), eMMC 32GB, LVDS, Displayport, 1 controller di rete I210, 2 controller di rete I210, no TPM - Comm.

Intel Atom x7-E3950 1.6 GHz 12 VDC I2C, SPI, UART 0 C + 60 C 82 mm x 50 mm
SECO 模块化系统 - SOM JAGER w/CPU Atom E3940 step F1, LPDDR4 4GB (4 chip da 8Gb), eMMC 32GB, LVDS, Displayport, 1 controller di rete I210, 2 controller di rete I210, no TPM - Comm.

Intel Atom x5-E3940 1.6 GHz 12 VDC I2C, SPI, UART 0 C + 60 C 82 mm x 50 mm
SECO 模块化系统 - SOM SMARC con CPU ZU4EV Quad Core+GPU+VCU 1,30GHz Zynq Ultrascale+, PS DRAM 2 GB, PL DRAM 512M, eMMC 8 GB, SecondGigabit Ethernet SGMII, Clock Generator Si510 148.5 MHz - Range Commerciale

ZU4EV 1.3 GHz 3 VDC to 5.25 VDC I2C, SPI, UART 0 C + 60 C 82 mm x 50 mm
SECO 模块化系统 - SOM SMARC con CPU ZU4EG Quad Core+GPU 1,30GHz Xilinx Zynq Ultrascale+, PS DRAM 2 GB, eMMC 4 GB - Ind.Temp.

ZU4EG 1.3 GHz 3 VDC to 5.25 VDC I2C, SPI, UART - 40 C + 85 C 82 mm x 50 mm
SECO 模块化系统 - SOM SM-C12 i.MX8M Quad 1.3 GHz (VPU decode + HDR10 + GPU), LPDDR4 2 GB, eMMC 8 GB, LVDS + HDMI, uSD + UART4, PCIe, CAN, Ind. Temp

ARM ARM Cortex-A53 1.5 GHz 5 VDC I2C, SPI, UART - 40 C + 85 C 82 mm x 50 mm
SECO 模块化系统 - SOM Trizeps VII Solo/IT800/R1G.2/uSD/ETH/nWB/CODW/RoHS

ARM ARM Cortex-A9 1 GHz 3.3 VDC I2C, SPI, UART 0 C + 70 C 67.6 mm x 36.7 mm x 6.4 mm
SECO 模块化系统 - SOM Trizeps VII Solo/IT800/R1G.2/uSD/ETH/nWB/CODW/RoHS

ARM ARM Cortex-A9 1 GHz 3.3 VDC I2C, SPI, UART 0 C + 70 C 67.6 mm x 36.7 mm x 6.4 mm
SECO 模块化系统 - SOM Trizeps VII Solo/IT800/R1G.2/#uSD/ETH/nWB/CODW/RoHS

ARM ARM Cortex-A9 1 GHz 3.3 VDC I2C, SPI, UART 0 C + 70 C 67.6 mm x 36.7 mm x 6.4 mm
SECO 模块化系统 - SOM Trizeps VII DualLite/IT800/R1G.2/uSD/ETH/nWB/CODW/RoHS

ARM ARM Cortex-A9 1 GHz 3.3 VDC I2C, SPI, UART 0 C + 70 C 67.6 mm x 36.7 mm x 6.4 mm
SECO 模块化系统 - SOM Trizeps VII Quad/IT800/R1G.4/uSD/nWB/RoHS

ARM ARM Cortex-A9 1 GHz 3.3 VDC I2C, SPI, UART 0 C + 70 C 67.6 mm x 36.7 mm x 6.4 mm