+ 85 C - 40 C 模块化系统 - SOM

结果: 359
选择 图像 零件编号 制造商 描述 数据表 供货情况 单价(含13%增值税) 根据您的数量,按照单价筛选表格中的结果。 数量 RoHS ECAD模型 系列 外观尺寸 处理器品牌 处理器类型 频率 RAM最大容量 已安装RAM 工作电源电压 接口类型 最小工作温度 最大工作温度 尺寸 封装
Trenz Electronic 模块化系统 - SOM AMD/Xilinx Artix 7 XC7A35T-2CSG324I, 512 MByte DDR3, dual 100 MBit Ethernet PHY

SPI - 40 C + 85 C 50 mm x 40 mm
Trenz Electronic 模块化系统 - SOM FPGA Module with AMD Artix 7 XC7A200T-1I, 1 GByte DDR3, 4 x 5 cm, low profile
4 cm x 5 mm AMD XC7A200T-1FBG484I 1 GB 1 GB 3.3 V, 5 V Ethernet, QSPI - 40 C + 85 C 50 mm x 40 mm
Trenz Electronic 模块化系统 - SOM FPGA Module with AMD Artix 7A35T-2I, 1 GByte DDR3L, 32MByte Flash, 4 x 5 cm
4 cm x 5 mm Xilinx XC7A35T-2FGG484I 3.3 V, 5 V Ethernet, JTAG, QSPI - 40 C + 85 C 50 mm x 40 mm
Trenz Electronic 模块化系统 - SOM SoC Module with AMD Zynq 7015-2I, 1 GByte DDR3L, 32 MByte Flash, 4 x 5 cm
Xilinx XC7Z015-2CLG485I 125 MHz Ethernet, I2C, SPI, USB 2.0 - 40 C + 85 C 50 mm x 40 mm
Trenz Electronic 模块化系统 - SOM SoC-Module with AMD Zynq 7020-2I, 1 GB DDR3L, 8 GByte eMMC, 4 x 5 cm
40 mm x 50 mm Xilinx XC7Z020-2CLG484I 1 GB 1 GB 3.3 V Ethernet, JTAG, QSPI, USB 2.0 - 40 C + 85 C 50 mm x 40 mm
Trenz Electronic 模块化系统 - SOM FPGA-Module with AMD Kintex 7K410T-2I, 32 MByte QSPI Flash, 4 x 5 cm
4 cm x 5 cm AMD XC7K410T-2FBG676I 3.3 V, 5 V - 40 C + 85 C 50 mm x 40 mm
Trenz Electronic 模块化系统 - SOM SoM with AMD Zynq 7030-2I, 1 GByte DDR3L, 5.2 x 7.6 cm
AMD XC7Z030-2FBG676I 1 GB 1 GB Ethernet, I2C, QSPI, USB 2.0 OTG - 40 C + 85 C 76 mm x 52 mm
Trenz Electronic 模块化系统 - SOM SoM with AMD Zynq 7035-2I, 1 GByte DDR3L, 5.2 x 7.6 cm
AMD XC7Z035-2FBG676I 1 GB 1 GB Ethernet, I2C, QSPI, USB 2.0 OTG - 40 C + 85 C 76 mm x 52 mm
Trenz Electronic 模块化系统 - SOM SoM with AMD Zynq 7030-1I incl. Heat Spreader
AMD XC7Z030-1FBG676I 1 GB 1 GB Ethernet, I2C, QSPI, USB 2.0 OTG - 40 C + 85 C 76 mm x 52 mm
Trenz Electronic 模块化系统 - SOM SoM with AMD Zynq 7045-2I incl. Heat Spreader
AMD XC7Z045-2FBG676I 1 GB 1 GB Ethernet, I2C, QSPI, USB 2.0 OTG - 40 C + 85 C 76 mm x 52 mm
Trenz Electronic 模块化系统 - SOM SoM with AMD Zynq 7045-3E incl. Heat Spreader
AMD XC7Z045-3FFG676E 1 GB 1 GB Ethernet, I2C, QSPI, USB 2.0 OTG - 40 C + 85 C 76 mm x 52 mm
Trenz Electronic 模块化系统 - SOM High-Performance FPGA-Modul mit AMD Zynq 7035-2I, 1 GByte DDR3L, 8,5 x 8,5 cm
85 mm x 85 mm Xilinx XC7Z035-2FFG900I 1 GB 1 GB eMMC, Ethernet, JTAG, QSPI, USB 2.0 - 40 C + 85 C 85 mm x 85 mm
Trenz Electronic 模块化系统 - SOM High-Performance FPGA-Module with AMD Zynq 7045-2I, 1 GByte DDR3L, 8,5 x 8,5 cm
85 mm x 85 mm Xilinx XC7Z045-2FFG900I 1 GB 1 GB eMMC, Ethernet, JTAG, QSPI, USB 2.0 - 40 C + 85 C 85 mm x 85 mm
Trenz Electronic 模块化系统 - SOM UltraSOM MPSoC-Module with AMD Zynq UltraScale?? ZU9EG-2I incl. Heat Spreader

52 mm x 76 mm AMD XCZU9EG-2FFVC900I 4 GB 4 GB 3.3 V - 40 C + 85 C 76 mm x 52 mm
Trenz Electronic 模块化系统 - SOM MPSoC Module with AMD Zynq UltraScale+ ZU7EV-1I, 4 GByte DDR4, 5.2 x 7.6 cm

4 GB JTAG, I2C - 40 C + 85 C 5.2 cm x 7.6 cm
Trenz Electronic 模块化系统 - SOM UltraSOM+ MPSoC-Module with AMD Zynq UltraScale+ ZU9EG-2I incl. Heat Spreader
AMD XCZU9EG-2FFVC900I 4 GB 4 GB - 40 C + 85 C 76 mm x 52 mm
Trenz Electronic 模块化系统 - SOM MPSoC Module with AMD Zynq UltraScale+ ZU2EG-1I, 2 GByte DDR4 SDRAM, 4 x 5 cm
4 cm x 5 cm AMD XCZU2EG-1SFVC784I 2 GB 2 GB DP, GMII, PCIe, SATA 3.1, USB 3.0 - 40 C + 85 C 50 mm x 40 mm
Trenz Electronic 模块化系统 - SOM MPSoC Module with AMD Zynq UltraScale+ ZU2EG-1I, 2 GByte DDR4, 4 x 5 cm, LP
4 cm x 5 cm AMD XCZU2EG-1SFVC784I 2 GB 2 GB DP, GMII, PCIe, SATA 3.1, USB 3.0 - 40 C + 85 C 50 mm x 40 mm
Trenz Electronic 模块化系统 - SOM MPSoC Module with AMD Zynq UltraScale?? ZU3EG-1I, 2 GByte DDR4, 4 x 5 cm, LP

4 cm x 5 cm AMD XCZU3EG-1SFVC784I 2 GB 2 GB DP, GMII, PCIe, SATA 3.1, USB 3.0 - 40 C + 85 C 50 mm x 40 mm
Trenz Electronic 模块化系统 - SOM MPSoC Module with AMD Zynq UltraScale?? 3CG-L1I, 1 GByte LPDDR4, 4 x 5 cm
40 mm x 50 mm Xilinx XCZU3CG-L1SFVC784I 1 GB 1 GB 3.3 V to 5 V DP, eMMC, GMII, I2C, JTAG, PCIe, QSPI, SATA, USB 3.0 - 40 C + 85 C 50 mm x 40 mm
Trenz Electronic 模块化系统 - SOM MPSoC Module with AMD Zynq UltraScale?? 3CG-L1I, 1 GByte LPDDR4, 4 x 5 cm, LP
40 mm x 50 mm Xilinx XCZU3CG-L1SFVC784I 1 GB 1 GB 3.3 V to 5 V DP, eMMC, GMII, I2C, JTAG, PCIe, QSPI, SATA, USB 3.0 - 40 C + 85 C 50 mm x 40 mm
Octavo Systems 模块化系统 - SOM System-in-Package: AMD Zynq UltraScale+ MPSoC ZU3, 2GB LPDDR4, Power Management System, 32MB 1V8 NOR QSPI, Osciallator, Passives - 20.5mmX40mm 600 Ball BGA - 40C to 85C

OSDZU3 Standard BGA XCZU3EG1 2 GB 4.5 V to 5.5 V CAN, I2C, SPI, UART, USB - 40 C + 85 C 20.5 mm X 40 mm Tray
BECOM Systems 模块化系统 - SOM eCM-BF561-C-I-Q25S128F32

Blackfin ADI ADSP-BF561 1.2 GHz 128 MB 0 GB 3 V to 3.6 V - 40 C + 85 C 44 mm x 33 mm x 3.5 mm Bulk
BECOM Systems 模块化系统 - SOM

ADSP-BF537 600 MHz 64 MB 64 MB 3.3 V CAN, Ethernet, PPI, SSI, Sport, TWI/I2C, UART - 40 C + 85 C 36 mm x 31 mm
Ezurio 模块化系统 - SOM Nitrogen8M PLUS SMARC: i.MX8M Quad Plus / 2GB / 16GB eMMC / LWB5+ / Industrial Temp

NXP i.MX 8M Plus 1.8 GHz 5 V I2C, SPI, UART, USB - 40 C + 85 C 82 mm x 50 mm Tray