512 MB 模块化系统 - SOM

结果: 49
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数量 RoHS ECAD模型 系列
外观尺寸
处理器品牌
处理器类型
频率
RAM最大容量
已安装RAM
工作电源电压
接口类型
最小工作温度
最大工作温度
尺寸
封装
MYIR 模块化系统 - SOM 512MB DDR3, 4GB eMMC, industrial
数据表
无库存
最低： 1
倍数： 1

15 mm x 15 mm Texas Instruments AM3352 1 GHz 1 GB 4.75 V to 5.25 V CAN, GPIO, I2C, JTAG, RGMII, SAI, SDIO, SPI, UART, USB - 40 C + 85 C 50 mm x 40 mm
Trenz Electronic 模块化系统 - SOM AMD/Xilinx Artix 7 XC7A100T-2CSG324C, 512 MByte DDR3, dual 100 MBit Ethernet PHY
数据表

SPI - 40 C + 85 C 50 mm x 40 mm
Critical Link 模块化系统 - SOM Cyclone V SoC module w/ 25KLE ALTERA CYCLONE V SOC
数据表

MitySOM-5CSX Small Form Factor Intel Cyclone V SE-U672 600 MHz 2.5 GB 512 MB 5 V CAN, Ethernet, I2C, JTAG, SPI, UART, USB 2.0 OTG 0 C + 70 C 82 mm x 39 mm
Toradex 模块化系统 - SOM 00731200VerdinAM62D1GBET
数据表

Verdin AM62 Texas Instruments AM623 400 MHz, 1 GHz 512 MB 512 MB 3.3 V, 5 V CAN, GPIO, I2C, I2S, SDIO, SPI, UART 0 C + 70 C 69.6 mm x 35 mm x 6 mm Bulk
Digi CC-WMX-JN69-NN
Digi 模块化系统 - SOM i.MX6UL-2, 528 MHz, Industrial Temp, 512 MB SLC NAND, 512 MB DDR3, Dual 10/100 Ethernet, 802.11a/b/g/n/ac, Bluetooth 5
ConnectCore 6UL NXP PF3000 528 MHz Ethernet, GPIO, I2C, SPI, UART, USB - 40 C + 85 C 29 mm x 29 mm x 3.5 mm
Toradex 模块化系统 - SOM 00761200VerdinAM62QGBWBIT
数据表
更多信息可用

Verdin AM62 Texas Instruments AM623 400 MHz, 1 GHz 512 MB 512 MB 3.3 V, 5 V CAN, GPIO, I2C, I2S, SDIO, SPI, UART - 40 C + 85 C 69.6 mm x 35 mm x 6 mm Bulk
Digi 模块化系统 - SOM ConnectCore 93, i.MX 93 Single A55, M33, no NPU, 512MB LPDDR4, 8GB eMMC, -40/+85C, no MCA
数据表
更多信息可用

ConnectCore 93 - 40 C + 85 C 45 mm x 40 mm
Digi 模块化系统 - SOM ConnectCore 93, i.MX 93 Single A55, M33, no NPU, 512MB LPDDR4, 8GB eMMC, -40/+85C, no MCA, Wi-Fi 802.11ax, Bluetooth 5.3
数据表
更多信息可用

ConnectCore 93 - 40 C + 85 C 45 mm x 40 mm
Trenz Electronic 模块化系统 - SOM AMD/Xilinx Artix 7 XC7A35T-2CSG324C, 512 MByte DDR3, dual 100 MBit Ethernet PHY
数据表

SPI - 40 C + 85 C 50 mm x 40 mm
Trenz Electronic 模块化系统 - SOM AMD/Xilinx Artix 7 XC7A35T-2CSG324I, 512 MByte DDR3, dual 100 MBit Ethernet PHY
数据表

SPI - 40 C + 85 C 50 mm x 40 mm
Octavo Systems 模块化系统 - SOM System-in-Package: ST Micro STM32MP153C Dual ARM Cortex A7 + M4 Processor, 512MB DDR3L, STPMIC1A, 4KB EEPROM, 24MHz Oscillator, Passives - 18mm x 18mm 302 Ball BGA - -40 C to 85 C
数据表

STMicroelectronics STM32MP153C 209 MHz, 800 MHz 384 kB 2.8 V to 5.5 V CAN, I2C, SPI, UART, USB 0 C + 85 C Tray
Octavo Systems 模块化系统 - SOM System-in-Package: ST Micro STM32MP153C Dual ARM Cortex A7 + M4 Processor, 512MB DDR3L, STPMIC1A, 4KB EEPROM, 24MHz Oscillator, Passives - 18mm x 18mm 302 Ball BGA - 0 C to 85 C
数据表

STMicroelectronics STM32MP153C 209 MHz, 800 MHz 384 kB 2.8 V to 5.5 V CAN, I2C, SPI, UART, USB 0 C + 85 C Tray
Octavo Systems 模块化系统 - SOM System-in-Package: ST Micro STM32MP157F Dual ARM Cortex A7 + M4 Processor, 512MB DDR3L, STPMIC1A, 4KB EEPROM, 24MHz Oscillator, Passives - 18mm x 18mm 302 Ball BGA - 0 C to 85 C
数据表

STMicroelectronics STM32MP157F 209 MHz, 800 MHz 384 kB 2.8 V to 5.5 V CAN, I2C, SPI, UART, USB 0 C + 85 C Tray
Digi 模块化系统 - SOM ConnectCore 91, i.MX 91, single-core A55 1.4GHz, 8GB eMMC, 512MB LPDDR4, -40/+85C
数据表

40 mm x 45 mm NXP I2C - 40 C + 85 C
Digi 模块化系统 - SOM ConnectCore
数据表
ConnectCore 6 NXP i.MX 6DualLite 800 MHz 2 GB 512 MB - 40 C + 85 C
Digi 模块化系统 - SOM ConnectCore 91, i.MX 91, single-core A55 1.4GHz, 8GB eMMC, 512MB LPDDR4, -40/+85C, Wi-Fi 6 802.11a/b/g/n/ac/ax 1x1, Bluetooth 5.4
数据表

40 mm x 45 mm NXP I2C - 40 C + 85 C
Octavo Systems 模块化系统 - SOM AM3358 512MB DDR3 System-In-Package
数据表

OSD3358 Texas Instruments AM3358 1 GHz 512 MB 512 MB 1.1 V CAN, Ethernet, GPIO, I2C, SPI, UART, USB - 40 C + 85 C 27 mm x 27 mm Tray
Critical Link 模块化系统 - SOM MitySOM-3354 CORTEX-A8 AM3354
数据表

MitySOM-335x Small Form Factor Texas Instruments AM335x 800 MHz 512 MB 0 GB 3.3 V - 40 C + 85 C 67.6 mm x 38.1 mm Bulk
Digi CC-MX-JN69-ZN
Digi 模块化系统 - SOM i.MX6UL-2, 528 MHz, Industrial Temp, 512 MB SLC NAND, 512 MB DDR3, Dual 10/100 Ethernet
ConnectCore 6UL NXP i.MX 6UltraLite 528 MHz GPIO, I2C, SPI, UART, USB - 40 C + 85 C 29 mm x 29 mm x 3.5 mm
Digi CC-WMX-L76C-N
Digi 模块化系统 - SOM ConnectCore 6 module, i.MX6DualLite, Industrial, 800 MHz, -40 to 85C, 4 GB flash, 512MB DDR3, 802.11ac, Bluetooth 5.0, Ethernet
ConnectCore 6 NXP i.MX 6DualLite 800 MHz 2 GB 512 MB Ethernet, GPIO, I2C, SPI, UART, USB - 40 C + 85 C
SoMLabs 模块化系统 - SOM VisionSOM module, STM32MP157A at 650MHz, 512MB RAM, microSD, 0...+70C
数据表

STMicroelectronics STM32MP157A 209 MHz, 800 MHz 512 MB 5 V Ethernet, I2C, SPI, USB 0 C + 70 C 67 mm x 32 mm x 4 mm Bulk
SoMLabs 模块化系统 - SOM VisionSOM module, STM32MP157A @ 650MHz, 512MB RAM, 4GB eMMC, -40...+85C

STMicroelectronics STM32MP157A 209 MHz, 800 MHz 512 MB 5 V Ethernet, I2C, SPI, USB - 40 C + 85 C 67 mm x 32 mm x 4 mm
SoMLabs 模块化系统 - SOM VisionSOM module, STM32MP157A @ 650MHz, 512MB RAM, 4GB eMMC, WiFi/BT, -25 +70C

STMicroelectronics STM32MP157A 209 MHz, 800 MHz 512 MB 5 V Ethernet, I2C, SPI, USB 67 mm x 32 mm x 4 mm
MYIR 模块化系统 - SOM SOM RENESAS RZ/G2UL, 512MB DDR3L, 4GB eMMC
数据表

Renesas RZ/G2UL 200 MHz, 1 GHz 5 V CAN, GPIO, I2C, RS-232, RS-485, SPI, USB - 40 C + 85 C 39 mm x 37 mm