- 40 C 模块化系统 - SOM

结果: 378
选择 图像 零件编号 制造商 描述 数据表 供货情况 单价(含13%增值税) 根据您的数量,按照单价筛选表格中的结果。 数量 RoHS ECAD模型 系列 外观尺寸 处理器品牌 处理器类型 频率 RAM最大容量 已安装RAM 工作电源电压 接口类型 最小工作温度 最大工作温度 尺寸 封装
Trenz Electronic 模块化系统 - SOM SoM with AMD Zynq 7045-3E incl. Heat Spreader
AMD XC7Z045-3FFG676E 1 GB 1 GB Ethernet, I2C, QSPI, USB 2.0 OTG - 40 C + 85 C 76 mm x 52 mm
Trenz Electronic 模块化系统 - SOM High-Performance FPGA-Modul mit AMD Zynq 7035-2I, 1 GByte DDR3L, 8,5 x 8,5 cm
85 mm x 85 mm Xilinx XC7Z035-2FFG900I 1 GB 1 GB eMMC, Ethernet, JTAG, QSPI, USB 2.0 - 40 C + 85 C 85 mm x 85 mm
Trenz Electronic 模块化系统 - SOM High-Performance FPGA-Module with AMD Zynq 7045-2I, 1 GByte DDR3L, 8,5 x 8,5 cm
85 mm x 85 mm Xilinx XC7Z045-2FFG900I 1 GB 1 GB eMMC, Ethernet, JTAG, QSPI, USB 2.0 - 40 C + 85 C 85 mm x 85 mm
Trenz Electronic 模块化系统 - SOM UltraSOM MPSoC-Module with AMD Zynq UltraScale?? ZU9EG-2I incl. Heat Spreader

52 mm x 76 mm AMD XCZU9EG-2FFVC900I 4 GB 4 GB 3.3 V - 40 C + 85 C 76 mm x 52 mm
Trenz Electronic 模块化系统 - SOM UltraSOM+ MPSoC-Module with AMD Zynq UltraScale+ ZU9EG-2I incl. Heat Spreader
AMD XCZU9EG-2FFVC900I 4 GB 4 GB - 40 C + 85 C 76 mm x 52 mm
Trenz Electronic 模块化系统 - SOM MPSoC Module with AMD Zynq UltraScale+ ZU2EG-1I, 2 GByte DDR4 SDRAM, 4 x 5 cm
4 cm x 5 cm AMD XCZU2EG-1SFVC784I 2 GB 2 GB DP, GMII, PCIe, SATA 3.1, USB 3.0 - 40 C + 85 C 50 mm x 40 mm
Trenz Electronic 模块化系统 - SOM MPSoC Module with AMD Zynq UltraScale+ ZU2EG-1I, 2 GByte DDR4, 4 x 5 cm, LP
4 cm x 5 cm AMD XCZU2EG-1SFVC784I 2 GB 2 GB DP, GMII, PCIe, SATA 3.1, USB 3.0 - 40 C + 85 C 50 mm x 40 mm
Trenz Electronic 模块化系统 - SOM MPSoC Module with AMD Zynq UltraScale?? ZU3EG-1I, 2 GByte DDR4, 4 x 5 cm, LP

4 cm x 5 cm AMD XCZU3EG-1SFVC784I 2 GB 2 GB DP, GMII, PCIe, SATA 3.1, USB 3.0 - 40 C + 85 C 50 mm x 40 mm
Trenz Electronic 模块化系统 - SOM MPSoC Module with AMD Zynq UltraScale?? 3CG-L1I, 1 GByte LPDDR4, 4 x 5 cm
40 mm x 50 mm Xilinx XCZU3CG-L1SFVC784I 1 GB 1 GB 3.3 V to 5 V DP, eMMC, GMII, I2C, JTAG, PCIe, QSPI, SATA, USB 3.0 - 40 C + 85 C 50 mm x 40 mm
Trenz Electronic 模块化系统 - SOM MPSoC Module with AMD Zynq UltraScale?? 3CG-L1I, 1 GByte LPDDR4, 4 x 5 cm, LP
40 mm x 50 mm Xilinx XCZU3CG-L1SFVC784I 1 GB 1 GB 3.3 V to 5 V DP, eMMC, GMII, I2C, JTAG, PCIe, QSPI, SATA, USB 3.0 - 40 C + 85 C 50 mm x 40 mm
Octavo Systems 模块化系统 - SOM System-in-Package: AMD Zynq UltraScale+ MPSoC ZU3, 2GB LPDDR4, Power Management System, 32MB 3V3 NOR QSPI, Osciallator, Passives - 20.5mmX40mm 600 Ball BGA - 40C to 100C

OSDZU3 Standard BGA XCZU3EG1 2 GB 4.5 V to 5.5 V CAN, I2C, SPI, UART, USB - 40 C + 100 C 20.5 mm X 40 mm Tray
BECOM Systems 模块化系统 - SOM eCM-BF561-C-I-Q25S128F32

Blackfin ADI ADSP-BF561 1.2 GHz 128 MB 0 GB 3 V to 3.6 V - 40 C + 85 C 44 mm x 33 mm x 3.5 mm Bulk
BECOM Systems 模块化系统 - SOM

ADSP-BF537 600 MHz 64 MB 64 MB 3.3 V CAN, Ethernet, PPI, SSI, Sport, TWI/I2C, UART - 40 C + 85 C 36 mm x 31 mm
Ezurio 模块化系统 - SOM Nitrogen8M PLUS SMARC: i.MX8M Quad Plus / 2GB / 16GB eMMC / LWB5+ / Industrial Temp

NXP i.MX 8M Plus 1.8 GHz 5 V I2C, SPI, UART, USB - 40 C + 85 C 82 mm x 50 mm Tray
Ezurio 模块化系统 - SOM Nitrogen8M PLUS SMARC: i.MX8M Quad Plus / 4GB / 16GB eMMC / LWB5+ / Industrial Temp

NXP i.MX 8M Plus 1.8 GHz 5 V I2C, SPI, UART, USB - 40 C + 85 C 82 mm x 50 mm Tray
Ezurio 模块化系统 - SOM Nitrogen8M PLUS SMARC: i.MX8M Quad Plus / 8GB / 16GB eMMC / LWB5+

NXP i.MX 8M Plus 1.8 GHz 5 V I2C, SPI, UART, USB - 40 C + 85 C 82 mm x 50 mm Tray
Ezurio 模块化系统 - SOM Nitrogen8M PLUS SOM: i.MX8M Quad Plus / 1GB / 16GB eMMC Wifi+BT

Nitrogen8 NXP i.MX 8M Plus Quad 1.8 GHz 4 GB 2 GB 5 V Audio, Ethernet, HDMI, I2C, MIPI-CSI, MIPI-DSI, PCIe, SPI, UART, USB 3.0, Video, WiFi - 40 C + 85 C 48 mm x 38 mm
TechNexion 模块化系统 - SOM FLEX SOM NXP I.MX8M Mini QUAD 1.6GHZ + 2GB RAM + 16GB EMMC + QCA9377 802.11AC + BLUETOOTH INDUSTRIAL TEMP -40 85C

FLEX NXP i.MX 8M Mini Quad 1.6 GHz 2 GB 5 V Ethernet, GPIO, I2C, I2S, MIPI, LVDS, PCIe, RGMII, RS-232, SDIO, UART, USB, USB 2.0, USB OTG - 40 C + 85 C 69.6 mm x 35 mm x 3.45 mm
TechNexion 模块化系统 - SOM FLEX SOM NXP I.MX8M Mini QUAD 1.6GHZ + 4GB RAM + 16GB EMMC + QCA9377 802.11AC + BLUETOOTH INDUSTRIAL TEMP -40 85C

FLEX NXP i.MX 8M Mini Quad 1.6 GHz 4 GB 5 V Ethernet, GPIO, I2C, I2S, MIPI, LVDS, PCIe, RGMII, RS-232, SDIO, UART, USB, USB 2.0, USB OTG - 40 C + 85 C 69.6 mm x 35 mm x 3.45 mm
TechNexion 模块化系统 - SOM FLEX SOM NXP I.MX8M Mini QUAD 1.6GHZ + 1GB RAM + 16GB EMMC + QCA9377 802.11AC + BLUETOOTH INDUSTRIAL TEMP -40 85C

FLEX NXP i.MX 8M Mini Quad 1.6 GHz 1 GB 5 V Ethernet, GPIO, I2C, I2S, MIPI, LVDS, PCIe, RGMII, RS-232, SDIO, UART, USB, USB 2.0, USB OTG - 40 C + 85 C 69.6 mm x 35 mm x 3.45 mm
TechNexion 模块化系统 - SOM FLEX SOM NXP I.MX8M Mini QUAD 1.6GHZ + 1GB RAM + 16GB EMMC INDUSTRIAL TEMP -40 85C

FLEX NXP i.MX 8M Mini Quad 1.6 GHz 1 GB 5 V Ethernet, GPIO, I2C, I2S, MIPI, LVDS, PCIe, RGMII, RS-232, SDIO, UART, USB, USB 2.0, USB OTG - 40 C + 85 C 69.6 mm x 35 mm x 3.45 mm
TechNexion 模块化系统 - SOM FLEX SOM NXP I.MX8M Mini QUAD 1.6GHZ + 2GB RAM + 16GB EMMC INDUSTRIAL TEMP -40 85C

FLEX NXP i.MX 8M Mini Quad 1.6 GHz 2 GB 5 V Ethernet, GPIO, I2C, I2S, MIPI, LVDS, PCIe, RGMII, RS-232, SDIO, UART, USB, USB 2.0, USB OTG - 40 C + 85 C 69.6 mm x 35 mm x 3.45 mm
TechNexion 模块化系统 - SOM FLEX SOM NXP I.MX8M Mini QUAD 1.6GHZ + 4GB RAM + 16GB EMMC INDUSTRIAL TEMP -40 85C

FLEX NXP i.MX 8M Mini Quad 1.6 GHz 4 GB 5 V Ethernet, GPIO, I2C, I2S, MIPI, LVDS, PCIe, RGMII, RS-232, SDIO, UART, USB, USB 2.0, USB OTG - 40 C + 85 C 69.6 mm x 35 mm x 3.45 mm
Digi 模块化系统 - SOM Digi ConnectCore 9C 16MB SDRAM 4MB Flash

ConnectCore 9C SO-DIMM Digi International NS9360 155 MHz 16 MB 16 MB 3.3 V Ethernet, GPIO, I2C, SPI, UART, USB - 40 C + 85 C 91.9 mm x 52.2 mm x 18.08 mm
Digi 模块化系统 - SOM Digi ConnectCore 9C 16MB SDRAM 4MB Flash

SO-DIMM Digi International NS9360 155 MHz 16 MB 16 MB 3.3 V Ethernet, GPIO, I2C, SPI, UART, USB - 40 C + 85 C 91.9 mm x 52.2 mm x 18.08 mm