WORKPRO 模块化系统 - SOM

结果: 48
选择 图像 零件编号 制造商 描述 数据表 供货情况 单价(含13%增值税) 根据您的数量,按照单价筛选表格中的结果。 数量 RoHS ECAD模型 系列 外观尺寸 处理器品牌 处理器类型 频率 RAM最大容量 已安装RAM 工作电源电压 接口类型 最小工作温度 最大工作温度 尺寸 封装
Luxonis A00497
Luxonis 模块化系统 - SOM OAK-SoM Pro (25 pcs)

OAK-SoM Bulk
Lantronix 模块化系统 - SOM Production ready computing module, based on Qualcomm QCS7230 processor.
Bulk
Lantronix 模块化系统 - SOM Open-Q? 7230CS SOM (6GB/64GB) production ready computing module, based on Qualcomm QCS7230 processor.
Bulk
Lantronix 模块化系统 - SOM Production ready computing module, based on Qualcomm QCS8250 processor.

Bulk
DLP Design 模块化系统 - SOM Ferroelectric DLP-FR256 Module

Texas Instruments MSP430 16 MHz 5 V 56.4 mm x 22.9 mm x 12.7 mm
Trenz Electronic 模块化系统 - SOM Micromodule with AMD Kintex UltraScale KU040, 2 GB DDR4, 4 x 5, low profile
Trenz Electronic 模块化系统 - SOM FPGA Module with AMD Artix 7A100T-2C, 1 GByte DDR3L, 4 x 5 cm, low profile
4 cm x 5 mm Xilinx XC7A100T-2C 3.3 V, 5 V Ethernet, JTAG, QSPI 0 C + 70 C 50 mm x 40 mm
Trenz Electronic 模块化系统 - SOM FPGA Module with AMD Artix 7 XC7A200T-1I, 1 GByte DDR3, 4 x 5 cm, low profile
4 cm x 5 mm AMD XC7A200T-1FBG484I 1 GB 1 GB 3.3 V, 5 V Ethernet, QSPI - 40 C + 85 C 50 mm x 40 mm
Trenz Electronic 模块化系统 - SOM MPSoC Module with AMD Zynq UltraScale+ ZU4EV-1E, 4 GByte DDR4, low profile
BECOM Systems 模块化系统 - SOM eCM-BF561-C-C Q25S128F32

Blackfin ADI ADSP-BF561 600 MHz 128 MB 0 GB 3.3 V 0 C + 70 C 44 mm x 33 mm Reel
Octavo Systems 模块化系统 - SOM System-in-Package: ST Micro STM32MP153C Dual ARM Cortex A7 + M4 Processor, 512MB DDR3L, STPMIC1A, 4KB EEPROM, 24MHz Oscillator, Passives - 18mm x 18mm 302 Ball BGA - 0 C to 85 C

STMicroelectronics STM32MP153C 209 MHz, 800 MHz 384 kB 2.8 V to 5.5 V CAN, I2C, SPI, UART, USB 0 C + 85 C Tray
Toradex 模块化系统 - SOM NXP i.MX 95 SoM. Pin-to-pin compatible with Aquila Family. NXP i.MX 95 applications processor, with 6 Cortex-A55 1.8 GHz. Dual Cortex-M processor, for real-time applications. Enhanced Functional Safety, and built for mission-critical applications
Aquila iMX95 2 mm x 3 mm 1.8 GHz 1.8 V CAN, GPIO, I2C, JTAG, SPI, UART - 40 C + 85 C 85 mm x 55 mm x 8 mm
Octavo Systems 模块化系统 - SOM System-in-Package: ST Micro STM32MP157F Dual ARM Cortex A7 + M4 Processor, 512MB DDR3L, STPMIC1A, 4KB EEPROM, 24MHz Oscillator, Passives - 18mm x 18mm 302 Ball BGA - 0 C to 85 C

STMicroelectronics STM32MP157F 209 MHz, 800 MHz 384 kB 2.8 V to 5.5 V CAN, I2C, SPI, UART, USB 0 C + 85 C Tray
Toradex 模块化系统 - SOM TI AM69 / TDA4 SoM Based on the TI AM69 processor with up to 8x ARM Cortex-A72 cores. State-of-the-art Deep Learning Accelerator with up to 32 TOPS. Ideal for robotics, AI, real-time control, and computer vision applications.
Aquila AM69 TI AM69 2 GHz 5 V CAN, GPIO, I2C, JTAG, SPI, UART - 40 C + 85 C 85 mm x 55 mm x 9 mm
Octavo Systems 模块化系统 - SOM System-in-Package: ST Micro STM32MP153C Dual ARM Cortex A7 + M4 Processor, 512MB DDR3L, STPMIC1A, 4KB EEPROM, 24MHz Oscillator, Passives - 18mm x 18mm 302 Ball BGA - -40 C to 85 C

STMicroelectronics STM32MP153C 209 MHz, 800 MHz 384 kB 2.8 V to 5.5 V CAN, I2C, SPI, UART, USB 0 C + 85 C Tray
SECO 模块化系统 - SOM Q7 - Q7-A36 w/Bay Trail-I E3845 a.1.91 GHz QC - RAM DDR3L 4GB - eMMC 32GB - LVDS - HDMI - Ind. Temp - Xtra Works Conformal AV

Intel Atom E3845 1.91 GHz 5 VDC I2C, SPI, UART, USB - 40 C + 85 C 70 mm x 70 mm
Octavo Systems 模块化系统 - SOM AM3358 512MB DDR3 System-In-Package

OSD3358 Texas Instruments AM3358 1 GHz 512 MB 512 MB 1.1 V CAN, Ethernet, GPIO, I2C, SPI, UART, USB - 40 C + 85 C 27 mm x 27 mm Tray
Trenz Electronic TE0722-04-41C-4-A
Trenz Electronic 模块化系统 - SOM DIPFORTy1 "Soft Propeller" with AMD Zynq 7010-1C, 16 MByte Flash
DIP40 AMD XC7Z010-1CLG225C 3.3 V 0 C + 70 C 51 mm x 18 mm
Olimex Ltd. T2-SOM-e16Gs16M-IND
Olimex Ltd. 模块化系统 - SOM System on chip module, with A20 Dual Core Cortex-A7 processor
Olimex Ltd. T2-SOM204-1Gs16Me16G-MC-I
Olimex Ltd. 模块化系统 - SOM SO-DIMM format system on chip module with A20 Dual Core Cortex-A7 processor
CHERRY Embedded Solutions 模块化系统 - SOM System-on-Module tconnects multiple high-resolution cameras

RK3588-Q7 Qseven RK3588 5 V GPIO, I2C, I2S, UART - 20 C + 85 C 70 mm x 70 mm
CHERRY Embedded Solutions 模块化系统 - SOM Versatile System-on-Module for smart devices that collect, process and output high resolution video streams.It is typically used to run 2 MIPI-CSI high-resolution cameras and a 4K / 60fps display.Potential Configuration: DRAM up to 4GB, EMMC up to 12
RK3399-Q7 Qseven Rockchip RK3399 4 GB 5 V GPIO, I2C, I2S, SPI, UART - 20 C + 85 C 70 mm x 70 mm
MNT Research 模块化系统 - SOM This is the MNT Reform CM4 A311D Processor Module Bundle that increases the performance of your MNT Reform laptop using the RCM4 Processor Module Adapter. The A311D is power efficient, has stable Linux support, 4 GB LPDDR4 RAM, and integrated Bluetoo

MNT Reform Amlogic A311D, ARM Mali G52 MP4 1.8 GHz, 2.2 GHz 4 GB 4 GB Ethernet, PCIe, USB 3.0 68 mm x 67.5 mm