CA 模块化系统 - SOM

结果: 1,125
选择 图像 零件编号 制造商 描述 数据表 供货情况 单价(含13%增值税) 根据您的数量,按照单价筛选表格中的结果。 数量 RoHS ECAD模型 系列 外观尺寸 处理器品牌 处理器类型 频率 RAM最大容量 已安装RAM 工作电源电压 接口类型 最小工作温度 最大工作温度 尺寸 封装
Silex Technology 模块化系统 - SOM [Sample Pack] The IM-100-SB is a driverless Serial-to-Wi-Fi board offering plug-and-play Wi-Fi 6 enablement. Equipped with a 34-pin board-to-board connector, the IM-100-SB offers a streamlined development path for devices with a UART interface, reduc

IM-100 2.4 GHz to 5 GHz 1.2 MB 3.3 V UART - 40 C + 85 C 24 mm × 26.5 mm × 3.5 mm Bulk
SECO 模块化系统 - SOM Myon II CO/Quad/CO1800/R1G/EMMC8G/MIPI/RoHS

ARM 3.3 VDC I2C, SPI, UART, USB 0 C + 70 C 48 mm x 32 mm x 4.2 mm
SECO 模块化系统 - SOM Myon II CO/Quad/CO1800/R1G/EMMC8G/Dual-LVDS/RoHS

ARM 3.3 VDC I2C, SPI, UART, USB 0 C + 70 C 48 mm x 32 mm x 4.2 mm
SECO 模块化系统 - SOM Trizeps VIII Mini CO/Quad/CO1800/R1G/uSD/ ETH/RoHS

ARM ARM Cortex-A53 1.8 GHz 3.3 VDC I2C, SPI, UART, USB 0 C + 70 C 67.6 mm x 36.7 mm x 6.4 mm
SECO 模块化系统 - SOM Trizeps VIII Mini EC/Quad/IT1600/R1G/EMMC8G/ETH/RoHS

ARM ARM Cortex-A53 1.8 GHz 3.3 VDC I2C, SPI, UART, USB 0 C + 70 C 67.6 mm x 36.7 mm x 6.4 mm
SECO 模块化系统 - SOM Myon II EC/Quad/IT1600/R2G/EMMC8G/MIPI/RoHS

ARM 3.3 VDC I2C, SPI, UART, USB 0 C + 70 C 48 mm x 32 mm x 4.2 mm
SECO 模块化系统 - SOM Myon II EC/Quad/IT1600/R2G/EMMC8G/Dual-LVDS/RoHS

ARM 3.3 VDC I2C, SPI, UART, USB 0 C + 70 C 48 mm x 32 mm x 4.2 mm
SECO 模块化系统 - SOM Myon II EC/Quad/IT1600/R2G/EMMC16G/MIPI/COD/RoHS

ARM 3.3 VDC I2C, SPI, UART, USB 0 C + 70 C 48 mm x 32 mm x 4.2 mm
SECO 模块化系统 - SOM Trizeps VIII Plus EC/Quad/IT1600/R2G/EMMC8G/ETH/COD/RoHS

ARM ARM Cortex-A53 1.8 GHz 3.3 VDC I2C, SPI, UART 0 C + 70 C 67.6 mm x 36.7 mm x 6.4 mm
SECO 模块化系统 - SOM Trizeps VIII Plus EC/Quad/IT1600/R2G/EMMC16G/ETH/MCU/COD/RoHS

ARM ARM Cortex-A53 1.8 GHz 3.3 VDC I2C, SPI, UART 0 C + 70 C 67.6 mm x 36.7 mm x 6.4 mm
SECO 模块化系统 - SOM Trizeps VIII Mini EC/Quad/IT1600/R2G/EMMC16G/Dual-LVDS/ETH/Azure/RoHS

ARM ARM Cortex-A53 1.8 GHz 3.3 VDC I2C, SPI, UART, USB 0 C + 70 C 67.6 mm x 36.7 mm x 6.4 mm
SECO 模块化系统 - SOM Trizeps VIII Mini CT/Quad/C01800/R2G/EMMC16G/FPGA/Dual-LVDS/ETH/COD/MCU/WB/RoHS

ARM ARM Cortex-A53 1.8 GHz 3.3 VDC I2C, SPI, UART, USB 0 C + 70 C 67.6 mm x 36.7 mm x 6.4 mm
SECO 模块化系统 - SOM Trizeps VIII Mini EC/Quad/IT1600/R2G/EMMC8G/Dual-LVDS/ETH/RoHS

ARM ARM Cortex-A53 1.8 GHz 3.3 VDC I2C, SPI, UART, USB 0 C + 70 C 67.6 mm x 36.7 mm x 6.4 mm
SECO 模块化系统 - SOM Trizeps VIII Mini EC/Quad/IT1600/R2G/EMMC16G/Dual-LVDS/ETH/COD/RoHS

ARM ARM Cortex-A53 1.8 GHz 3.3 VDC I2C, SPI, UART, USB 0 C + 70 C 67.6 mm x 36.7 mm x 6.4 mm
SECO 模块化系统 - SOM Trizeps VIII Mini EC/Quad/IT1600/R2G/EMMC32G/Dual-LVDS/ETH/COD/RoHS

ARM ARM Cortex-A53 1.8 GHz 3.3 VDC I2C, SPI, UART, USB 0 C + 70 C 67.6 mm x 36.7 mm x 6.4 mm
SECO 模块化系统 - SOM Myon II EC/Quad/ IT1600/R4G/EMMC32G/MIPI/RoHS

ARM 3.3 VDC I2C, SPI, UART, USB 0 C + 70 C 48 mm x 32 mm x 4.2 mm
SECO 模块化系统 - SOM Myon II EC/Quad/ IT1600/R4G/EMMC64G/MIPI/RoHS

ARM 3.3 VDC I2C, SPI, UART, USB 0 C + 70 C 48 mm x 32 mm x 4.2 mm
SECO 模块化系统 - SOM COMe-B75-CT6 w/AMD Ryzen Embedded V1807B a. 3.35GHz - Ethernet Contr. I211 - EDP Port - HUB - Packet Switch - Comm. Temp

COMe
SECO 模块化系统 - SOM https://www.seco.com/Datasheet/Modules/Qseven/SOM-Q7-MX6_datasheet.pdf

i.MX6 800 MHz 1 GB
SECO 模块化系统 - SOM Q7 - Q7-928 w/ i.MX6 Quad a.800MHz - 4GB RAM - eMMC 8GB - microSD - Video Input Port - RTC low power - No CPLD + GPIO + KSZ9031 - Ind. Temp.

Q7
SECO 模块化系统 - SOM uQ7-962 w/ i.MX6 DualLite a.800MHz - DDR3L 1GB - eMMC 8GB - RTC low power - Ind. Temp.

Q7
SECO 模块化系统 - SOM uQ7-962 w/ i.MX6 Quad a.800MHz - DDR3L 1GB - eMMC 8GB - RTC low power - Ind. Temp.

Q7
SECO 模块化系统 - SOM uQ7 - uQ7-962 w/ i.MX6 Quad a.800MHz - DDR3L 2GB - eMMC 4GB - RTC low power - Ind. Temp.

Q7
SECO 模块化系统 - SOM uQ7 - uQ7-962 w/ i.MX6 Quad a.1GHz - DDR3L 2GB - eMMC 8GB - RTC low power - Comm. Temp.

Q7
SECO 模块化系统 - SOM Q7 - Q7-974 w/Bay Trail-D J1900 a.2.00 GHz QC - RAM DDR3L 4GB - LVDS - HDMI - Com. Temp

Intel Intel Celeron J1900 2 GHz 5 VDC I2C, SPI, UART, USB 0 C + 60 C 70 mm x 70 mm