Development Boards 开发板与工具包 - x86

结果: 115
选择 图像 零件编号 制造商 描述 数据表 供货情况 单价(含13%增值税) 根据您的数量,按照单价筛选表格中的结果。 数量 RoHS 系列 产品 核心 工具用于评估 封装
congatec 开发板与工具包 - x86 Evaluation carrier board for COM HPC Client.

conga-HPC/cTLU Intel Tiger Lake-UP3 Evaluation Carrier Boards conga-HPC
Advantech 开发板与工具包 - x86 COM-HPC Development Board for Client Pin

Advantech 开发板与工具包 - x86 COM-HPC Size E proprietary Dev Board A1

Advantech 开发板与工具包 - x86 COMe R31 Devel Board Type6 Rev A3

Advantech 开发板与工具包 - x86 SMARC R21 Devel Board Rev A1 for RISC


Advantech 开发板与工具包 - x86 COM-HPC Size D Devel Board A1 w/10G OCP

Advantech 开发板与工具包 - x86 SMARC R21 Devel Board Rev A1 w/eDP

Advantech 开发板与工具包 - x86 COMe Type 7 Devel Board RevA2 w/10G PH

Advantech 开发板与工具包 - x86 COMe R31 Devel Board Type6 Rev A3 w/e

Advantech 开发板与工具包 - x86 COMe Type 7 Devel Board RevA2 w/10G PH

congatec 开发板与工具包 - x86 Evaluation Carrier Board for COM Express Type 7 modules with four 10GbE SFP+ fiber/copper ports. The carrier features an Aspeed AST2500 Board Management Controller (BMC). Commercial temperature range from 0 C to 60 C.
Advantech 开发板与工具包 - x86 COMe Type 7 Devel. Board Rev.A1 w/10G PHY EA63

Advantech ROM-DB7503-SCA1E
Advantech 开发板与工具包 - x86 ROM-DB7503 Qseven 21 Carrier Board

Altera EB-HPSTB
Altera 开发板与工具包 - x86 Hard Processor System Test Board

Advantech SOM-DH5000-01A1
Advantech 开发板与工具包 - x86 COM-HPC Size D Devel Board A1 w/25G OCP

congatec 开发板与工具包 - x86 Evaluation Carrier Board for COM Express Type 7 modules with four 10GbE SFP+ fiber/copper ports. No BMC. Industrial temperature range from -40 C to 85 C.

Carrier Boards COM Express Type 7
ADLINK Technology I-Pi LEC-EL-6425E-4G-64G/US
ADLINK Technology 开发板与工具包 - x86 I-Pi SMARC Plus X Prototype Kit for AIOT with LEC-EL-6425E-4G-64G-CT, low profile heatsink and HDA ALC888 Audio (US 110/220V to 19V Adapter)
Development Kits Atom x6425E LEC-EL-6425E-4G-64G
ADLINK Technology I-cExpress-MTL-125H-Kit
ADLINK Technology 开发板与工具包 - x86 COM Express Type 6 Prototype Kit with cExpress-MTL-125H, Express-BASE6 R3.1 carrier, heatsink with FAN and necessary parts for enabling
Development Kits Ultra 5 125H cExpress-MTL-125H
ADLINK Technology I-Express-RLP-i5-13600HE-Kit
ADLINK Technology 开发板与工具包 - x86 COM Express Type 6 Prototype Kit with Express-ADP-i5-13600HE, Express-BASE6 R3.1 carrier, heatsink with FAN and necessary parts for enabling
Development Kits Core i5-13600HE Express-ADP-i5-13600HE
Advantech SOM-DB5830-H0A2
Advantech 开发板与工具包 - x86 COMe R3.0 Devel. Board Type6 Rev. A2 w/8mm BTB

ADLINK Technology I-nanoX-EL-x6211E-2G-Kit
ADLINK Technology 开发板与工具包 - x86 I-nanoX-EL-x6211E-2G-KitCOM Express Type 10 Prototype Kit with nanoX-EL-x6211G-2G, miniBase-10R carrier, heatspreader, US 110/220V to 19V Adapter and necessary enabling parts
Development Kits Atom x6211E nanoX-EL-x6211E-2G
Eurotech 开发板与工具包 - x86 Eurotech DeviceCloud (EDC) Dev Kit

Development Kits Intel Atom Z5xx Helios
ADLINK Technology I-Pi LEC-EL-6425E-4G-64G/EU
ADLINK Technology 开发板与工具包 - x86 I-Pi SMARC Plus X Prototype Kit for AIOT with LEC-EL-6425E-4G-64G-CT, low profile heatsink and HDA ALC888 Audio (EU 110/220V to 19V Adapter)

Development Kits Atom x6425E LEC-EL-6425E-4G-64G
Eurotech 开发板与工具包 - x86 Eurotech DeviceCloud (EDC) Dev Kit

Development Kits Intel Atom Z5xx Helios
ADLINK Technology Starterkit-COM Express 7 PLUS-4 Copper
ADLINK Technology 开发板与工具包 - x86 Starterkit-COM Express 7 PLUS-Full CopperCOM Express formfactor starterkit with Express-BASE7 carrier, 10GbE Full BaseT Card, power supply and accessory (order COM Express module, memory and thermal solution separately)
Starter Kits COM Express Type 7 Series