WIRE PRO 多协议开发工具

结果: 5
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最大工作温度
协议 - 蓝牙、BLE - 802.15.1
DFRobot 多协议开发工具 The LoRaWAN ESP32-S3 Development Board is a professional hardware focusing on long-range wireless communication and convenient development. With comprehensive compatibility for LoRa, LoRaWAN, and Meshtastic protocols, integration capability with the 7库存量
24在途量
最低： 1
倍数： 1

Development Boards ESP32 3.3 V I2C, SPI, USB - 10 C + 60 C
Nordic Semiconductor 多协议开发工具 Devkit for wireless protocol and ICs 1,172库存量
325预期 2026/7/29
最低： 1
倍数： 1

Development Kits
SparkFun 多协议开发工具 The SparkFun Thing Plus Matter is the first easily accessible board of its kind that combines Matter and SparkFun s Qwiic ecosystem for agile development and prototyping of Matter-based IoT devices. The MGM240P wireless module from Silicon Labs p
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14库存量
61在途量
最低： 1
倍数： 1

Evaluation Boards EFR32MG24 I2C, SPI, UART
Telink 多协议开发工具 The TL7218X Development board is designed based on the TL7218X chip and and is used to verify the TL721x series chips and supports various functional tests. TL721X SoC supports Bluetooth LE, Zigbee, Thread, Matter, and 2.4GHz proprietary protocols. I
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Evaluation Kits TL7218X Bluetooth
Telink 多协议开发工具 Telink Semiconductor is a fabless IC design company of state-of-the art wireless connectivity SoCs. Through years of research and development, Telink has built a comprehensive product portfolio and become one of the world-leading IC suppliers in this