ADLINK Technology 存储器模块和存储卡

内存模块和内存卡类型

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选择 图像 零件编号 制造商 描述 数据表 供货情况 单价(含13%增值税) 根据您的数量,按照单价筛选表格中的结果。 数量 RoHS
ADLINK Technology DDR4 2666 288P 16GB U-DIMM
ADLINK Technology 存储器模块 DDR4-2666, 16GB, 2Gx64, U-DIMM 288P, 1.2V, Rank:2, CL19, Non-ECC, OP Temp:0-85, Fix Die:No(C-die), Samsung Chip(1Gx8)
ADLINK Technology DDR4 2666 288P 16GB ECC U-DIMM
ADLINK Technology 存储器模块 DDR4-2666, 16GB, 2Gx72, U-DIMM 288P, 1.2V, Rank:2, CL19, ECC, OP Temp:0-85, Fix Die:Yes(C-die), Samsung Chip(1Gx8), anti-sulfur
ADLINK Technology DDR4 2666 288P 32GB RDIMM ECC
ADLINK Technology 存储器模块 DDR4-2666, 32GB, 4Gx72, R-DIMM 288P, 1.2V, Rank:2, CL19, ECC, OP Temp:0-85
ADLINK Technology DDR4 2666 288P 4GB U-DIMM
ADLINK Technology 存储器模块 DDR4-2666, 4GB, 512Mx64, U-DIMM 288P, 1.2V, Rank:1, CL19, Non-ECC, OP Temp:0-85, Fix Die:Yes(F-die), Samsung Chip(512Mx8)
ADLINK Technology DDR4 2666 288P 4GB ECC U-DIMM
ADLINK Technology 存储器模块 DDR4-2666, 4GB, 512Mx72, U-DIMM 288P, 1.2V, Rank:1, CL19, ECC, OP Temp:0-85, Fix Die:Yes(F-die), Samsung Chip(512Mx8), anti-sulfur
ADLINK Technology DDR4 2666 288P 4GB U-DIMM non-ECC
ADLINK Technology 存储器模块 DDR4-2666, 4GB, 512Mx64, U-DIMM 288P, 1.2V, Rank:1, CL19, Non-ECC, OP Temp:0-85, Fix Die:No(F-die), Samsung Chip(512Mx8)
ADLINK Technology DDR4 2666 288P 8GB U-DIMM
ADLINK Technology 存储器模块 DDR4-2666, 8GB, 1Gx64, U-DIMM 288P, 1.2V, Rank:1, CL19, Non-ECC, OP Temp:0-85, Fix Die:No(C-die), Samsung Chip(1Gx8)
ADLINK Technology DDR4 2666 288P 8GB U-DIMM non-ECC
ADLINK Technology 存储器模块 DDR4-2666, 8GB, 1Gx64, U-DIMM 288P, 1.2V, Rank:2, CL19, Non-ECC, OP Temp:0-85, Fix Die:No(F-die), Samsung Chip(512Mx8)
ADLINK Technology DDR4 2666 288P 8GB ECC U-DIMM
ADLINK Technology 存储器模块 DDR4-2666, 8GB, 1Gx72, U-DIMM 288P, 1.2V, Rank:1, CL19, ECC, OP Temp:0-85, Fix Die:No(C-die), Samsung Chip(1Gx8)
ADLINK Technology DDR4 2666 4GB SO-DIMM
ADLINK Technology 存储器模块 DDR4-2666, 4GB, 512Mx64, SO-DIMM 260P, 1.2V, Rank:1, CL19, Non-ECC, OP Temp:0-85, Fix Die:No, Chip(512Mx16)
ADLINK Technology DDR4 2666 ECC 32GB SO-DIMM
ADLINK Technology 存储器模块 DDR4-2666, 32GB, 4Gx72, SO-DIMM 260P, 1.2V, Rank:2, CL19, ECC, OP Temp:-40 85, Fix Die:No, Samsung Chip(2Gx8), anti-sulfur, hight:30mm
ADLINK Technology DDR4 2666MHZ 8GB RDIMM
ADLINK Technology 存储器模块 DDR4-2666, 8GB, 512Mx8, RDIMM 288P, 1.2V, Rank:2, CL19, ECC, OP Temp:0 85, Fix Die:No, Chip(512Mx8), M4R0-8GSSBCIK
ADLINK Technology DDR4 2666MHZ 260P 4GB SODIMM
ADLINK Technology 存储器模块 DDR4-2666, 4GB, 512Mx64, SO-DIMM 260P, 1.2V, Rank:1, CL19, Non-ECC, OP Temp:0 85, Fix Die:No, Chip(512Mx8)
ADLINK Technology DDR4 2400 ECC 260P 16GB
ADLINK Technology 存储器模块 DDR4-2400, 16GB, 2Gx72, SO-DIMM 260P, 1.2V, Rank:2, CL17, ECC, OP Temp:0-85, Fix Die:No, Samsung Chip(1Gx8)
ADLINK Technology DDR4 2400 ECC 260P 4GB
ADLINK Technology 存储器模块 DDR4-2400, 4GB, 512Mx72, SO-DIMM 260P, 1.2V, Rank:1, CL17, ECC, OP Temp:0 85, Fix Die:No, Samsung Chip(512Mx8)
ADLINK Technology DDR4 3200 16GB ECC SO-DIMM
ADLINK Technology 存储器模块 DDR4-3200, 16GB, 2Gx72, SO-DIMM 260P, 1.2V, Rank:2, CL22, ECC, OP Temp:0-85, Fix Die:No, Samsung Chip(1Gx8), anti-sulfur, Height:30.00mm
ADLINK Technology DDR4 ECC SODIMM 3200-22 32GB SA-A INDUS
ADLINK Technology 存储器模块 DDR4-3200, 32GB, 4096Mx72, SO-DIMM 260P, 1.2V, Rank:2, CL22, ECC, OP Temp:-40-85, Fix Die:No, Chip(2048M x8*18 ), height:30mm
ADLINK Technology DDR4 3200 260P 16GB SODIMM ECC
ADLINK Technology 存储器模块 DDR4-3200, 16GB, 2Gx72, SO-DIMM 260P, 1.2V, Rank:2, CL22, ECC, OP Temp:-40-95, Fix Die:Yes(C-die), Samsung Chip(1Gx8), anti-sulfur
ADLINK Technology DDR4 3200 260P 32GB ECC-SO-DIMM Indus
ADLINK Technology 存储器模块 DDR4-3200, 32GB, 4Gx72, SO-DIMM 260P, 1.2V, Rank:2, CL22, ECC, OP Temp:-40-85, Fix Die:No, Samsung Chip(2Gx8), Anti-sulfur, Height:30mm
ADLINK Technology DDR4 3200 260P 32GB ECC SODIMM
ADLINK Technology 存储器模块 DDR4-3200, 32GB, 4Gx72, SO-DIMM 260P, 1.2V, Rank:2, CL22, ECC, OP Temp:0-85, Fix Die:No(A-die), Samsung Chip(2Gx8), hight:30mm
ADLINK Technology DDR4 3200 260P 8GB NON-ECC SODIMM INDUS
ADLINK Technology 存储器模块 DDR4-3200, 8GB, 1024Mx64, SO-DIMM 260P, 1.2V, Rank:1, CL22, non-ECC, OP Temp:-40-85, Fix Die:No, Samsung Chip(1024M x8*8 ), height:30mm
ADLINK Technology DDR4 3200 260P 16GB ECC SODIMM INDUS
ADLINK Technology 存储器模块 DDR4-3200, 16GB, 1024x8, SO-DIMM 260P, 1.2V, Rank:2, CL22, ECC, OP Temp:-40-95, Fix Die:No, Samsung Chip(K4A8G085WC-BIWE), height:30mm
ADLINK Technology DDR4 3200 260P 16GB SODIMM INDUS
ADLINK Technology 存储器模块
ADLINK Technology DDR4 3200 260P 4GB NON-ECC SODIMM INDUS
ADLINK Technology 存储器模块 DDR4-3200, 4GB, 512Mx64, SO-DIMM 260P, 1.2V, Rank:1, CL22, non-ECC, OP Temp:-40-85, Fix Die:No, Samsung Chip(512M x8*8 ), height:30mm
ADLINK Technology DDR4 3200 288P 16GB REG-DIMM
ADLINK Technology 存储器模块