SOC 模块配件

结果: 24
选择 图像 零件编号 制造商 描述 数据表 供货情况 单价(含13%增值税) 根据您的数量,按照单价筛选表格中的结果。 数量 RoHS ECAD模型 产品 用于
ReFLEX CES 模块配件 Ares Agilex 7 SoC F-Series system-on-module 6U VPX carrier board is an evaluation board with a FMC+ connector 2库存量
最低: 1
倍数: 1

Carrier Boards RXCAGF012PR24-SOM00I, RXCAGF027PR24-SOM00I
ADLINK Technology 模块配件 3U cPCI Single 64bit PMC Slot Carrier Brd 3库存量
最低: 1
倍数: 1

Trenz Electronic 模块配件 Carrier Board for Trenz Electronic TE0782, TE0783 and TE0784 SoC 无库存
最低: 1
倍数: 1
Carrier Boards TE0782 SoC
Trenz Electronic 模块配件 Test Board for Trenz Electronic TE0782, TE0783 and TE0784 SoC without USB 无库存
最低: 1
倍数: 1
Test Fixtures TE0782
IEI 模块配件 Half-size PCIe CPU card supports 32nm Socket G2 Intel mobile Core i7/i5/i3 CPU per Intel HM65 PCH,VGA/LVDS,Dual PCIe GbE,SATA 6Gb/s and HD Audio 无库存
最低: 1
倍数: 1

Hirschmann Dust-Cover set for M12 socket,
Hirschmann 模块配件 Dust-Cover set for M12 socket,
Trenz Electronic 模块配件 Carrier board for TEM0007 Microchip PolarFire SoC module
Trenz Electronic 模块配件 Carrierboard for a TE0728 Automotive Zynq-7020 SoC Module
交货期 18 周
最低: 1
倍数: 1
Carrier Boards TE0728
Trenz Electronic 模块配件 Carrier board for TE0729 Zynq-7020 SoC with USB-A-Host Connector
congatec 400006
congatec 模块配件 Connector for ETX and XTX-Baseboards, height 3.0 mm, packing unit 8 pieces

congatec 400009
congatec 模块配件 Connector for ETX and XTX-Baseboards, height 9.5 mm, packing unit 8 pieces

congatec 400004
congatec 模块配件 Connector for COM Express carrier boards, height 8mm, packing unit 4 pieces

Advantech 模块配件 CLAMP BASE, RAM-202U, AND SOCKET ARM

Quantic X-Microwave 模块配件 1-72 x 0.500" Socket Head Cap Screws, (Qty 50), used to fasten X-MWwalls to plates.

Hardwares
Quantic X-Microwave 模块配件 1-72 x 0.625" Socket Head Cap Screws, (Qty 50), used to fasten X-MWlids and X-MWwalls to plates.

Hardwares
Quantic X-Microwave 模块配件 1-72 x 0.187" Socket Head Cap Screws, (Qty 100), used to fasten X-MWlids together.

Hardwares
Quantic X-Microwave 模块配件 1-72 x 0.156" Socket Head Cap Screws, (Qty 100), used to attach RF boards to the top of the prototyping plate.

Hardwares
Quantic X-Microwave 模块配件 1-72 x 0.375" Socket Head Cap Screws, (Qty 100), used to fasten X-MWprobes to plates or housings, and to fasten X-MWwalls to plates.

Hardwares
Quantic X-Microwave 模块配件 1-72 x 0.125" Socket Head Cap Screws, (Qty 100), used to attach Control boards to the bottom of the prototyping plate.

Hardwares
Quantic X-Microwave 模块配件 1-72 x 0.250" Socket Head Cap Screws, (Qty 100), used to fasten Anchors and X-MWblocks to plates or housings, and to fasten Pinbridges and X-MWblocks to housings.

Hardwares
ADLINK Technology Backplate size_92.5x89x6.3mm
ADLINK Technology 模块配件 1. 32-50031-0000-A02. Backing plate for INTEL 115X socket CPU3. Mylar with adhesive4. Backplate: 75x75mm5. Material: SPCC
Backplates Intel 115X socket CPU3
WIZnet WizFi250-PF
WIZnet 模块配件 2X11 22Pin 1.27mmSMD Socket for WizFi250

IEI 33403-000015-RS
IEI 模块配件 Socket;Edgecard Card;PC104 PLUS(PRESS FIT) ;DIP(After Soldering);120PIN;180;P=2.0MM ;BLACK;e-Conn;HEE5-D4FA-KODO-26;;PPS;FEMALE;RoHS

IEI 33403-000016-RS
IEI 模块配件 Socket;Edgecard Card;PC104 PRESS FIT;DIP(After Soldering);(64+40)PIN;180;P=2.54MM ;BLACK;e-Conn;HEE5-D4FA-K0D0-22;;PPS;FEMALE;;RoHS