WIRE PRO 无线与射频模块

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数量 RoHS 产品类型
产品
频率
接口类型
协议 - 蓝牙、BLE - 802.15.1
协议 - 蜂窝、Nbiot、LTE
协议 - GPS、GLONASS
协议 - WiFi - 802.11
协议 - ANT、Thread、Zigbee - 802.15.4
协议 - Sub GHz
Taoglas 天线 Monsoon MA172.A.LBC.001 Monsoon 3 in 1 GNSS, Dual-Band Wi-Fi LTE Low Profile Permanent Mount Antenna
数据表
无库存交货期 16 周
最低： 50
倍数： 50

Multiprotocol Antennas Outdoor Antennas Bluetooth, BLE 2G/3G/4G/5G NR, Cellular (NBIoT, LTE), GSM, UMTS, DCS, PCS, UMTS, EDGE, GPRS, HSPA, WCDMA GLONASS, GPS 802.11, WiFi, WLAN 802.15.4 (ANT, Thread, Zigbee) IoT, ISM
Silicon Labs 蓝牙模块 - 802.15.1 Zentri Module, Bluetooth low energy, 1 MB Serial Flash, Integrated antenna & DC-DC, 4dBm, Cut Reel. Full Production version. ACKme TruConnect serial Bluetooth Application.
数据表

Bluetooth Modules 2.45 GHz I2C, SPI, USART Bluetooth LE
Seeed Studio 蓝牙模块 - 802.15.1 The factory is currently not accepting orders for this product.
无库存
最低： 1
倍数： 1

Bluetooth Modules 2.4 GHz Bluetooth LE
Silicon Labs RS9113-N00-D1F
Silicon Labs WiFi模块 - 802.11 integrated antenna
数据表
无库存
最低： 490
倍数： 490
WiFi Modules 2.412 GHz to 5.825 GHz SPI, UART, USB
SparkFun 射频模块 XBee RR 802.15.4 射频模块 are embedded solutions providing wireless end-point connectivity to devices. These devices use the IEEE 802.15.4 networking protocol for fast point-to-multipoint or peer-to-peer networking. They are designed for high-throu 无库存
最低： 1
倍数： 1
RF Modules RF Modules SPI, UART
SparkFun 蓝牙模块 - 802.15.1 The SparkFun IN100 NanoBeacon Board offers a 2.4 GHz wireless low-energy BT beacon breakout with exceptionally low power consumption features and minimal programming required. The board features the IN100 NanoBeacon from InPlay that is complian 无库存
最低： 1
倍数： 1
Bluetooth Modules
SparkFun 多协议模块 The Digi XBee 3 global cellular module is a compact programmable reliable solution with BLE and end-device carrier certifications for developing secure wireless devices with worldwide connectivity and global positioning. A combination of the XBee e
数据表
无库存
最低： 1
倍数： 1
Multiprotocol Modules 3G, BLE, GNSS, LTEM/NBIoT SPI, UART, USB BLE 3G, LTE-M/NBIoT GNSS
Silex Technology 多协议模块 The Silex SX-SDCAC Plus is a next generation 802.11a/b/g/n/ac plus Bluetooth SDIO card based on the QCA9377-3 System-on-Chip (SoC). The SX-SDCAC Plus is mechanically designed in a SD card form factor to provide customers with a vendor independent for
数据表
无库存交货期 30 周
最低： 1
倍数： 1
Multiprotocol Modules
FCL Components 蓝牙模块 - 802.15.1 BLE 4.1 Cent/Periph w/Ant SingleMode
数据表
无库存
最低： 1,000
倍数： 1,000

Bluetooth Modules 2.4 GHz UART Bluetooth LE
FCL Components 蓝牙模块 - 802.15.1 BLE 4.1 Peripheral w/Ant SingleMode
数据表
无库存
最低： 1,000
倍数： 1,000

Bluetooth Modules 2.4 GHz GPIO, I2C, SPI, UART Bluetooth LE
FCL Components 蓝牙模块 - 802.15.1 BLE 4.1 Peripheral w/Ant SingleMode
数据表
无库存
最低： 1,000
倍数： 1,000

Bluetooth Modules 2.4 GHz UART Bluetooth LE
FCL Components 蓝牙模块 - 802.15.1 BLE 4.1 Cent/Periph noAnt SingleMode
数据表
无库存
最低： 1,000
倍数： 1,000

Bluetooth Modules 2.4 GHz UART Bluetooth LE
FCL Components 蓝牙模块 - 802.15.1 BLE 4.1 Peripheral w/Ant SingleMode Ult
数据表
无库存
最低： 1,000
倍数： 1,000

Bluetooth Modules 2.4 GHz UART Bluetooth LE
Silex Technology 多协议模块 2x2 Dual Band 802.11 ac WLAN+BT SMT
数据表
无库存交货期 30 周
最低： 1,500
倍数： 1,500
: 1,500

Multiprotocol Modules WiFi Modules 2.4 GHz, 5 GHz Serial Bluetooth 5.0 802.11 a/b/g/n/ac
Silex Technology 多协议模块 2x2 Dual Band 802.11 ac WLAN+BT PCIe
数据表
无库存交货期 30 周
最低： 100
倍数： 100

Multiprotocol Modules WiFi Modules 2.4 GHz, 5 GHz Serial Bluetooth 5.0 PCIe 802.11 a/b/g/n/ac
Silex Technology 多协议模块 2.4 GHz/5 GHz dual-band Wi-Fi 6 plus BLE v5.3 BR/EDR/LE SDIO 3.0 module Sample
数据表
无库存交货期 26 周
最低： 1
倍数： 1

Multiprotocol Modules 802.11 a/b/g/n/ac/ax, Bluetooth 5.3 2.4 GHz, 5 GHz UART Bluetooth 5.3 802.11 a/b/g/n/ac/ax
Quectel 多协议模块 12+256GB, Wi-Fi 7, no cellular, with Ethernet(EAU >2000pcs) (Do not promote)
数据表
无库存交货期 16 周
最低： 560
倍数： 80
: 80

Multiprotocol Modules
FCL Components mbh7bLZ01
FCL Components 蓝牙模块 - 802.15.1 Bluetooth / 802.15.1 Modules, Class2, SingleMode, Small BLE Module no Antenna, with Fujitsu Data Communication (FDC) profile embedded, nRF51
数据表
无库存
最低： 1,000
倍数： 1,000
Bluetooth Modules Bluetooth LE
Quectel 多协议模块 longevity extended till 2028, not recommended for new designs. please promote SC200E series. (EAU >2000pcs)
数据表
无库存交货期 16 周
最低： 600
倍数： 200
: 200

Multiprotocol Modules
Quectel 多协议模块 longevity extended till 2028, not recommended for new designs. please promote SC200E series. (EAU >2000pcs)
数据表
无库存交货期 16 周
最低： 600
倍数： 200
: 200

Multiprotocol Modules
Quectel 多协议模块 longevity extended till 2028, not recommended for new designs. please promote SC200E series. (EAU >2000pcs)
数据表
无库存交货期 16 周
最低： 600
倍数： 200
: 200

Multiprotocol Modules
Digi Zigbee模块 - 802.15.4 XBee S2D ZigBee Thread Ready SMT PCB
数据表
72库存量
最低： 1
倍数： 1

Zigbee Modules 2.4 GHz SPI, UART Zigbee PRO
Digi Zigbee模块 - 802.15.4 XBee S2D ZigBee Thread Ready SMT RF
数据表
39库存量
最低： 1
倍数： 1

Zigbee Modules 2.4 GHz SPI, UART Zigbee PRO
Espressif Systems 多协议模块 SMD Module, ESP8684H2, 2 MB flash inside, -40C +105C
数据表
4,784库存量
最低： 1
倍数： 1

Multiprotocol Modules 2.4 GHz GPIO, I2C, I2S, SPI, UART Bluetooth 5.0 802.11 b/g/n
Digi Zigbee模块 - 802.15.4 Xbee-Pro 900HP (S3B) DigiMsh 920MHz RPSM
数据表
23库存量
最低： 1
倍数： 1

Zigbee Modules 902 MHz to 928 MHz SPI, UART Zigbee LoRa/LoRaWAN