2 mm SMD/SMT 蓝牙模块 - 802.15.1

结果: 33
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数量 RoHS ECAD模型 系列
协议
类
接口类型
输出功率
数据速率
接收器灵敏度
频率
电源电压-最小
电源电压-最大
最小工作温度
最大工作温度
封装
FCL Components 蓝牙模块 - 802.15.1 BLE 4.1 Cent/Periph w/Ant SingleMode
数据表
无库存
最低： 1,000
倍数： 1,000

MBH7BLZ BLE, Bluetooth 4.1 UART 4 dBm - 88 dBm 2.4 GHz 1.9 V 3.6 V - 25 C + 85 C
FCL Components 蓝牙模块 - 802.15.1 BLE 4.1 Cent/Periph w/Ant SingleMode
数据表
无库存
最低： 1,000
倍数： 1,000

MBH7BLZ BLE, Bluetooth 4.1 GPIO, I2C, SPI, UART 4 dBm - 88 dBm 2.4 GHz 1.9 V 3.6 V - 25 C + 85 C
Microchip Technology 蓝牙模块 - 802.15.1 SmartConnect WINC3400-MR210CA Module
数据表

I2C, SPI, UART 18.3 dBm 1 Mb/s, 2 Mb/s, 5.5 Mb/s, 11 Mb/s, 6 Mb/s, 9 Mb/s, 12 Mb/s, 18 Mb/s, 24 Mb/s, 36 Mb/s, 48 Mb/s, 54 Mb/s 2.4 GHz 2.7 V 3.6 V - 40 C + 85 C
Microchip Technology 蓝牙模块 - 802.15.1 SmartConnect WINC3400-MR210CA Module Tape and Reel
数据表

I2C, SPI, UART 18.3 dBm 1 Mb/s, 2 Mb/s, 5.5 Mb/s, 11 Mb/s, 6 Mb/s, 9 Mb/s, 12 Mb/s, 18 Mb/s, 24 Mb/s, 36 Mb/s, 48 Mb/s, 54 Mb/s 2.4 GHz 2.7 V 3.6 V - 40 C + 85 C
Microchip Technology 蓝牙模块 - 802.15.1 SmartConnect WINC3400-MR210UA Module
数据表

I2C, SPI, UART 18.3 dBm 1 Mb/s, 2 Mb/s, 5.5 Mb/s, 11 Mb/s, 6 Mb/s, 9 Mb/s, 12 Mb/s, 18 Mb/s, 24 Mb/s, 36 Mb/s, 48 Mb/s, 54 Mb/s 2.4 GHz 2.7 V 3.6 V - 40 C + 85 C
Microchip Technology 蓝牙模块 - 802.15.1 SmartConnect WINC3400-MR210UA Module Tape and Reel
数据表

I2C, SPI, UART 18.3 dBm 1 Mb/s, 2 Mb/s, 5.5 Mb/s, 11 Mb/s, 6 Mb/s, 9 Mb/s, 12 Mb/s, 18 Mb/s, 24 Mb/s, 36 Mb/s, 48 Mb/s, 54 Mb/s 2.4 GHz 2.7 V 3.6 V - 40 C + 85 C
Fanstel BM05M
Fanstel 蓝牙模块 - 802.15.1 Mini nRF54L05 BLE 6.0 module, 500KB flash, 96 KB RAM, PCB antenna
数据表

I2C, SPI 4 Mb/s 1.7 V 3.6 V - 40 C + 105 C Reel, Cut Tape
Quectel 蓝牙模块 - 802.15.1 BLE 5.4 standalone module w/ chip antenna in LGA FF, 32 KB RAM, 512 KB flash, 18 GPIOs, transmit power = 8 dBm, -40 C to +85 C
数据表
I2C, SPI, USART 8 dBm 97 dBm, 93 dBm, 101 dBm, 106 dBm 1.71 V 3.8 V - 40 C + 85 C Reel