-ar 蓝牙模块 - 802.15.1

结果: 254
选择 图像 零件编号 制造商 描述 数据表 供货情况 单价(含13%增值税) 根据您的数量,按照单价筛选表格中的结果。 数量 RoHS ECAD模型 系列 协议 接口类型 输出功率 数据速率 接收器灵敏度 频率 电源电压-最小 电源电压-最大 最小工作温度 最大工作温度 封装
Infineon Technologies 蓝牙模块 - 802.15.1 BT DM INDUSTRIAL AND IOT 383库存量
最低: 1
倍数: 1
卷轴: 500

BLE, Bluetooth 5.0 I2C, I2S, PCM, SPI, UART 9 dBm 4 Mb/s - 96.5 dBm 2.44 GHz 2.3 V 3.6 V - 30 C + 85 C Reel, Cut Tape
Infineon Technologies 蓝牙模块 - 802.15.1 BLE INDUSTRIAL AND IOT 1,180库存量
最低: 1
倍数: 1
卷轴: 500

BLE, Bluetooth 3.0 I2C, UART 12 dBm 1 Mb/s - 94.5 dBm 2.48 GHz 2.5 V 3.6 V - 30 C + 85 C Reel, Cut Tape, MouseReel


Infineon Technologies 蓝牙模块 - 802.15.1 BLE INDUSTRIAL AND IOT 477库存量
最低: 1
倍数: 1
卷轴: 500

BLE, Bluetooth 3.0 I2C, UART 12 dBm 1 Mb/s - 94.5 dBm 2.48 GHz 2.5 V 3.6 V - 30 C + 85 C Reel, Cut Tape, MouseReel
Infineon Technologies 蓝牙模块 - 802.15.1 BT DM INDUSTRIAL AND IOT 260库存量
最低: 1
倍数: 1
卷轴: 500

BLE, Bluetooth 5.0 I2C, I2S, PCM, SPI, UART 9 dBm 4 Mb/s - 96.5 dBm 2.44 GHz 2.3 V 3.6 V - 30 C + 85 C Reel, Cut Tape
Insight SiP 蓝牙模块 - 802.15.1 ISP1507-AX BLE Module with Antenna 512 K Flash/ 64 K Ram - standard tray or cut and tape 1,641库存量
最低: 1
倍数: 1

ISP1507 BLE, Bluetooth 5.0 I2C, PDM, SPI, UART 4 dBm 2 Mb/s - 96 dBm 2.44 GHz 1.7 V 3.6 V - 40 C + 85 C Tray
Silicon Labs 蓝牙模块 - 802.15.1 BGM111A Wireless Bluetooth Module, PCB, +8 dBm, 2.4 GHz, 256 kB flash, -40 to 85 C, Built-in Antenna 500库存量
最低: 1
倍数: 1

BGM111 BLE, Bluetooth 4.2 Serial 8 dBm 1 Mb/s - 92 dBm 2.4 GHz 1.85 V 3.8 V - 40 C + 85 C Cut Tape
Infineon Technologies 蓝牙模块 - 802.15.1 BLE INDUSTRIAL AND IOT 1,405库存量
最低: 1
倍数: 1
卷轴: 500

BLE, Bluetooth 4.2 Serial 3 dBm 1 Mb/s - 87 dBm 2.45 GHz 1.9 V 5.5 V - 40 C + 85 C Reel, Cut Tape, MouseReel
Insight SiP 蓝牙模块 - 802.15.1 ISP1507-AX BLE Module with Antenna 512 K Flash/ 64 K Ram - Jedec Tray 131库存量
最低: 1
倍数: 1

ISP1507 BLE, Bluetooth 5.0 I2C, PDM, SPI, UART 4 dBm 2 Mb/s - 96 dBm 2.44 GHz 1.7 V 3.6 V - 40 C + 85 C Tray
Silicon Labs 蓝牙模块 - 802.15.1 BGM210P Wireless Gecko Bluetooth Module, PCB, Secure Vault, +10 dBm, 2.4 GHz, 1 MB Flash, -40 to 125 C, Built-in Antenna & RF Pin 216库存量
最低: 1
倍数: 1

BLE, Bluetooth 5.1 Class 2 I2C, SPI, UART 10 dBm 2 Mb/s - 94.1 dBm 2.44 GHz 1.71 V 3.8 V - 40 C + 125 C Cut Tape
Fanstel 蓝牙模块 - 802.15.1 Mini nRF52811 BLE 5.4 module, 192KB flash,24KB RAM, PCB antenna, approtect 1,413库存量
最低: 1
倍数: 1
卷轴: 1,000

BM833 BLE, Bluetooth 5.1 I2C, I2S, SPI, UART 4 dBm 2 Mb/s - 97 dBm 2.4 GHz 1.7 V 3.6 V - 40 C + 85 C Reel, Cut Tape
ArduSimple 蓝牙模块 - 802.15.1 Bluetooth module 6库存量
最低: 1
倍数: 1

Kaga FEI 蓝牙模块 - 802.15.1 BLE 5.0 (nRF52832) 2Mbps mode, antenna, ARM M4F 64kB RAM, 5.1 x 11.3 x 1.3 mm module 285库存量
最低: 1
倍数: 1
卷轴: 2,000

4 dBm 2 Mb/s - 92 dBm 2.402 GHz to 2.48 GHz 1.7 V 3.6 V - 40 C + 85 C Reel, Cut Tape, MouseReel
Kaga FEI 蓝牙模块 - 802.15.1 BLE 5.0 (nRF52810) 2Mbps mode, antenna, ARM M4 24kB RAM, 3.25 x 8.55 x 1.00 mm module 271库存量
最低: 1
倍数: 1
卷轴: 2,000

BLE 4 dBm 2 Mb/s - 93 dBm 2.402 GHz to 2.48 GHz 1.7 V 3.6 V - 40 C + 85 C Reel, Cut Tape
Quectel 蓝牙模块 - 802.15.1 HCM511S TE-B EVB Evaluation Kit 10库存量
最低: 1
倍数: 1
BLE, Bluetooth 5.4 UART 2.4 GHz 1.71 V 3.8 V - 40 C + 85 C
Quectel 蓝牙模块 - 802.15.1 BLE 5.4 standalone module, 32 KB RAM, 512 KB flash, transmit power = 6 dBm, -40 C to +85 C, PCB antenna 420库存量
最低: 1
倍数: 1
卷轴: 500
BLE, Bluetooth 5.4 UART 2.4 GHz 1.71 V 3.8 V - 40 C + 85 C Reel, Cut Tape
Silicon Labs 蓝牙模块 - 802.15.1 BGM13S Wireless Bluetooth Module, SiP, +8 dBm, 2.4 GHz, 512 kB flash, -40 to 85 C, RF Pin 888库存量
最低: 1
倍数: 1

BGM13S BLE, Bluetooth 5.0 I2C, UART 8 dBm 2 Mb/s - 90.2 dBm 2.44 GHz 1.8 V 3.8 V - 40 C + 85 C Tray
Quectel 蓝牙模块 - 802.15.1 BLE 5.4 standalone module, 32 KB RAM, 352 KB flash, transmit power = 6 dBm, -40 C to +85 C, PCB antenna 405库存量
最低: 1
倍数: 1
卷轴: 500
BLE, Bluetooth 5.4 UART 2.4 GHz 1.71 V 3.8 V - 40 C + 85 C Reel, Cut Tape
Silicon Labs 蓝牙模块 - 802.15.1 BGM111A Wireless Bluetooth Module, PCB, +8 dBm, 2.4 GHz, 256 kB flash, -40 to 85 C, Built-in Antenna 496库存量
最低: 1
倍数: 1
卷轴: 1,000

BGM111 BLE, Bluetooth 4.2 Serial 8 dBm 1 Mb/s - 92 dBm 2.4 GHz 1.85 V 3.8 V - 40 C + 85 C Reel, Cut Tape
Silicon Labs 蓝牙模块 - 802.15.1 BGM13S Wireless Bluetooth Module, SiP, +19 dBm, 2.4 GHz, 512 kB flash, -40 to 85 C, RF Pin 1,014库存量
最低: 1
倍数: 1

BGM13S BLE, Bluetooth 5.0 I2C, UART 18 dBm 2 Mb/s - 90.2 dBm 2.44 GHz 1.8 V 3.8 V - 40 C + 85 C Tray
Renesas / Dialog 蓝牙模块 - 802.15.1 Bluetooth Low Energy 5.1 Module with integrated ARM Cortex M0+, memories and peripherals ? 8 GPIOs 202库存量
最低: 1
倍数: 1
卷轴: 300

DA14531 Bluetooth 5.1 Class 2 ADC, GPIO, I2C, SPI, UART 2.2 dBm 1 Mb/s - 93 dBm 2.48 GHz 1.8 V 3.3 V - 40 C + 85 C Reel, Cut Tape
Silicon Labs 蓝牙模块 - 802.15.1 BGM123 Wireless Bluetooth Module, SiP, +2 dBm, 2.4 GHz, 256 kB flash, -40 to 85 C, Built-in Antenna 1,055库存量
最低: 1
倍数: 1

BGM123 BLE, Bluetooth 4.2 GPIO, I2C, SPI, UART, USART 2 dBm 1 Mb/s - 90 dBm 2.44 GHz 1.85 V 3.8 V - 40 C + 85 C Tray
Silicon Labs 蓝牙模块 - 802.15.1 BGM121 Wireless Bluetooth Module, SiP, +8 dBm, 2.4 GHz, 256 kB flash, -40 to 85 C, RF Pin 1,195库存量
最低: 1
倍数: 1

BGM121 BLE, Bluetooth 4.2 GPIO, I2C, SPI, UART, USART 8 dBm 1 Mb/s - 90 dBm 2.44 GHz 1.85 V 3.8 V - 40 C + 85 C Tray
u-blox 蓝牙模块 - 802.15.1 Bluetooth LE module, (open CPU), pcb antenna, nRF54L10 chip 978库存量
最低: 1
倍数: 1
卷轴: 500

I2C, SPI, UART 7 dBm 2 Mb/s - 91 dBm 1.7 VDC 3.5 VDC - 40 C + 85 C Reel, Cut Tape
u-blox 蓝牙模块 - 802.15.1 Bluetooth LE module, (open CPU), pin antenna connect, nRF54L05 chip 900库存量
最低: 1
倍数: 1
卷轴: 500

I2C, SPI, UART 7 dBm 2 Mb/s - 91 dBm 1.7 VDC 3.5 VDC - 40 C + 85 C Reel, Cut Tape
u-blox 蓝牙模块 - 802.15.1 Bluetooth LE module (open CPU), pin antenna connect, nRF54L10 chip 1,000库存量
最低: 1
倍数: 1
卷轴: 500

I2C, SPI, UART 7 dBm 2 Mb/s - 91 dBm 1.7 VDC 3.5 VDC - 40 C + 85 C Reel, Cut Tape