Bluetooth Modules 蓝牙模块 - 802.15.1

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封装
Panasonic 蓝牙模块 - 802.15.1 PAN B611 Bottom Pad Standard
数据表
更多信息可用

PAN B611-1B Bluetooth 6.0, Bluetooth 802.15.4 GPIO, I2C, I2S, UART 8 dBm 1.7 V 3.6 V - 40 C + 85 C Reel, Cut Tape, MouseReel
Panasonic 蓝牙模块 - 802.15.1 PAN B611 Bottom Pad Economy
数据表
更多信息可用

PAN B611-1B Bluetooth 6.0, Bluetooth 802.15.4 GPIO, I2C, I2S, UART 8 dBm 1.7 V 3.6 V - 40 C + 85 C Reel, Cut Tape, MouseReel
Microchip Technology 蓝牙模块 - 802.15.1 SmartConnect WINC3400-MR210CA Module
数据表

I2C, SPI, UART 18.3 dBm 1 Mb/s, 2 Mb/s, 5.5 Mb/s, 11 Mb/s, 6 Mb/s, 9 Mb/s, 12 Mb/s, 18 Mb/s, 24 Mb/s, 36 Mb/s, 48 Mb/s, 54 Mb/s 2.4 GHz 2.7 V 3.6 V - 40 C + 85 C
Microchip Technology 蓝牙模块 - 802.15.1 SmartConnect WINC3400-MR210CA Module Tape and Reel
数据表

I2C, SPI, UART 18.3 dBm 1 Mb/s, 2 Mb/s, 5.5 Mb/s, 11 Mb/s, 6 Mb/s, 9 Mb/s, 12 Mb/s, 18 Mb/s, 24 Mb/s, 36 Mb/s, 48 Mb/s, 54 Mb/s 2.4 GHz 2.7 V 3.6 V - 40 C + 85 C
Microchip Technology 蓝牙模块 - 802.15.1 SmartConnect WINC3400-MR210UA Module
数据表

I2C, SPI, UART 18.3 dBm 1 Mb/s, 2 Mb/s, 5.5 Mb/s, 11 Mb/s, 6 Mb/s, 9 Mb/s, 12 Mb/s, 18 Mb/s, 24 Mb/s, 36 Mb/s, 48 Mb/s, 54 Mb/s 2.4 GHz 2.7 V 3.6 V - 40 C + 85 C
Microchip Technology 蓝牙模块 - 802.15.1 SmartConnect WINC3400-MR210UA Module Tape and Reel
数据表

I2C, SPI, UART 18.3 dBm 1 Mb/s, 2 Mb/s, 5.5 Mb/s, 11 Mb/s, 6 Mb/s, 9 Mb/s, 12 Mb/s, 18 Mb/s, 24 Mb/s, 36 Mb/s, 48 Mb/s, 54 Mb/s 2.4 GHz 2.7 V 3.6 V - 40 C + 85 C
Microchip Technology 蓝牙模块 - 802.15.1 Certified Dual Mode Bluetooth Module with ASCII Interface used with Apple MFI
数据表
Bluetooth v5.0, BR/EDR/LE Class 2 UART 1.5 dBm 1 Mb/s - 90 dBm, - 92 dBm 2.48 GHz 3.3 V 4.2 V - 20 C + 70 C Tray
Microchip Technology 蓝牙模块 - 802.15.1 Bluetooth 4.2 dual mode (BR/EDR/LE) module; ASCII, w/ shield, w/ antenna
数据表
Bluetooth v5.0, BR/EDR/LE Class 2 UART 1.5 dBm 1 Mb/s - 90 dBm, - 92 dBm 2.48 GHz 3.3 V 4.2 V - 20 C + 70 C Tray
Renesas / Dialog 蓝牙模块 - 802.15.1 Bluetooth Low Energy 5.3 Module with integrated ARM Cortex M0+, memories and peripherals
数据表

DA14535 1-Wire, I2C, SPI, UART 3 dBm - 92.5 dBm 1.8 V 3.6 V - 40 C + 85 C Reel
u-blox 蓝牙模块 - 802.15.1 Bluetooth Low Energy stand-alone module,antenna pin for external antenna, Open CPU with CAN FD
数据表

I2C, SPI, UART 10 dBm 2 Mb/s - 94 dBm 2.402 GHz to 2.48 GHz 1.71 V 3.6 V - 40 C + 85 C Reel
u-blox 蓝牙模块 - 802.15.1 Bluetooth Low Energy stand-alone module,embedded PCB trace antenna, Open CPU
数据表

I2C, SPI, UART 10 dBm 2 Mb/s - 94 dBm 2.402 GHz to 2.48 GHz 1.71 V 3.6 V - 40 C + 85 C Reel, Cut Tape
Silicon Labs 蓝牙模块 - 802.15.1 Low Energy 5.4 Wireless Gecko Bluetooth Module
数据表

BGM260P Bluetooth v5.4 Class 2 ADC, GPIO, I2C, I2S, IrDA, JTAG, SPI, UART, USART 10 dBm 2 Mb/s 2.4 GHz 1.8 V 3.8 V - 40 C + 125 C Reel
Silicon Labs 蓝牙模块 - 802.15.1 Low Energy 5.4 Wireless Gecko Bluetooth Module
数据表

BGM260P Bluetooth v5.4 Class 2 ADC, GPIO, I2C, I2S, IrDA, JTAG, SPI, UART, USART 19.5 dBm 2 Mb/s 2.4 GHz 1.8 V 3.8 V - 40 C + 125 C Reel, Cut Tape
Silicon Labs 蓝牙模块 - 802.15.1 Bluetooth Module, SiP, Secure Boot with Root of Trust and Secure Loader (RTSL), +6.5 dBm, 2.4 GHz, 768kB flash, 64kB RAM, -40 to +105 C, 26 GPIO, Certified
数据表

BGM270S 76.8 MHz - 40 C + 105 C Reel
Infineon Technologies 蓝牙模块 - 802.15.1 BLE INDUSTRIAL AND IOT
数据表

BLE, Bluetooth 5.0 I2C, SPI, UART 4 dBm 2 Mb/s - 101 dBm 2.4 GHz to 2.5 GHz 1.7 V 3.3 V - 40 C + 85 C Reel, Cut Tape, MouseReel
Infineon Technologies 蓝牙模块 - 802.15.1 BLE INDUSTRIAL AND IOT
数据表

Bluetooth 5.4 Class 1, Class 2 GPIO, I2C, I2S, SPI, UART 10 dBm 125 kb/s, 500 kb/s, 1 Mb/s, 2 Mb/s - 95 dBm, - 98 dBm, - 101 dBm, - 106 dBm 2.4 GHz 2.75 V 3.6 V - 40 C + 85 C Reel, Cut Tape
Fanstel BM05M
Fanstel 蓝牙模块 - 802.15.1 Mini nRF54L05 BLE 6.0 module, 500KB flash, 96 KB RAM, PCB antenna
数据表

I2C, SPI 4 Mb/s 1.7 V 3.6 V - 40 C + 105 C Reel, Cut Tape
Telit Cinterion BE890D3S152R0I7000
Telit Cinterion 蓝牙模块 - 802.15.1
SPI, I2C, UART 1.7 V 3.6 V - 40 C + 85 C Reel
Quectel 蓝牙模块 - 802.15.1 BLE 5.3 standalone module, LCC pin antenna, No audio codec for mic in/out
数据表
BLE 5.3 I2C, SPI, UART - 95 dBm, - 90 dBm 1.8 V 4.3 V - 40 C + 85 C Reel, Cut Tape
Quectel 蓝牙模块 - 802.15.1 BLE 5.3 standalone module, PCB antenna, No audio codec for mic in/out
数据表
BLE 5.3 I2C, SPI, UART - 95 dBm, - 90 dBm 1.8 V 4.3 V - 40 C + 85 C Reel, Cut Tape
Quectel 蓝牙模块 - 802.15.1 BLE 5.3 standalone module, IPEX-4 antenna connector, , No audio codec for mic in/out
数据表
BLE 5.3 I2C, SPI, UART - 95 dBm, - 90 dBm 1.8 V 4.3 V - 40 C + 85 C Reel, Cut Tape
Quectel 蓝牙模块 - 802.15.1 BT 5.0,Bluetooth independent antenna
数据表
Bluetooth 5.0 UART - 92 dBm, - 90 dBm, - 85 dBm, - 95 dBm 3.13 V 3.46 V - 40 C + 105 C Reel
Quectel 蓝牙模块 - 802.15.1 BT 5.0,Bluetooth independent antenna
数据表
Bluetooth 5.0 UART - 92 dBm, - 90 dBm, - 85 dBm, - 95 dBm 3.13 V 3.46 V - 40 C + 105 C Reel
Quectel 蓝牙模块 - 802.15.1 BT 5.0,Bluetooth independent antenna
数据表
Bluetooth 5.0 UART - 92 dBm, - 90 dBm, - 85 dBm, - 95 dBm 3.13 V 3.46 V - 40 C + 105 C Reel
Quectel 蓝牙模块 - 802.15.1 BLE 5.4 standalone module w/ chip antenna in LGA FF, 32 KB RAM, 512 KB flash, 18 GPIOs, transmit power 8 dBm, -40 C to +85 C
数据表
I2C, SPI, USART 8 dBm 97 dBm, 93 dBm, 101 dBm, 106 dBm 1.71 V 3.8 V - 40 C + 85 C Reel