THE BEST SOLUTION 蜂窝模块

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数量 RoHS ECAD模型 系列
频率
输出功率
接口类型
电源电压-最小
电源电压-最大
传输供电电流
接收供电电流
最小工作温度
最大工作温度
天线连接器类型
尺寸
协议 - 蜂窝、Nbiot、LTE
封装
Telit Cinterion 蜂窝模块 LE910C1-NA MODULE 25.21.213
数据表
LE910Cx 200 mW I2C, SPI, UART, USB 3.4 VDC 4.2 VDC - 40 C + 85 C 28.2 mm x 28.2 mm x 2.2 mm 2G, 3G Tray
Telit Cinterion 蜂窝模块 LE910C4-NFD SKU AT&T/VzW/TMO 25.21.564
数据表
200 mW I2C, SPI, UART, USB 3.4 VDC 4.2 VDC - 40 C + 85 C 28.2 mm x 28.2 mm x 2.2 mm 3G Tray
Telit Cinterion 蜂窝模块 LE910C4-NF miniPCIe V3 25.21.663
数据表
200 mW I2C, SPI, UART, USB 3.4 VDC 4.2 VDC - 40 C + 85 C 28.2 mm x 28.2 mm x 2.2 mm 3G Tray
Telit Cinterion 蜂窝模块 FN980m M.2 - 38.03.002 - HW 2.1
数据表
6 GHz 23 dBm USB - 20 C + 55 C RF 30 mm x 50 mm x 3.4 mm Cellular, LTE, 3G/4G/5G Tray
Telit Cinterion 蜂窝模块 ME910G1-WW mPCIe ADAPTER 37.00.413
数据表
23 dBm I2C, SPI, UART, USB 2.6 V 4.5 V - 40 C + 85 C 28.2 mm x 28.2 mm x 2.4 mm LTE, 2G/3G/4G Tray
Telit Cinterion 蜂窝模块 LE910C4-NFD miniPCIe V3 25.21.563
数据表
200 mW I2C, SPI, UART, USB 3.4 VDC 4.2 VDC - 40 C + 85 C 28.2 mm x 28.2 mm x 2.2 mm 3G Tray
Telit Cinterion 蜂窝模块 LE910C1-NF miniPCIe V3 25.21.263
数据表
200 mW I2C, SPI, UART, USB 3.4 VDC 4.2 VDC - 40 C + 85 C 28.2 mm x 28.2 mm x 2.2 mm 3G Tray
Telit Cinterion 蜂窝模块 MV31-W USB ext Dual SIM R2.0
数据表
USB 3.14 V 4.8 V - 40 C + 85 C MHF 42 mm x 30 mm x 2.5 mm LTE, 3G/4G.5G Tray
Telit Cinterion 蜂窝模块 MV31-W USB ext Dual SIM
数据表
USB 3.14 V 4.8 V - 40 C + 85 C MHF 42 mm x 30 mm x 2.5 mm LTE, 3G/4G.5G Tray
Telit Cinterion 蜂窝模块
- 40 C + 85 C Card Edge Connector Tray
Telit Cinterion 蜂窝模块 3G/4G/5G (FR1 bands)

23 dBm, 26 dBm, 29 dBm USB - 40 C + 85 C 52 mm x 30 mm x 2.25 mm Tray
Telit Cinterion LN920A06W04T041400
Telit Cinterion 蜂窝模块

USB 3.1 V 3.6 V - 40 C + 85 C 42 mm x 30 mm x 2.4 mm LTE Tray
u-blox 蜂窝模块 LTE/HSPA+/GSM module for Softbank (JP) Cat 4, B1, B3, B5, B7, B8 PCIe card, 51x30 mm, MOQ 160pcs, on tray
数据表

1.9 GHz 23 dBm GPIO, I2C, UART, USB 3.3 V 3.3 V 880 mA 880 mA - 20 C + 65 C 51 mm x 30 mm x 3.7 mm 2G/3G, LTE
u-blox 蜂窝模块 LTE/HSPA+/GSM module LTE:B1,B3,B5,B7,B8,B28; 3G :B1,B2,B5,B8 PCIe card, 51x30 mm, MOQ 160pcs, on tray
数据表

2.1 GHz 23 dBm GPIO, I2C, UART, USB 3.3 V 3.3 V 880 mA 880 mA - 20 C + 65 C 51 mm x 30 mm x 3.7 mm 2G/3G, LTE
ADLINK Technology M.2 B-KEY LTE HSPA MODULE
ADLINK Technology 蜂窝模块 AirPrime EM7565LTE Cat.12CBRS Disable, USB3.0/2.0Max DL/UL, 600/150 MbpsDimension : 42*30*2.3mmFW: Generic SWI9X50C_01.14.02.00 [002.035_000]Disable B30/48
USB 2.0, USB 3.0 42 mm x 30 mm x 2.3 mm
u-blox 蜂窝模块 LTE Cat 4 only; Japan/NTT docomo LTE: 1,3,5,8,19 PCIe card, 51x30 mm, MOQ 160pcs, on tray
数据表

2.1 GHz 23 dBm GPIO, I2C, UART, USB 3.3 V 3.3 V 880 mA 880 mA - 20 C + 65 C 51 mm x 30 mm x 3.7 mm 2G/3G, LTE
u-blox 蜂窝模块 LTE/Cat M1 NB1 module Cat M1 Australia regional variant LGA, 16x26 mm, 250 pcs/reel
数据表

2.1 GHz 25 dBm SPI, UART, USB 3.8 V 3.8 V 240 mA 240 mA - 20 C + 65 C 26 mm x 16 mm x 2.53 mm LTE
Telit Cinterion 蜂窝模块 LE910C1-LAX 25.30.398
数据表
UART, USB 3.1 VDC 3.6 VDC - 40 C + 85 C 28.2 mm x 28.2 mm x 2.2 mm Tray
Telit Cinterion L30960N6510A13001V
Telit Cinterion 蜂窝模块
Reel
Sequans 蜂窝模块 LTE Cat-6 LCC module for CBRS (band 48) and bands 42/43 enables easy and massive deployment of a wide range of IoT devices on private LTE CBRS networks
数据表
3.5 GHz 23 dBm UART, USB, USIM - 40 C + 85 C 29 mm x 32 mm LTE
Telit Cinterion LEPCIC4AP13T130700
Telit Cinterion 蜂窝模块
- 40 C + 85 C Card Edge Connector Tray
Soracom 蜂窝模块 LTE-M Button Emergency artwork with multi-carrier eSIM (AIR plan01s)
数据表

Box
Telit Cinterion L30960N6250A15001V
Telit Cinterion 蜂窝模块
I2C, SPI 2.6 V 4.8 V - 40 C + 90 C 27.6 mm x 18.8 mm x 2.3 mm NBIoT, LTE Reel
Quectel 蜂窝模块
数据表

Quectel 蜂窝模块 Cat 4 + 3G + 2G, 16MB, Standard version, mPCIe form factor, w/o sim card slot, EMEA + Southeast Asia
数据表

EC200 mPCIe Reel