2.4 GHz 多协议模块

结果: 335
选择 图像 零件编号 制造商 描述 数据表 供货情况 单价(含13%增值税) 根据您的数量,按照单价筛选表格中的结果。 数量 RoHS ECAD模型 系列 频率 输出功率 接口类型 电源电压-最小 电源电压-最大 最小工作温度 最大工作温度 天线连接器类型 尺寸 协议 - 蓝牙、BLE - 802.15.1 协议 - 蜂窝、Nbiot、LTE 协议 - GPS、GLONASS 协议 - Sub GHz 协议 - WiFi - 802.11 协议 - ANT、Thread、Zigbee - 802.15.4 资格 封装
Jorjin 多协议模块 Based on TI WL1831 and supports 802.11b/g/n & BT/BLE 4.2 111库存量
最低: 1
倍数: 1
: 1,800

2.4 GHz 17 dBm SDIO, UART 2.9 V 4.8 V - 20 C + 75 C 12.8 mm x 12 mm x 1.7 mm Bluetooth 802.11 b/g/n Reel, Cut Tape, MouseReel


Espressif Systems 多协议模块 SMD module, ESP32-S3FN8, 8 MB SPI flash, PCB antenna
16,885在途量
最低: 1
倍数: 1
: 650
2.4 GHz 20.5 dBm Camera, GPIO, I2C, I2S, PWM, UART, USB 3 V 3.6 V - 40 C + 85 C PCB 15.4 mm x 20.5 mm x 2.4 mm Bluetooth 5.0 802.11 b/g/n Reel, Cut Tape, MouseReel
Espressif Systems 多协议模块 SMD module, ESP32-S3R2 with 2 MB PSRAM die inside, 8 MB SPI flash, IPEX antenna connector.
6,482预期 2026/8/11
最低: 1
倍数: 1

2.4 GHz 20.5 dBm GPIO, I2C, I2S, SPI, UART 3 V 3.6 V - 40 C + 85 C PCB 19.2 mm x 18 mm x 3.2 mm Bluetooth 5.0 802.11 b/g/n Bulk
Espressif Systems 多协议模块 ESP32-WROOM-32UE integrates ESP32-D0WD-V3, with higher stability and safety performance.
11,690在途量
最低: 1
倍数: 1

ESP32-WROOM-32UE 2.4 GHz 19.5 dBm I2C, I2S, PWM, SDIO, SPI, UART 3 V 3.6 V - 40 C + 85 C External 18 mm x 19 mm x 3.2 mm Bluetooth 4.2
u-blox 多协议模块 ESP32, 802.11bgn+BT, metal antenna, u-connectXpress
3,997在途量
最低: 1
倍数: 1
: 500

NINA-W15 2.4 GHz 8 dBm, 18 dBm GPIO, I2C, I2S, SPI, UART 3 V 3.6 V - 40 C + 85 C u.FL Bluetooth 802.11 b/g/n Reel, Cut Tape
u-blox 多协议模块 ESP32, 802.11bgn+BT, PCB antenna, u-connectXpress
4,422在途量
最低: 1
倍数: 1
: 500

NINA-W15 2.4 GHz 15 dBm GPIO, SPI, UART 3 V 3.6 V - 40 C + 85 C PCB 10 mm x 14 mm x 2.2 mm Bluetooth 4.2 Reel, Cut Tape
Silicon Labs 多协议模块 802.15.4 and Bluetooth Low Energy 5.4 Multiprotocol Wireless Module
8,000预期 2026/10/8
最低: 1
倍数: 1
: 1,000

MGM240P 2.4 GHz 20 dBm I2C, USART 1.8 V 3.8 V - 40 C + 105 C 12.9 mm x 15 mm Bluetooth, BLE 802.15.4 (ANT, Thread, Zigbee) Reel, Cut Tape, MouseReel
CEL 多协议模块 WiFi bgn BT5 BT Mesh PCB Antenna BULK 20库存量
最低: 1
倍数: 1

CMP4010 2.4 GHz 18 dBm GPIO, I2C, I2S, SDIO, SPI, UART, USB 3.3 V 3.3 V PCB 16.7 mm x 26.3 mm Bluetooth 5.0 Mesh 802.11 b/g/n Bulk
CEL 多协议模块 WiFi bgn BT5 BT Mesh RF Connector BULK 20库存量
最低: 1
倍数: 1

CMP4010 2.4 GHz 18 dBm GPIO, I2C, I2S, SDIO, SPI, UART, USB 3.3 V 3.3 V PCB 16.7 mm x 26.3 mm Bluetooth 5.0 Mesh 802.11 b/g/n Bulk
CEL 多协议模块 ZB/Thread/BT, +20dBm, 1.64Mb, Antenna BULK 3库存量
最低: 1
倍数: 1

2.4 GHz 20 dBm ADC, GPIO, I2C, QSPI, SPI, UART, USB 3.3 V 3.3 V - 40 C + 85 C PCB 16.7 mm x 26.3 mm Bluetooth 5.0 Thread, Zigbee Bulk
Ezurio 多协议模块 BL651 Series - Bluetooth v5 Module, Int. Antenna (Nordic nRF52810) Tape & Reel
1,998预期 2026/9/8
最低: 1
倍数: 1
: 1,000

BL651 2.4 GHz 4 dBm GPIO, I2C, SPI, UART 1.7 V 3.6 V - 40 C + 85 C PCB 14 mm x 10 mm x 2.1 mm Bluetooth LE Reel, Cut Tape, MouseReel
Ezurio 多协议模块 BL5340 series - Multi-Core / Protocol Bluetooth + 802.15.4 + NFC Module (Nordic nRF52340) - Integrated Antenna (Cut Tape)
863预期 2026/6/19
最低: 1
倍数: 1

BL5340 2.4 GHz 3 dBm ADC, GPIO, I2C, I2S, SPM, UART, USB 1.7 V 5.5 V - 40 C + 105 C Integrated 15 mm x 10 mm x 2 mm Bluetooth LE NFC 802.15.4 802.15.4 (ANT, Thread, Zigbee) Cut Tape
u-blox 多协议模块 ESP32, 802.11bgn+BT, metal antenna, open CPU
1,496在途量
最低: 1
倍数: 1
: 500

NINA-W10 2.4 GHz I2C, I2S, SPI, UART 3 V 3.6 V - 40 C + 85 C 10 mm x 14 mm x 3.8 mm Reel, Cut Tape
u-blox 多协议模块 ESP32, 802.11bgn+BT, PCB antenna, open CPU
1,000预期 2026/6/25
最低: 1
倍数: 1
: 500

NINA-W10 2.4 GHz 18 dBm GPIO, I2C, I2S, SPI, UART 3 V 3.6 V - 40 C + 85 C PCB 10 mm x 14 mm x 2.2 mm Bluetooth Reel, Cut Tape
Microchip Technology 多协议模块 Wi-Fi + Bluetooth LE Module, Chip Antenna
500在途量
最低: 1
倍数: 1
: 500

2.4 GHz 18.3 dBm I2C, SPI, UART 2.7 V 3.6 V - 40 C + 85 C Chip 22.43 mm x 14.73 mm x 2 mm Bluetooth 5.0 802.11 b/g/n Reel, Cut Tape
Texas Instruments 多协议模块 SimpleLink multipro tocol 2.4-GHz wirele
2,000预期 2026/10/26
最低: 1
倍数: 1
: 2,000

CC2651R3SIPA 2.4 GHz 5 dBm I2C, I2S, SPI, SSI, UART 1.8 V 3.8 V - 40 C + 105 C External, Integrated 7 mm x 7 mm BLE Thread, Zigbee Reel, Cut Tape, MouseReel
Silicon Labs 多协议模块 802.15.4 and Bluetooth Low Energy 5.4 Multiprotocol Wireless Module
500预期 2026/6/16
最低: 1
倍数: 1

MGM240P 2.4 GHz 20 dBm I2C, USART 1.8 V 3.8 V - 40 C + 105 C 12.9 mm x 15 mm Bluetooth, BLE 802.15.4 (ANT, Thread, Zigbee) Cut Tape
Silicon Labs 多协议模块 802.15.4 and Bluetooth Low Energy 5.4 Multiprotocol Wireless Module
1,070预期 2026/9/4
最低: 1
倍数: 1

MGM240P 2.4 GHz 20 dBm I2C, USART 1.8 V 3.8 V - 40 C + 105 C 12.9 mm x 15 mm Bluetooth, BLE 802.15.4 (ANT, Thread, Zigbee) Cut Tape

Silicon Labs 多协议模块 Wireless bluetooth SiP module, Secure Boot with Root of Trust and Secure Loader(RTSL), 78 MHz, 10 dBm
1,300预期 2026/7/10
最低: 1
倍数: 1

xGM240S 2.4 GHz 10 dBm I2C, USART 1.8 V 3.8 V - 40 C + 105 C Built-In, RF 7 mm x 7 mm x 1.18 mm Bluetooth 5.3 802.15.4 (ANT, Thread, Zigbee) Tray
Ezurio 多协议模块 Sterling-LWB SIP, Cut Tape
474预期 2027/2/24
最低: 1
倍数: 1

Sterling-LWB 2.4 GHz 14 dBm UART 1.8 V 3.6 V - 40 C + 85 C RF 15.5 mm x 21 mm x 2 mm Bluetooth LE 802.11 b/g/n Cut Tape
Microchip Technology 多协议模块 Bluetooth Low Energy/15.4 Combo Module with PCB Antenna and extended temperature
144预期 2026/7/24
最低: 1
倍数: 1

2.4 GHz 12 dBm 1.9 V 3.6 V - 40 C + 125 C 7 mm x 7 mm x 0.9 mm Bluetooth Zigbee Tray
Murata Electronics 多协议模块 Type 1DX Shielded ultra-small dual bandWi-Fi 11a/b/g/n/ac Bluetooth 4.1
920预期 2026/6/12
最低: 1
倍数: 1
: 1,000

1DX 2.4 GHz 17 dBm SDIO, UART 1.71 V 3.63 V - 30 C + 70 C External 6.95 mm x 5.15 mm x 1.1 mm Bluetooth 4.1 802.11 b/g/n Reel, Cut Tape, MouseReel
Murata Electronics 多协议模块 Type 2DS Shielded ultra-small dual bandWi-Fi 11a/b/g/n/ac Bluetooth
1,000预期 2026/10/2
最低: 1
倍数: 1
: 500

2DS 2.4 GHz USB 3 V 3.6 V - 40 C + 85 C 25 mm x 14 mm x 2.4 mm Reel, Cut Tape
SparkFun 多协议模块 ESP32-C6 is Espressif s first WiFi 6 SoC integrating 2.4 GHz WiFi 6 Bluetooth 5 (LE) and the 802.15.4 protocol. It features an industry-leading RF performance with reliable security features and multiple memory resources for IoT products. It cons 29库存量
最低: 1
倍数: 1
2.4 GHz GPIO, I2C, I2S, Parallel, SPI, UART 3 V 3.6 V - 40 C + 85 C PCB 19.2 mm x 18 mm x 3.2 mm Bluetooth 5.3, Bluetooth Mesh 802.11 b/g/n/ax Thread, Zigbee
Microchip Technology 多协议模块 Wi-Fi + Bluetooth LE Module, Chip Antenna 交货期 8 周
最低: 1
倍数: 1

2.4 GHz 18.3 dBm I2C, SPI, UART 2.7 V 3.6 V - 40 C + 85 C Chip 22.43 mm x 14.73 mm x 2 mm Bluetooth 5.0 802.11 b/g/n Tray