SPI 多协议模块

结果: 35
选择 图像 零件编号 制造商 描述 数据表 供货情况 单价(含13%增值税) 根据您的数量,按照单价筛选表格中的结果。 数量 RoHS ECAD模型 系列 频率 输出功率 接口类型 电源电压-最小 电源电压-最大 最小工作温度 最大工作温度 天线连接器类型 尺寸 协议 - 蓝牙、BLE - 802.15.1 协议 - WiFi - 802.11 协议 - ANT、Thread、Zigbee - 802.15.4 封装
Insight SiP 多协议模块 nRF52832 LoRa Transceiver & BLE 5 Module AS 61库存量
最低: 1
倍数: 1
920 MHz to 923 MHz, 2.4 GHz 14 dBm SPI 1.8 V 3.6 V - 30 C + 85 C External 9.8 mm x 17.2 mm x 1.7 mm Bluetooth 5.0
Silex Technology 多协议模块 [Sample Pack] Low power version SMT type 802.11ah SDIO Wi-Fi HaLow module using MM6108. 15库存量
最低: 1
倍数: 1

23 dBm SPI - 40 C + 85 C MHF1 18 mm x 17 mm x 2.65 mm 802.11 ah Cut Tape
Insight SiP 多协议模块 nRF52832 LoRa Transceiver & BLE 5 Module AS 121库存量
最低: 1
倍数: 1
: 250
920 MHz to 923 MHz, 2.4 GHz 14 dBm SPI 1.8 V 3.6 V - 30 C + 85 C External 9.8 mm x 17.2 mm x 1.7 mm Bluetooth 5.0 Reel, Cut Tape
Espressif Systems 多协议模块 SMD Module, ESP32-H2FH2S, Chip revision v1.2 and above, 2 MB SPI flash, PCB antenna, -40 C +105 C Required ESP-IDF version: v5.1.6 and v5.2.5, v5.3.3 (expected on 3/27), v5.4.1 (expected on 4/4), and above 851库存量
3,250预期 2026/7/14
最低: 1
倍数: 1

2.402 GHz to 2.48 GHz 20 dBm SPI 3 V 3.6 V - 40 C + 105 C 16.6 mm x 13.2 mm x 2.4 mm Bluetooth, BLE 802.15.4 (ANT, Thread, Zigbee)
Espressif Systems 多协议模块 SMD Module, ESP32-H2FH4S, Chip revision v1.2 and above, 4 MB SPI flash, PCB antenna, -40 C +105 C. Required ESP-IDF version: v5.1.6 and v5.2.5, v5.3.3 (expected on 3/27), v5.4.1 (expected on 4/4), and above 3,080库存量
最低: 1
倍数: 1

2.402 GHz to 2.48 GHz 20 dBm SPI 3 V 3.6 V - 40 C + 105 C 16.6 mm x 13.2 mm x 2.4 mm Bluetooth, BLE 802.15.4 (ANT, Thread, Zigbee)
Seeed Studio 多协议模块 XIAO ESP32S3 & Wio-SX1262 Kit with 3D case for Meshtastic & LoRa 101库存量
23预期 2026/6/9
最低: 1
倍数: 1

XIAO 862 MHz to 930 MHz 22 dBm SPI 1.8 V 3.6 V - 40 C + 85 C 11.6 m x 11 mm x 2.95 mm
Murata Electronics 多协议模块 RF TXRX MODULE 5.4/WIFI 6 90库存量
最低: 1
倍数: 1
: 1,000

17 dBm SPI 1.71 V 3.46 V - 40 C + 85 C 8.8 mm x 7.7 mm x 1.3 mm 802.11 a/b/g/n/ac/ax Reel, Cut Tape
Espressif Systems 多协议模块 ESP32-C6-MINI-1 is a ESP32-C6 based module, which supports Wi-Fi 6 in 2.4 GHz band, Bluetooth 5, Zigbee 3.0 and Thread. It's small-sized and pin-to-pin compatible with the ESP32-C3-MINI series module. With low power consumption, it is an ideal choice 5,060库存量
650预期 2026/5/26
最低: 1
倍数: 1

160 MHz SPI 3 V 3.6 V - 40 C + 105 C 16.6 mm x 13.2 mm x 2.4 mm
Espressif Systems 多协议模块 ESP32-C6-MINI-1 is a ESP32-C6 based module, which supports Wi-Fi 6 in 2.4 GHz band, Bluetooth 5, Zigbee 3.0 and Thread. It's small-sized and pin-to-pin compatible with the ESP32-C3-MINI series module. With low power consumption, it is an ideal choice 5,559库存量
4,550预期 2026/6/22
最低: 1
倍数: 1
: 3,250

2.4 GHz SPI 3 V 3.6 V - 40 C + 85 C 16.6 mm x 13.2 mm x 2.4 mm Reel, Cut Tape, MouseReel
u-blox 多协议模块 IW611, 802.11ax+BT, 2 U.FL connectors 444库存量
1,000预期 2026/8/27
最低: 1
倍数: 1
: 500

MAYA-W2 18 dBm SPI - 40 C + 85 C u.FL 14.3 mm x 10.4 mm x 1.9 mm Reel, Cut Tape
u-blox 多协议模块 IW611, 802.11ax+BT, 1 PCB antenna or antenna pin 529库存量
1,500预期 2026/8/17
最低: 1
倍数: 1
: 500

MAYA-W2 18 dBm SPI - 40 C + 85 C PCB Antenna 14.3 mm x 10.4 mm x 1.9 mm Reel, Cut Tape
Silex Technology 多协议模块 [Bulk SKU] Low power version SMT type 802.11ah SDIO Wi-Fi HaLow module using MM6108. 500库存量
最低: 500
倍数: 500
: 500

23 dBm SPI - 40 C + 85 C MHF1 18 mm x 17 mm x 2.65 mm 802.11 ah Reel
Embedded Artists 多协议模块 2DL M.2 Module 3库存量
最低: 1
倍数: 1

2.4 GHz to 5 GHz SPI 3 V 3.6 V - 40 C + 85 C Bulk
Murata Electronics 多协议模块 BT 5.4/WIFI 6 3库存量
1,000预期 2026/10/20
最低: 1
倍数: 1
: 1,000

17 dBm SPI 1.71 V 3.46 V - 40 C + 85 C 8.8 mm x 7.7 mm x 1.3 mm 802.11 a/b/g/n/ac/ax Reel, Cut Tape
Espressif Systems 多协议模块 ESP32-S3-WROOM-2 is based on ESP32-S3R16V, with flash memory of Octal 32 MB and PSRAM memory of 16 MB. It provides acceleration for neural network computing and signal processing workloads.
9,653在途量
最低: 1
倍数: 1
: 650

2.412 GHz to 2.484 GHz SPI 3 V 3.6 V - 40 C + 65 C 25.5 mm x 18 mm x 3.1 mm Bluetooth 802.11 b/g/n Reel, Cut Tape
Insight SiP 多协议模块 nRF52832 LoRa Transceiver & BLE 5 Module EU
692在途量
最低: 1
倍数: 1
ISP4520 863 MHz to 870 MHz, 2.4 GHz 14 dBm SPI 1.8 V 3.6 V - 30 C + 85 C External 9.8 mm x 17.2 mm x 1.7 mm Bluetooth 5.0 Tray
Embedded Artists 多协议模块 2EL M.2 Wi-Fi 6 a/b/g/n/ac/ax, Bluetooth 5.3 with IW612 chipset and LBES5PL2EL
41预期 2026/6/5
最低: 1
倍数: 1

2.4 GHz to 2.484 GHz 2.6 dBm SPI - 40 C + 85 C 802.11 a/b/g/n/ac/ax Bulk
u-blox 多协议模块 IW611, 802.11ax+BT, 2 antenna pins
1,000预期 2026/8/6
最低: 1
倍数: 1
: 500

MAYA-W2 18 dBm SPI - 40 C + 85 C 14.3 mm x 10.4 mm x 1.9 mm Reel, Cut Tape
u-blox 多协议模块 IW612, 802.11ax+BT+802.15.4, 2 antenna pins
500在途量
最低: 1
倍数: 1
: 500

MAYA-W2 18 dBm SPI - 40 C + 85 C 14.3 mm x 10.4 mm x 1.9 mm Reel, Cut Tape
u-blox 多协议模块 IW612, 802.11ax+BT+802.15.4, 1 PCB antenna or ant. pin
980在途量
最低: 1
倍数: 1
: 500

MAYA-W2 18 dBm SPI - 40 C + 85 C PCB Antenna 14.3 mm x 10.4 mm x 1.9 mm Reel, Cut Tape, MouseReel
Murata Electronics 多协议模块 Shielded Small Wi-Fi 11a/b/g/n/ac/ax + Bluetooth 5.3 Module Type 2EL
3,993在途量
最低: 1
倍数: 1
: 1,000

2EL 2.4 GHz, 5.8 GHz 20 dBm SPI 1.71 V 3.46 V - 40 C + 85 C 8.8 mm x 7.7 mm x 1.3 mm Bluetooth 5.3 802.11 a/b/g/n/ac/ax Reel, Cut Tape, MouseReel
Murata Electronics 多协议模块 Type 2FR module
975预期 2026/11/3
最低: 1
倍数: 1
: 1,000

2FR 2.484 GHz 18 dBm SPI 3.14 V 3.46 V - 40 C + 85 C 12 mm x 11 mm x 1.5 mm Reel, Cut Tape

Murata Electronics 多协议模块 Type 2BP NXP SR150 UWB MODULE
999预期 2026/9/23
最低: 1
倍数: 1
: 1,000

UWB 6.25 GHz to 8.25 GHz SPI - 30 C + 85 C 6.6 mm x 5.8 mm x 1.2 mm Reel, Cut Tape
Insight SiP 多协议模块 ISP3010-UX nRF52832 BLE 5 Module 无库存
最低: 250
倍数: 250
: 250
2.4 GHz to 2.8 GHz SPI 1.8 V 6 V - 40 C + 85 C 14 mm x 14 mm x 1.5 mm BLE Reel
Insight SiP 多协议模块 ISP3010-UX nRF52832 BLE 5 Module 无库存
最低: 500
倍数: 500
: 500
2.4 GHz to 2.8 GHz SPI 1.8 V 6 V - 40 C + 85 C 14 mm x 14 mm x 1.5 mm BLE Reel