结果: 274
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数量 RoHS ECAD模型 系列
频率
输出功率
接口类型
电源电压-最小
电源电压-最大
最小工作温度
最大工作温度
天线连接器类型
尺寸
协议 - 蓝牙、BLE - 802.15.1
协议 - 蜂窝、Nbiot、LTE
协议 - GPS、GLONASS
协议 - Sub GHz
协议 - WiFi - 802.11
协议 - ANT、Thread、Zigbee - 802.15.4
封装
NXP Semiconductors 多协议模块 IW610CUK/A1ZDI
数据表
更多信息可用

IW610CUK 2.4 GHz, 5 GHz 23 dBm SDIO, SPI, UART, USB 3.14 V 3.46 V - 40 C + 125 C Bluetooth, BLE - 802.15.4 WiFi 6 Reel, Cut Tape
NXP Semiconductors 多协议模块 IW610FHN/A1ZDI
数据表
更多信息可用

IW610FHN 2.4 GHz, 5 GHz 23 dBm SDIO, SPI, UART, USB 3.14 V 3.46 V - 40 C + 125 C Bluetooth, BLE WiFi 6 Reel, Cut Tape
NXP Semiconductors 多协议模块 IW610FUK/A1ZDI
数据表
更多信息可用

IW610FUK 2.4 GHz, 5 GHz 23 dBm SDIO, SPI, UART, USB 3.14 V 3.46 V - 40 C + 125 C Bluetooth, BLE WiFi 6 Reel, Cut Tape
NXP Semiconductors 多协议模块 IW610GUK/A1ZDI
数据表
更多信息可用

IW610GUK 2.4 GHz, 5 GHz 23 dBm SDIO, SPI, UART, USB 3.14 V 3.46 V - 40 C + 125 C Bluetooth, BLE - 802.15.4 WiFi 6 Reel, Cut Tape
Microchip Technology 多协议模块 Wi-Fi + Bluetooth LE Module, Chip Antenna
数据表

2.412 GHz to 2.484 GHz 18.3 dBm SPI 2.7 V 3.6 V - 40 C + 85 C 22.4 mm x 14.7 mm x 2 mm Bluetooth Tray
Microchip Technology 多协议模块 Wi-Fi + Bluetooth LE Module, Chip Antenna
数据表

2.412 GHz to 2.484 GHz 18.3 dBm SPI 2.7 V 3.6 V - 40 C + 85 C 22.4 mm x 14.7 mm x 2 mm Bluetooth Reel
Microchip Technology 多协议模块 Wi-Fi + Bluetooth LE Module,u.FL Antenna
数据表

2.412 GHz to 2.484 GHz 18.3 dBm SPI 2.7 V 3.6 V - 40 C + 85 C 22.4 mm x 14.7 mm x 2 mm Bluetooth Tray
Microchip Technology 多协议模块 Wi-Fi + Bluetooth LE Module,u.FL Antenna
数据表

2.412 GHz to 2.484 GHz 18.3 dBm SPI 2.7 V 3.6 V - 40 C + 85 C 22.4 mm x 14.7 mm x 2 mm Bluetooth Reel
Silicon Labs 多协议模块 Mighty Gecko lighting module, +12 dBm, 2.4 GHz, 1 MB Flash, -40 to 125 C, PCB trace antenna, certified.
数据表

2.4 GHz 12.5 dBm I2C, UART 1.8 V 3.8 V - 40 C + 125 C 22.5 mm x 15.5 mm x 2.25 mm Bluetooth Thread, Zigbee Cut Tape
Silicon Labs 多协议模块 Mighty Gecko lighting module, +12 dBm, 2.4 GHz, 1 MB Flash, -40 to 125 C, PCB trace antenna, certified.
数据表

2.4 GHz 12.5 dBm I2C, UART 1.8 V 3.8 V - 40 C + 125 C 22.5 mm x 15.5 mm x 2.25 mm Thread, Zigbee Reel
Silicon Labs 多协议模块 Mighty Gecko lighting module, +12 dBm, 2.4 GHz, 1 MB Flash, -40 to 105 C, PCB trace antenna, certified.
数据表

2.4 GHz 12.5 dBm I2C, UART 1.8 V 3.8 V - 40 C + 105 C 22.5 mm x 15.5 mm x 2.25 mm Bluetooth Thread, Zigbee Cut Tape
Silicon Labs 多协议模块 Mighty Gecko lighting module, +12 dBm, 2.4 GHz, 1 MB Flash, -40 to 105 C, PCB trace antenna, certified.
数据表

2.4 GHz 12.5 dBm I2C, UART 1.8 V 3.8 V - 40 C + 105 C 22.5 mm x 15.5 mm x 2.25 mm Thread, Zigbee Reel
Silicon Labs 多协议模块 802.15.4 and Bluetooth Low Energy 5.4 Multiprotocol Wireless Module
数据表

MGM260P 2.4 GHz 10 dBm ADC, GPIO, I2C, I2S, IrDA, JTAG, SPI, UART, USART 1.8 V 3.8 V - 40 C + 125 C 12.9 mm x 15 mm Bluetooth, BLE Reel
Silicon Labs 多协议模块 802.15.4 and Bluetooth Low Energy 5.4 Multiprotocol Wireless Module
数据表

MGM260P 2.4 GHz 20 dBm ADC, GPIO, I2C, I2S, IrDA, JTAG, SPI, UART, USART 1.8 V 3.8 V - 40 C + 125 C 12.9 mm x 15 mm Bluetooth, BLE Reel
Silicon Labs 多协议模块 802.15.4 and Bluetooth Low Energy 5.4 Multiprotocol Wireless Module
数据表

MGM260P 2.4 GHz 20 dBm ADC, GPIO, I2C, I2S, IrDA, JTAG, SPI, UART, USART 1.8 V 3.8 V - 40 C + 125 C 12.9 mm x 15 mm Bluetooth, BLE Reel
Silicon Labs 多协议模块 802.15.4 and Bluetooth Low Energy 5.4 Multiprotocol Wireless Module
数据表

MGM260P 2.4 GHz 10 dBm ADC, GPIO, I2C, I2S, IrDA, JTAG, SPI, UART, USART 1.8 V 3.8 V - 40 C + 125 C 12.9 mm x 15 mm Bluetooth, BLE Reel
Silicon Labs 多协议模块 802.15.4 and Bluetooth Low Energy 5.4 Multiprotocol Wireless Module
数据表

MGM260P 2.4 GHz 20 dBm ADC, GPIO, I2C, I2S, IrDA, JTAG, SPI, UART, USART 1.8 V 3.8 V - 40 C + 125 C 12.9 mm x 15 mm Bluetooth, BLE Reel
Silicon Labs 多协议模块 802.15.4 and Bluetooth Low Energy 5.4 Multiprotocol Wireless Module
数据表

MGM260P 2.4 GHz 20 dBm ADC, GPIO, I2C, I2S, IrDA, JTAG, SPI, UART, USART 1.8 V 3.8 V - 40 C + 125 C 12.9 mm x 15 mm Bluetooth, BLE Reel
Panasonic 多协议模块 PAN9028 mSDIO Adapter with module (NXP 88W8977)
数据表

PAN9028 mSDIO Dongle 2.4 GHz, 5 GHz 16 dBm UART 3.3 V 3.3 V - 30 C + 85 C Chip 24 mm x 12 mm x 2.8 mm Bluetooth 5.2 802.11 a/b/g/n/ac Bulk
NXP Semiconductors 多协议模块 AW693PHNB/A1ZDB

2.4 GHz, 5 GHz to 7 GHz UART 11 mm x 11 mm x 0.85 mm Bluetooth 5.3 Wi-Fi 6/6E Tray
NXP Semiconductors 多协议模块 IW610BHN/A1ZDI
数据表

IW610BHN 2.4 GHz, 5 GHz 23 dBm SDIO, SPI, UART, USB 3.14 V 3.46 V - 40 C + 125 C Bluetooth, BLE WiFi 6 Reel
NXP Semiconductors 多协议模块 IW610CHN/A1ZDI
数据表

IW610CHN 2.4 GHz, 5 GHz 23 dBm SDIO, SPI, UART, USB 3.14 V 3.46 V - 40 C + 125 C Bluetooth, BLE - 802.15.4 WiFi 6 Reel
NXP Semiconductors 多协议模块 IW610FHN/A1ZDI
数据表

IW610FHN 2.4 GHz, 5 GHz 23 dBm SDIO, SPI, UART, USB 3.14 V 3.46 V - 40 C + 125 C Bluetooth, BLE WiFi 6 Tray
NXP Semiconductors 多协议模块 IW610GHN/A1ZDI
数据表

IW610GHN 2.4 GHz, 5 GHz 23 dBm SDIO, SPI, UART, USB 3.14 V 3.46 V - 40 C + 125 C Bluetooth, BLE - 802.15.4 WiFi 6 Reel, Cut Tape
Olimex Ltd. 多协议模块 ESP32-WROOM-32 WIFI/BLE module

2 W - 40 C + 85 C U.FL 98 mm x 28 mm