多协议模块

结果: 699
选择 图像 零件编号 制造商 描述 数据表 供货情况 单价(含13%增值税) 根据您的数量,按照单价筛选表格中的结果。 数量 RoHS ECAD模型 系列 频率 输出功率 接口类型 电源电压-最小 电源电压-最大 最小工作温度 最大工作温度 天线连接器类型 尺寸 协议 - 蓝牙、BLE - 802.15.1 协议 - 蜂窝、Nbiot、LTE 协议 - GPS、GLONASS 协议 - Sub GHz 协议 - WiFi - 802.11 协议 - ANT、Thread、Zigbee - 802.15.4 资格 封装
Nordic Semiconductor 多协议模块 Low Power Cellular IoT SIP, LTE-M, NB-IoT, GNSS wireless modem
2,500预期 2026/12/25
最低: 1
倍数: 1
: 2,500

700 MHz to 2.2 GHz 23 dBm I2C, I2S, SPI, UART 3 V 5.5 V - 40 C + 85 C 16 mm x 10.5 mm x 1.04 mm DECT NR+, LTE Cat-M1/NB1/NB2 GPS, QZSS Reel, Cut Tape
CEL 多协议模块 RTL8721, Dual Band, WiFi+BLE, MFH4, BULK 5库存量
最低: 1
倍数: 1

CMP4020 2.4 GHz, 5 GHz 18 dBm GPIO, I2C, I2S, SDIO, SPI, UART, USB 3 V 3.6 V - 40 C + 85 C Bluetooth 5.1 Bulk
CEL 多协议模块 CMP4020-2 BULK 20库存量
最低: 1
倍数: 1

CMP4020 2.4 GHz, 5 GHz 18 dBm GPIO, I2C, I2S, SDIO, SPI, UART, USB 3 V 3.6 V - 40 C + 85 C Bluetooth 5.1 Bulk
CEL 多协议模块 CMP4020-3 BULK 50库存量
最低: 1
倍数: 1

CMP4020 2.4 GHz, 5 GHz 18 dBm GPIO, I2C, I2S, SDIO, SPI, UART, USB 3 V 3.6 V - 40 C + 85 C Bluetooth 5.1 Bulk
CEL 多协议模块 ZB/Thread/BT, +20dBm, 1.64Mb, Antenna BULK 3库存量
最低: 1
倍数: 1

2.4 GHz 20 dBm ADC, GPIO, I2C, QSPI, SPI, UART, USB 3.3 V 3.3 V - 40 C + 85 C PCB 16.7 mm x 26.3 mm Bluetooth 5.0 Thread, Zigbee Bulk
Silicon Labs 多协议模块 802.11 b/g/n dual-band (2.4/5 GHz), dual-mode Bluetooth 5 Wi-Fi Modules
2,360预期 2026/10/16
最低: 1
倍数: 1

2.4 GHz, 5 GHz 18 dBm SDIO, UART, USB 1.85 V 3.3 V - 40 C + 85 C External 9.8 mm x 9.1 mm x 1.6 mm Bluetooth 5.0 802.11 a/b/g/n Tray
Ezurio 多协议模块 BL651 Series - Bluetooth v5 Module, Int. Antenna (Nordic nRF52810) Tape & Reel
1,998预期 2026/9/8
最低: 1
倍数: 1
: 1,000

BL651 2.4 GHz 4 dBm GPIO, I2C, SPI, UART 1.7 V 3.6 V - 40 C + 85 C PCB 14 mm x 10 mm x 2.1 mm Bluetooth LE Reel, Cut Tape, MouseReel
Ezurio 多协议模块 Module, Sterling LWB5+, MHF4
700预期 2026/10/16
最低: 1
倍数: 1
: 1,000

Sterling-LWB5+ 2.4 GHz, 5 GHz UART, USB 3.3 V 3.3 V - 40 C + 85 C 12 mm x 17 mm x 2.2 mm Bluetooth 5.2, Bluetooth LE WiFi 5, 802.11 ac Reel, Cut Tape, MouseReel
Ezurio 多协议模块 BL5340 series - Multi-Core / Protocol Bluetooth + 802.15.4 + NFC Module (Nordic nRF52340) - Integrated Antenna (Cut Tape)
863预期 2026/6/23
最低: 1
倍数: 1

BL5340 2.4 GHz 3 dBm ADC, GPIO, I2C, I2S, SPM, UART, USB 1.7 V 5.5 V - 40 C + 105 C Integrated 15 mm x 10 mm x 2 mm Bluetooth LE NFC 802.15.4 802.15.4 (ANT, Thread, Zigbee) Cut Tape
Ezurio 多协议模块 Module, Sona NX611, MIMO, M.2 2230, 2 x MHF4, Tray
107预期 2026/7/3
最低: 1
倍数: 1

Sona NX611 2.4 GHz, 5 GHz UART 1.8 V 3.3 V - 40 C + 85 C MHF4 Bluetooth 5.4, Bluetooth LE WiFi 6 Tray
Ezurio 多协议模块 Module, Sona IF513, Antenna Diversity, M.2, Key E, SDIO, UART
200预期 2026/8/17
最低: 1
倍数: 1

Sona IF513 2.4 GHz, 5 GHz, 6 GHz 17 dBm SDIO, UART 3.13 V 3.5 V - 40 C + 85 C MHF4L 30 mm x 22 mm x 3.1 mm Bluetooth 5.4, Bluetooth LE WiFi 6E, 802.11 a/b/g/n/ax Tray
Ezurio 多协议模块 Module, BL54H20, Bluetooth LE, Chip Antenna, Tape and Reel
985预期 2026/7/21
最低: 1
倍数: 1
: 1,000

BL54H20 UART 1.71 V 1.98 V - 40 C + 105 C Chip 13.5 mm x 10 mm x 1.8 mm Bluetooth 5.4 802.15.4 Reel, Cut Tape
Ezurio 多协议模块 Module, BL54H20, Bluetooth LE, MHF4, Tape and Reel
986预期 2026/7/21
最低: 1
倍数: 1
: 1,000

BL54H20 UART 1.71 V 1.98 V - 40 C + 105 C MHF4 13.5 mm x 10 mm x 1.8 mm Bluetooth 5.4 802.15.4 Reel, Cut Tape
Espressif Systems 多协议模块 SMD module, ESP32-S3R8 with 8 MB Octal PSRAM die inside, 8 MB Quad SPI flash, IPEX antenna connector 2,525库存量
7,800在途量
最低: 1
倍数: 1
: 650

2.4 GHz 20.5 dBm GPIO, I2C, I2S, SPI, UART 3 V 3.6 V - 40 C + 65 C PCB 19.2 mm x 18 mm x 3.2 mm Bluetooth 5.0 802.11 b/g/n Reel, Cut Tape
u-blox 多协议模块 IW611, 802.11ax+BT, 2 antenna pins
1,000预期 2026/8/6
最低: 1
倍数: 1
: 500

MAYA-W2 18 dBm SPI - 40 C + 85 C 14.3 mm x 10.4 mm x 1.9 mm Reel, Cut Tape
u-blox 多协议模块 IW612, 802.11ax+BT+802.15.4, 1 PCB antenna or ant. pin
500预期 2026/6/18
最低: 1
倍数: 1
: 500

MAYA-W2 18 dBm SPI - 40 C + 85 C PCB Antenna 14.3 mm x 10.4 mm x 1.9 mm Reel, Cut Tape, MouseReel
u-blox 多协议模块 ESP32, 802.11bgn+BT, metal antenna, open CPU
1,486在途量
最低: 1
倍数: 1
: 500

NINA-W10 2.4 GHz I2C, I2S, SPI, UART 3 V 3.6 V - 40 C + 85 C 10 mm x 14 mm x 3.8 mm Reel, Cut Tape
u-blox 多协议模块 ESP32, 802.11bgn+BT, PCB antenna, open CPU
973预期 2026/6/26
最低: 1
倍数: 1
: 500

NINA-W10 2.4 GHz 18 dBm GPIO, I2C, I2S, SPI, UART 3 V 3.6 V - 40 C + 85 C PCB 10 mm x 14 mm x 2.2 mm Bluetooth Reel, Cut Tape
Microchip Technology 多协议模块 Wi-Fi + Bluetooth LE Module, Chip Antenna
500在途量
最低: 1
倍数: 1
: 500

2.4 GHz 18.3 dBm I2C, SPI, UART 2.7 V 3.6 V - 40 C + 85 C Chip 22.43 mm x 14.73 mm x 2 mm Bluetooth 5.0 802.11 b/g/n Reel, Cut Tape
Texas Instruments 多协议模块 SimpleLink multipro tocol 2.4-GHz wirele
2,000预期 2026/10/26
最低: 1
倍数: 1
: 2,000

CC2651R3SIPA 2.4 GHz 5 dBm I2C, I2S, SPI, SSI, UART 1.8 V 3.8 V - 40 C + 105 C External, Integrated 7 mm x 7 mm BLE Thread, Zigbee Reel, Cut Tape, MouseReel
Silicon Labs 多协议模块 802.15.4 and Bluetooth Low Energy 5.4 Multiprotocol Wireless Module
1,069预期 2026/9/4
最低: 1
倍数: 1

MGM240P 2.4 GHz 20 dBm I2C, USART 1.8 V 3.8 V - 40 C + 105 C 12.9 mm x 15 mm Bluetooth, BLE 802.15.4 (ANT, Thread, Zigbee) Cut Tape

Silicon Labs 多协议模块 Wireless bluetooth SiP module, Secure Boot with Root of Trust and Secure Loader(RTSL), 78 MHz, 10 dBm
1,300预期 2026/7/22
最低: 1
倍数: 1

xGM240S 2.4 GHz 10 dBm I2C, USART 1.8 V 3.8 V - 40 C + 105 C Built-In, RF 7 mm x 7 mm x 1.18 mm Bluetooth 5.3 802.15.4 (ANT, Thread, Zigbee) Tray
Silicon Labs 多协议模块 SiWG917Y SoC Module Wi-Fi 6 2.4 GHz Bluetooth LE 5.4 No Antenna, 2MB PSRAM in package
400在途量
最低: 1
倍数: 1

SIWG917Y I2C, SPI, UART, USART 1.71 V 3.63 V - 40 C + 85 C Cut Tape
DFRobot 多协议模块 Gravity: CAT1 SIM7600G Global 4G Communication and GNSS Positioning Module (10Mbps/5Mbps)
1预期 2026/6/25
最低: 1
倍数: 1

1.9 GHz 5 V 12 V - 40 C + 85 C 60 mm x 52 mm GPS, BD, GLONASS Bulk
Ezurio 多协议模块 Sterling-LWB SIP, Cut Tape
474预期 2026/7/3
最低: 1
倍数: 1

Sterling-LWB 2.4 GHz 14 dBm UART 1.8 V 3.6 V - 40 C + 85 C RF 15.5 mm x 21 mm x 2 mm Bluetooth LE 802.11 b/g/n Cut Tape