多协议模块

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数量 RoHS ECAD模型 系列
频率
输出功率
接口类型
电源电压-最小
电源电压-最大
最小工作温度
最大工作温度
天线连接器类型
尺寸
协议 - 蓝牙、BLE - 802.15.1
协议 - 蜂窝、Nbiot、LTE
协议 - GPS、GLONASS
协议 - Sub GHz
协议 - WiFi - 802.11
协议 - ANT、Thread、Zigbee - 802.15.4
资格
封装
Silex Technology 多协议模块 [Sample Pack] SX-PCEBE-M2-SP is a Wi-Fi7 2x2 Tri-band IEEE802.11 be WLAN, Bluetooth 5.3 BR/EDR/HS/LE module in a M.2 card form factor (M.2 Card Type 2230-S3-A-E). It is based on Qualcomm's QCC2076 chipset. This is ideal for low quantity purchases fo
数据表

SX-PCEBE 2.4 GHz, 5 GHz, 6 GHz USB - 40 C + 85 C MHF4 Bluetooth WiFi Bulk
Silex Technology 多协议模块 [Bulk SKU] SX-PCEBE-SMT is a Wi-Fi7 2x2 Tri-band IEEE802.11 be WLAN, Bluetooth 5.3 BR/EDR/HS/LE module in an M.2 LGA Type 1620 Surface Mount form factor. It is based on Qualcomm's QCC2076 chipset.
数据表

SX-PCEBE 2.4 GHz, 5 GHz, 6 GHz USB - 40 C + 85 C MHF4 Bluetooth WiFi Reel
Silex Technology 多协议模块 [Sample Pack] SX-PCEBE-SMT-SP is a Wi-Fi 7 2x2 Tri-band IEEE802.11 be WLAN, Bluetooth 5.3 BR/EDR/HS/LE module in an M.2 LGA Type 1620 Surface Mount form factor. It is based on Qualcomm's QCC2076 chipset. This is ideal for low quantity purchases for e
数据表

SX-PCEBE 2.4 GHz, 5 GHz, 6 GHz USB - 40 C + 85 C MHF4 Bluetooth WiFi Cut Tape
Quectel 多协议模块
2.5 GHz, 5 GHz ADC, eDP, GPIO, I2C, MIPI-CSI, MIPI-DSI, LVDS, PWM, SPI, UART, USB 2.0, USB 3.0 3.3 V 3.5 V - 40 C + 85 C 46 mm x 42 mm x 3.15 mm Bluetooth 4.2 802.11 a/b/g/n/ac
Quectel 多协议模块 No connectivity. 1+8GB - Industrial temperature range(EAU >2000pcs)
数据表
2.5 GHz, 5 GHz ADC, eDP, GPIO, I2C, MIPI-CSI, MIPI-DSI, LVDS, PWM, SPI, UART, USB 2.0, USB 3.0 3.3 V 3.5 V - 40 C + 85 C 46 mm x 42 mm x 3.15 mm Bluetooth 4.2 802.11 a/b/g/n/ac Reel
Quectel 多协议模块
2.5 GHz, 5 GHz ADC, eDP, GPIO, I2C, MIPI-CSI, MIPI-DSI, LVDS, PWM, SPI, UART, USB 2.0, USB 3.0 3.3 V 3.5 V - 40 C + 85 C 46 mm x 42 mm x 3.15 mm Bluetooth 4.2 802.11 a/b/g/n/ac
Quectel 多协议模块 No connectivity. 2+16GB - Industrial temperature range(EAU >2000pcs)
数据表
2.5 GHz, 5 GHz ADC, eDP, GPIO, I2C, MIPI-CSI, MIPI-DSI, LVDS, PWM, SPI, UART, USB 2.0, USB 3.0 3.3 V 3.5 V - 40 C + 85 C 46 mm x 42 mm x 3.15 mm Bluetooth 4.2 802.11 a/b/g/n/ac Reel
Quectel 多协议模块
2.5 GHz, 5 GHz ADC, eDP, GPIO, I2C, MIPI-CSI, MIPI-DSI, LVDS, PWM, SPI, UART, USB 2.0, USB 3.0 3.3 V 3.5 V - 40 C + 85 C 46 mm x 42 mm x 3.15 mm Bluetooth 4.2 802.11 a/b/g/n/ac
Quectel 多协议模块 Wi-Fi /BT variant. 2+16GB - Industrial temperature range(EAU >2000pcs)
数据表
2.5 GHz, 5 GHz ADC, eDP, GPIO, I2C, MIPI-CSI, MIPI-DSI, LVDS, PWM, SPI, UART, USB 2.0, USB 3.0 3.5 V 3.5 V - 40 C + 85 C 46 mm x 42 mm x 3.15 mm Bluetooth 4.2 802.11 a/b/g/n/ac Reel
Quectel 多协议模块 cloud enabled, Wi-Fi 4, 2.4GHz, BLE 5.2, Antenna: IPEX-1, -40 85C, 2MB flash
数据表
2.4 GHz UART 3 V 3.6 V - 40 C + 85 C IPEX-1 24 mm x 16 mm x 2.6 mm BLE 5.2 802.11 b/g/n Reel
Quectel 多协议模块 cloud enabled, Wi-Fi 4, 2.4GHz, BLE 5.2, Antenna: PCB, -40 85C, 2MB flash
数据表
2.4 GHz UART 3 V 3.6 V - 40 C + 85 C PCB 24 mm x 16 mm x 2.6 mm BLE 5.2 802.11 b/g/n Reel
Quectel 多协议模块 cloud enabled, Wi-Fi 4, 2.4GHz, BLE 5.2, Antenna: PCB, extended temp -40 105C, 4MB flash
数据表
2.4 GHz UART 3 V 3.6 V - 40 C + 105 C PCB 24 mm x 16 mm x 2.6 mm BLE 5.2 802.11 b/g/n Reel
Quectel 多协议模块 Dual-band Wi-Fi 6e module, supporting Bluetooth 5.4,2.4 GHz + 5 GHz + 6 GHz,-45 C +85 C
数据表

FCS963N-LP 2.4 GHz, 5 GHz 7.5 dBm, 19 dBm UART 3 V 4.8 V - 40 C + 85 C 12 mm x 12 mm x 1.55 mm Bluetooth Wi-Fi Reel
Quectel 多协议模块 Wi-Fi 6, 2.4GHz, BLE5.2, RISC-V, ACK SDK for Matter, 4MB Flash, 512 KB SRAM, PCB antenna, -40C to 105C
数据表
2.4 GHz UART 3 V 3.6 V - 40 C + 105 C 17.3 mm x 15 mm x 2.8 mm BLE 5.2 802.11 b/g/n/ax Reel
Quectel 多协议模块
2.4 GHz UART 3 V 3.6 V - 40 C + 105 C 17.3 mm x 15 mm x 2.8 mm BLE 5.2 802.11 b/g/n/ax
Quectel 多协议模块 Wi-Fi 6, 802.11a/ b/ g/ n/ ac/ ax, 2 2 (2T2R), 2.4/ 5 GHz dual-band, PCIe interface, 2 antennas (BT 5.2 shares 1 Wi-Fi antenna), -40 C to +85 C, M.2 FF
数据表
2.4 GHz, 5 GHz PCIe, UART 3 V 3.6 V - 40 C + 85 C 22 mm x 30 mm x 2.85 mm Bluetooth 5.2 802.11a/b/g/n/ac/ax Tray
Quectel 多协议模块 Wi-Fi 4, 2.4GHz, BLE 5.2, Antenna: Pin, extended temp -40-105C, 2MB flash
2.4 GHz - 40 C + 105 C Reel
Quectel 多协议模块 Wi-Fi 4, 2.4GHz, BLE 5.2, Antenna: IPEX-1, extended temp -40-105C, 2MB flash
2.4 GHz - 40 C + 105 C BLE 5.2 Reel
Quectel 多协议模块 Wi-Fi 6, single band 2.4GHz, BLE 5.1, Antenna: LCC, -40 85C, 8MB flash
数据表
2.4 GHz ADC, I2C, I2S, PWM, SPI, UART 3 V 3.6 V - 40 C + 85 C Pin Antenna Interface 25.5 mm x 18 mm x 3.2 mm BLE 5.1 802.11b/g/n/ax Reel
Quectel 多协议模块 Wi-Fi 6, single band 2.4GHz, BLE 5.1, Antenna: IPEX-1, -40 85C, 8MB flash
数据表
2.4 GHz ADC, I2C, I2S, PWM, SPI, UART 3 V 3.6 V - 40 C + 85 C RF Coaxial Connector 25.5 mm x 18 mm x 3.2 mm 802.11b/g/n/ax Reel
Quectel 多协议模块 Wi-Fi 4, 2.4GHz,1x1 antenna,BLE 5.2, Antenna: Pin, -40 105C, 2MB flash
数据表
2.4 GHz GPIO, I2C, PWM, SPI, UART 3 V 3.6 V - 40 C + 105 C Pin Antenna Interface 12.5 mm x 13.2 mm x 1.8 mm BLE 5.2 802.11b/g/n Reel
Quectel 多协议模块 Wi-Fi 4, 2.4GHz,1x1 antenna,BLE 5.2, Antenna: RF coax conn, -40 105C, 2MB flash
数据表
2.4 GHz GPIO, I2C, PWM, SPI, UART 3 V 3.6 V - 40 C + 105 C RF Coaxial Connector 12.5 mm x 13.2 mm x 1.8 mm BLE 5.2 802.11b/g/n Reel
Quectel 多协议模块 Wi-Fi 4, 2.4GHz,1x1 antenna,BLE 5.2, Antenna: PCB, -40 105C, 2MB flash
数据表
2.4 GHz GPIO, I2C, PWM, SPI, UART 3 V 3.6 V - 40 C + 105 C PCB Antenna 16.6 mm x 13.2 mm x 1.8 mm BLE 5.2 802.11b/g/n Reel
Quectel 多协议模块 Wi-Fi 4, 2.4 GHz, BLE5.2, 256 KB RAM, 2 MB flash, 1 1 antenna: LLC (pin), -40 105C, DIP package (FF)
数据表
2.4 GHz GPIO 3 V 3.6 V - 40 C + 105 C Pin Antenna Interface 12.7 mm x 8.5 mm x 2.55 mm BLE 5.2 802.11b/g/n Reel
Quectel 多协议模块 No connectivity. 4+32GB - Industrial temperature range(EAU >2000pcs)
数据表
2.5 GHz, 5 GHz ADC, eDP, GPIO, I2C, MIPI-CSI, MIPI-DSI, LVDS, PWM, SPI, UART, USB 2.0, USB 3.0 3.5 V 3.5 V - 40 C + 85 C 46 mm x 42 mm x 3.15 mm Bluetooth 4.2 802.11 a/b/g/n/ac Reel