- 40 C Reel 多协议模块

结果: 346
选择 图像 零件编号 制造商 描述 数据表 供货情况 单价(含13%增值税) 根据您的数量,按照单价筛选表格中的结果。 数量 RoHS ECAD模型 系列 频率 输出功率 接口类型 电源电压-最小 电源电压-最大 最小工作温度 最大工作温度 天线连接器类型 尺寸 协议 - 蓝牙、BLE - 802.15.1 协议 - 蜂窝、Nbiot、LTE 协议 - GPS、GLONASS 协议 - Sub GHz 协议 - WiFi - 802.11 协议 - ANT、Thread、Zigbee - 802.15.4 资格 封装
Telit Cinterion 多协议模块 WE866C6-P Wi-Fi 11ac + BT/BLE-5 MODULE
2.4 GHz, 5 GHz UART - 40 C + 85 C 15 mm x 13 mm x 2.2 mm Bluetooth LTE 802.11 a/b/g/n/ac Reel
Fanstel 多协议模块 nRF5340 BLE 5.4 and nRF7002 WiFi 6 combo modules, 2 chip antennas

2.4 GHz, 5 GHz 3 dBm, 19 dBm GPIO, I2C, QSPI, SPI, SWD, UART, USB 2.0 3.3 V 3.3 V - 40 C + 85 C Chip 24.5 mm x 15.5 mm BLE 802.11 a/b/g/n/ac/ax 802.15.4 Reel
Texas Instruments 多协议模块 SimpleLink Wi-Fi 6 c ompanion module
CC3300MOD 2.412 GHz to 2.472 GHz 18.4 dBm SPI, UART 1.62 V, 2.97 V 1.98 V, 3.63 V - 40 C + 85 C 11 mm x 11 mm Bluetooth Wi-Fi 6, 802.11ax Reel, Cut Tape, MouseReel
Texas Instruments 多协议模块 SimpleLink dual-band (2.4GHz and 5GHz) W
CC3351MOD 2.41 GHz to 2.47 GHz 18.3 dBm SPI - 40 C + 85 C 10.9 mm x 10.9 mm x 2.1 mm Bluetooth WiFi Reel, Cut Tape, MouseReel
Inventek ISM43439-WBP-L151
Inventek 多协议模块

2.4 GHz 17 dBm I2S, SPI, UART 3 V 3.6 V - 40 C + 85 C BLE, Bluetooth 5.2 802.11 b/g/n Reel
Silex Technology 多协议模块 Based on NXP's RW610, IM-100 is a small, stand-alone, dual-band Wi-Fi 6

260 MHz I2C, SPI, UART - 40 C + 85 C MHF 18 mm x 17 mm x 2.65 mm 802.11 a/b/g/n/ac/ax Reel
Silex Technology 多协议模块 the option to attach an antenna via a trace. does not include the u.Fl connector

260 MHz I2C, SPI, UART - 40 C + 85 C 18 mm x 17 mm x 2.65 mm 802.11 a/b/g/n/ac/ax Reel
Silex Technology 多协议模块 [Bulk SKU] SX-PCEBE-SMT is a Wi-Fi7 2x2 Tri-band IEEE802.11 be WLAN, Bluetooth 5.3 BR/EDR/HS/LE module in an M.2 LGA Type 1620 Surface Mount form factor. It is based on Qualcomm's QCC2076 chipset.

SX-PCEBE 2.4 GHz, 5 GHz, 6 GHz USB - 40 C + 85 C MHF4 Bluetooth WiFi Reel
Quectel 多协议模块 No connectivity. 1+8GB - Industrial temperature range(EAU >2000pcs)
2.5 GHz, 5 GHz ADC, eDP, GPIO, I2C, MIPI-CSI, MIPI-DSI, LVDS, PWM, SPI, UART, USB 2.0, USB 3.0 3.3 V 3.5 V - 40 C + 85 C 46 mm x 42 mm x 3.15 mm Bluetooth 4.2 802.11 a/b/g/n/ac Reel
Quectel 多协议模块 No connectivity. 2+16GB - Industrial temperature range(EAU >2000pcs)
2.5 GHz, 5 GHz ADC, eDP, GPIO, I2C, MIPI-CSI, MIPI-DSI, LVDS, PWM, SPI, UART, USB 2.0, USB 3.0 3.3 V 3.5 V - 40 C + 85 C 46 mm x 42 mm x 3.15 mm Bluetooth 4.2 802.11 a/b/g/n/ac Reel
Quectel 多协议模块 No connectivity. 4+32GB - Industrial temperature range(EAU >2000pcs)
2.5 GHz, 5 GHz ADC, eDP, GPIO, I2C, MIPI-CSI, MIPI-DSI, LVDS, PWM, SPI, UART, USB 2.0, USB 3.0 3.5 V 3.5 V - 40 C + 85 C 46 mm x 42 mm x 3.15 mm Bluetooth 4.2 802.11 a/b/g/n/ac Reel
Quectel 多协议模块 Wi-Fi /BT variant. 1+8GB - Industrial temperature range(EAU >2000pcs)
2.5 GHz, 5 GHz ADC, eDP, GPIO, I2C, MIPI-CSI, MIPI-DSI, LVDS, PWM, SPI, UART, USB 2.0, USB 3.0 3.5 V 3.5 V - 40 C + 85 C 46 mm x 42 mm x 3.15 mm Bluetooth 4.2 802.11 a/b/g/n/ac Reel
Quectel 多协议模块 Wi-Fi /BT variant. 2+16GB - Industrial temperature range(EAU >2000pcs)
2.5 GHz, 5 GHz ADC, eDP, GPIO, I2C, MIPI-CSI, MIPI-DSI, LVDS, PWM, SPI, UART, USB 2.0, USB 3.0 3.5 V 3.5 V - 40 C + 85 C 46 mm x 42 mm x 3.15 mm Bluetooth 4.2 802.11 a/b/g/n/ac Reel
Quectel 多协议模块 Wi-Fi 5, 802.11a/ b/ g/ n/ ac, 2 2, DBDC, 2.4/ 5 GHz dual-band, Bluetooth 5.1 (CYW54591) - Replacement for FC80AABMD
2.4 GHz, 5 GHz 1.7 V 4.5 V - 40 C + 85 C 15 mm x 13 mm x 2.2 mm Bluetooth 5.1 802.11a/b/g/n/ac Reel
Quectel 多协议模块 cloud enabled, Wi-Fi 4, 2.4GHz, BLE 5.2, Antenna: IPEX-1, -40 85C, 2MB flash
2.4 GHz UART 3 V 3.6 V - 40 C + 85 C IPEX-1 24 mm x 16 mm x 2.6 mm BLE 5.2 802.11 b/g/n Reel, Cut Tape
Quectel 多协议模块 cloud enabled, Wi-Fi 4, 2.4GHz, BLE 5.2, Antenna: PCB, -40 85C, 2MB flash
2.4 GHz UART 3 V 3.6 V - 40 C + 85 C PCB 24 mm x 16 mm x 2.6 mm BLE 5.2 802.11 b/g/n Reel, Cut Tape
Quectel 多协议模块 cloud enabled, Wi-Fi 4, 2.4GHz, BLE 5.2, Antenna: PCB, extended temp -40 105C, 4MB flash
2.4 GHz UART 3 V 3.6 V - 40 C + 105 C PCB 24 mm x 16 mm x 2.6 mm BLE 5.2 802.11 b/g/n Reel, Cut Tape
Quectel 多协议模块 Wi-Fi 6, dual band (2.4 GHz/5 GHz) + Zigbee/Thread + BLE 5.3, ARM Cortex-M33, 260MHz, 8MB Flash, 1.2MB RAM, Antenna: PCB, -40 85C, ultra-compact LCC
2.4 GHz, 5 GHz I2C, SPI 3.14 V 3.46 V - 40 C + 85 C 25.5 mm × 18 mm × 3.16 mm Reel
Quectel 多协议模块 Dual-band Wi-Fi 6e module, supporting Bluetooth 5.4,2.4 GHz + 5 GHz + 6 GHz,-45 C +85 C

FCS963N-LP 2.4 GHz, 5 GHz 7.5 dBm, 19 dBm UART 3 V 4.8 V - 40 C + 85 C 12 mm x 12 mm x 1.55 mm Bluetooth Wi-Fi Reel
Quectel 多协议模块 Wi-Fi 6 (802.11ax), 2.4/5 GHz Dual-Band 1x1 + BT 5.2 + 802.15.4 Tri-Radio
2.4 GHz, 5 GHz SDIO, SPI, UART 3.14 V 3.46 V - 40 C + 85 C 14 mm x 13 mm x 2 mm BLE 5.2 802.11 a/b/g/n/ac/ax Reel
Quectel 多协议模块 Wi-Fi 6 (802.11ax), 2.4/5 GHz Dual-Band 1x1 + BT 5.2 + 802.15.4 Tri-Radio, Higher performance for Wi-Fi 4 and 6
2.4 GHz, 5 GHz SPI, UART 1.71 V 3.46 V - 40 C + 85 C 14 mm x 13 mm x 2 mm Bluetooth 5.2 802.11 a/b/g/n/ac/ax Reel
Quectel 多协议模块 Wi-Fi 6, 2.4GHz, BLE5.2, RISC-V, ACK SDK for Matter, 4MB Flash, 512 KB SRAM, PCB antenna, -40C to 105C
2.4 GHz UART 3 V 3.6 V - 40 C + 105 C 17.3 mm x 15 mm x 2.8 mm BLE 5.2 802.11 b/g/n/ax Reel
Quectel 多协议模块 Wi-Fi 4, 2.4GHz, BLE 5.2, Antenna: Pin, extended temp -40-105C, 2MB flash
2.4 GHz - 40 C + 105 C Reel
Quectel 多协议模块 Wi-Fi 4, 2.4GHz, BLE 5.2, Antenna: IPEX-1, extended temp -40-105C, 2MB flash
2.4 GHz - 40 C + 105 C BLE 5.2 Reel
Quectel 多协议模块 Wi-Fi 6, single band 2.4GHz, BLE 5.1, Antenna: LCC, -40 85C, 8MB flash
2.4 GHz ADC, I2C, I2S, PWM, SPI, UART 3 V 3.6 V - 40 C + 85 C Pin Antenna Interface 25.5 mm x 18 mm x 3.2 mm BLE 5.1 802.11b/g/n/ax Reel