- 40 C 多协议模块

结果: 699
选择 图像 零件编号 制造商 描述 数据表 供货情况 单价(含13%增值税) 根据您的数量,按照单价筛选表格中的结果。 数量 RoHS ECAD模型 系列 频率 输出功率 接口类型 电源电压-最小 电源电压-最大 最小工作温度 最大工作温度 天线连接器类型 尺寸 协议 - 蓝牙、BLE - 802.15.1 协议 - 蜂窝、Nbiot、LTE 协议 - GPS、GLONASS 协议 - Sub GHz 协议 - WiFi - 802.11 协议 - ANT、Thread、Zigbee - 802.15.4 资格 封装
Microchip Technology 多协议模块 Wi-Fi + Bluetooth LE Module,u.FL Antenna 26库存量
最低: 1
倍数: 1

2.4 GHz 18.3 dBm I2C, SPI, UART 2.7 V 3.6 V - 40 C + 85 C u.FL 22.43 mm x 14.73 mm x 2 mm Bluetooth 5.0 802.11 b/g/n Tray
Espressif Systems 多协议模块 SMD module, ESP32-C3FH4, PCB antenna, -40C - +105C 137库存量
最低: 1
倍数: 1

2.4 GHz 20.5 dBm GPIO, I2C, I2S, SPI, UART 2.7 V 3.6 V - 40 C + 105 C PCB 13.2 mm x 16.6 mm x 2.4 mm Bluetooth 802.11 b/g/n Reel, Cut Tape
Ezurio 多协议模块 Module, Sterling-EWB, U.FL, Cut Tape 3库存量
最低: 1
倍数: 1

Sterling-EWB 2.4 GHz 17.5 dBm SPI, UART 3 V 3.6 V - 40 C + 85 C u.FL 16 mm x 21 mm Bluetooth 5.1 802.11 b/g/n Cut Tape
TechNexion 多协议模块 CLIX MODULE WITH QCA9377 WIFI 802.11AC (SDIO) + BLUETOOTH (UART) MODULE 43库存量
最低: 1
倍数: 1
UART 3.3 V 3.3 V - 40 C + 85 C MHF4 25 mm x 20 mm x 5 mm Bluetooth 802.11 a/b/g/n/ac
Silicon Labs 多协议模块 PMOD Card 802.11abgn BT4.0 + ZigBee 1库存量
最低: 1
倍数: 1

RS9113 2.4 GHz, 5 GHz 18 dBm SDIO, SPI, UART, USB 3 V 3.6 V - 40 C + 85 C Integrated, u.FL 16 mm x 27 mm x 3.1 mm Bluetooth 4.0 802.11 a/b/g/n 802.15.4 (ANT, Thread, Zigbee) Bulk
SparkFun 多协议模块 The Digi XBee 3 global cellular module is a cutting-edge compact module engineered for rapid integration of cellular IoT capabilities. This innovative solution is equipped with cellular and BLE connectivity with end-device carrier certifications an 1库存量
最低: 1
倍数: 1
23 dBm SPI, UART, USB 3.3 V 4.3 V - 40 C + 85 C SMA 32.94 mm x 24.38 mm BLE LTE-M/NBIoT GNSS
CEL 多协议模块 WiFi+BLE, USB, Conn. 105库存量
最低: 1
倍数: 1

CMP9377 2.4 GHz, 5 GHz 20 dBm USB 3.3 V 3.3 V - 40 C + 85 C External 17 mm x 12 mm x 3 mm Bluetooth 5.0 802.11 a/b/g/n/ac Tray
Quectel 多协议模块 Amazon Sidewalk IoT module (US version only) 250库存量
最低: 1
倍数: 1
: 500

2.4 GHz I2C, SPI, UART 1.8 V 3.3 V - 40 C + 85 C 15 mm x 15 mm x 2.25 mm BLE 5.1 Reel, Cut Tape
SparkFun 多协议模块 ESP32-C6 is Espressif s first WiFi 6 SoC integrating 2.4 GHz WiFi 6 Bluetooth 5 (LE) and the 802.15.4 protocol. It features an industry-leading RF performance with reliable security features and multiple memory resources for IoT products. It cons 29库存量
最低: 1
倍数: 1
2.4 GHz GPIO, I2C, I2S, Parallel, SPI, UART 3 V 3.6 V - 40 C + 85 C PCB 19.2 mm x 18 mm x 3.2 mm Bluetooth 5.3, Bluetooth Mesh 802.11 b/g/n/ax Thread, Zigbee
SparkFun 多协议模块 ESP32-C6 is Espressif s first WiFi 6 SoC integrating 2.4 GHz WiFi 6 Bluetooth 5 (LE) and the 802.15.4 protocol. It features an industry-leading RF performance with reliable security features and multiple memory resources for IoT products. It cons 6库存量
最低: 1
倍数: 1
2.4 GHz GPIO, I2C, I2S, Parallel, SPI, UART 3 V 3.6 V - 40 C + 85 C PCB 19.2 mm x 18 mm x 3.2 mm Bluetooth 5.3, Bluetooth Mesh 802.11 b/g/n/ax Thread, Zigbee
Quectel 多协议模块 Wi-Fi 5, 802.11a/ b/ g/ n/ ac, 2 2, DBDC, 2.4/ 5 GHz dual-band, Bluetooth 5.1 (CYW54591) - For new designs FC80AACMD should be selected 229库存量
最低: 1
倍数: 1
: 500

2.4 GHz, 5 GHz SDIO 1.7 V 3.6 V - 40 C + 85 C 15 mm x 13 mm x 2.2 mm Bluetooth 5.1 Reel, Cut Tape
Espressif Systems 多协议模块 SMD module, ESP32-S3R2 with 2 MB PSRAM die inside, 16 MB SPI flash, PCB antenna
6,499预期 2026/8/10
最低: 1
倍数: 1
: 650

2.4 GHz 20.5 dBm I2C, I2S, SPI, PWM, UART, USB 3 V 3.6 V - 40 C + 85 C PCB 25.5 mm x 18 mm x 3.1 mm Bluetooth 5.0 802.11 b/g/n Reel, Cut Tape, MouseReel
InnoPhase IoT 多协议模块 WiFi/BLE5/MCU Module w/ RF Antenna Pin Reduced Footprint 199库存量
最低: 1
倍数: 1

2.4 GHz 17.5 dBm SPI, UART 2.6 V 3.6 V - 40 C + 85 C RF 12.8 mm x 15 mm x 2.5 mm BLE 5.0 802.11 b/g/n Tray
InnoPhase IoT 多协议模块 WiFi/BLE5/MCU Module w/ U.FL Antenna Connector 93库存量
最低: 1
倍数: 1
2.4 GHz 17.5 dBm SPI, UART 2.6 V 3.6 V - 40 C + 85 C u.FL 12.8 mm x 17 mm x 2.5 mm BLE 5.0 802.11 b/g/n Tray
Ezurio 多协议模块 Module, Sterling LWB5+, MHF4
1,000预期 2026/10/14
最低: 1
倍数: 1

Sterling-LWB5+ 2.4 GHz, 5 GHz Serial, SDIO, USB 3.3 V 3.3 V - 40 C + 85 C External 12 mm x 17 mm x 2.2 mm Bluetooth 5.2, Bluetooth LE WiFi 5, 802.11 ac Cut Tape
Ezurio 多协议模块 BL5340 series - Multi-Core / Protocol Bluetooth + 802.15.4 + NFC Module (Nordic nRF52340) - Integrated Antenna (Tape/Reel)
5,000在途量
最低: 1
倍数: 1
: 1,000

BL5340 2.4 GHz 3 dBm ADC, GPIO, I2C, I2S, SPM, UART, USB 1.7 V 5.5 V - 40 C + 105 C Integrated 15 mm x 10 mm x 2 mm Bluetooth LE NFC 802.15.4 802.15.4 (ANT, Thread, Zigbee) Reel, Cut Tape
Ezurio 多协议模块 Module, Sona IF573, MIMO, M.2, Key E, PCIe, UART
412在途量
最低: 1
倍数: 1

Sona IF573 2.4 GHz, 5 GHz, 6 GHz UART 3.13 V 3.47 V - 40 C + 85 C MHF4 Bluetooth Core 6.0, Bluetooth LE WiFi 6E, 802.11 a/b/g/n/ax Tray
Espressif Systems 多协议模块 "ESP32-C5-WROOM-1 and ESP32-C5-WROOM-1U are two general-purpose 2.4 and 5 GHz dual-band Wi-Fi 6 (802.11ax), Bluetooth 5 (LE), Zigbee, and Thread (802.15.4) modules. The rich set of peripherals and high performance make the module an ideal choice for
9,750在途量
最低: 1
倍数: 1

240 MHz 20 dBm I2C, SPI, UART 3 V 3.6 V - 40 C + 85 C 27.5 mm x 18 mm x 3.3 mm
Espressif Systems 多协议模块 SMD module, ESP32-S3R2 with 2 MB PSRAM die inside, 8 MB SPI flash, IPEX antenna connector.
6,226预期 2026/8/11
最低: 1
倍数: 1

2.4 GHz 20.5 dBm GPIO, I2C, I2S, SPI, UART 3 V 3.6 V - 40 C + 85 C PCB 19.2 mm x 18 mm x 3.2 mm Bluetooth 5.0 802.11 b/g/n Bulk
Espressif Systems 多协议模块 SMD module ESP32-WROOM-32UE, ESP32-D0WD-V3, ESP32 ECO V3, 8 MB SPI flash, IPEX antenna connector
5,764预期 2026/7/21
最低: 1
倍数: 1
: 650

2.4 GHz 19.5 dBm I2C, I2S, PWM, SDIO, SPI, UART 3 V 3.6 V - 40 C + 85 C External 18 mm x 19 mm x 3.2 mm BLE, Bluetooth 4.2 802.11 b/g/n Reel, Cut Tape
u-blox 多协议模块 IW611, 802.11ax+BT, 1 PCB antenna or antenna pin
1,500预期 2026/8/17
最低: 1
倍数: 1
: 500

MAYA-W2 18 dBm SPI - 40 C + 85 C PCB Antenna 14.3 mm x 10.4 mm x 1.9 mm Reel, Cut Tape
u-blox 多协议模块 ESP32, 802.11bgn+BT, metal antenna, u-connectXpress
3,997在途量
最低: 1
倍数: 1
: 500

NINA-W15 2.4 GHz 8 dBm, 18 dBm GPIO, I2C, I2S, SPI, UART 3 V 3.6 V - 40 C + 85 C u.FL Bluetooth 802.11 b/g/n Reel, Cut Tape
u-blox 多协议模块 ESP32, 802.11bgn+BT, PCB antenna, u-connectXpress 422库存量
4,000在途量
最低: 1
倍数: 1
: 500

NINA-W15 2.4 GHz 15 dBm GPIO, SPI, UART 3 V 3.6 V - 40 C + 85 C PCB 10 mm x 14 mm x 2.2 mm Bluetooth 4.2 Reel, Cut Tape
STMicroelectronics 多协议模块 Ultra-low-power dual core MCU 64 MHz Cortex-M0+ 32MHz 1 Mbyte Bluetooth LE
19,755预期 2026/9/4
最低: 1
倍数: 1
: 1,800

STM32WB 2.4 GHz 6 dBm I2C, USART, USB 1.7 V 3.6 V - 40 C + 85 C Chip 7.3 mm x 11 mm x 1.34 mm Bluetooth 5.3 802.15.4 (ANT, Thread, Zigbee) Reel, Cut Tape, MouseReel
Silicon Labs 多协议模块 802.15.4 and Bluetooth Low Energy 5.4 Multiprotocol Wireless Module
8,000预期 2026/10/8
最低: 1
倍数: 1
: 1,000

MGM240P 2.4 GHz 20 dBm I2C, USART 1.8 V 3.8 V - 40 C + 105 C 12.9 mm x 15 mm Bluetooth, BLE 802.15.4 (ANT, Thread, Zigbee) Reel, Cut Tape, MouseReel