- 40 C 多协议模块

结果: 686
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数量 RoHS ECAD模型 系列
频率
输出功率
接口类型
电源电压-最小
电源电压-最大
最小工作温度
最大工作温度
天线连接器类型
尺寸
协议 - 蓝牙、BLE - 802.15.1
协议 - 蜂窝、Nbiot、LTE
协议 - GPS、GLONASS
协议 - Sub GHz
协议 - WiFi - 802.11
协议 - ANT、Thread、Zigbee - 802.15.4
资格
封装
Arduino 多协议模块 Portenta Proto Kit ME ABX00042; ASX00055; TPX00200; ABX00050
数据表

Portenta CAN, Ethernet, I2C, SPI, USB 7 VDC 30 VDC - 40 C + 85 C Bluetooth 5.0 LTE Cat.4, 4G GNSS Bulk
Arduino 多协议模块 Portenta Proto Kit VE ABX00042; ASX00055; TPX00200; ABX00051; ABX00089

Portenta CAN, Ethernet, I2C, SPI, USB 7 VDC 30 VDC - 40 C + 85 C LTE Cat.4, 4G GNSS Bulk
Ezurio 多协议模块 Module, Sona TI351, 1216, MHF4L, Tape and Reel
数据表

Sona TI351 2.4 GHz, 5 GHz SDIO, UART 1.62 V 3.6 V - 40 C + 85 C 16 mm x 12 mm x 0.43 mm Bluetooth 5.4, Bluetooth LE WiFi 6, 802.11 a/b/g/n/ax Reel, Cut Tape
Murata Electronics 多协议模块 Type 2FP is NXP RW610 based Hostless dual band Wi-Fi 6 + BLE 5.4 Module
数据表
260 MHz 12 dBm 3.14 V 3.46 V - 40 C + 85 C 12 mm x 11 mm x 1.55 mm Bluetooth WiFi Reel, Cut Tape
Seeed Studio 多协议模块 Seeed Studio XIAO ESP32C3

2.4 GHz I2C, SPI, UART - 40 C + 85 C 21 mm x 17.5 mm 802.11 b/g/n
Phoenix Contact 多协议模块 FL EPA 2
数据表

9 V 30 V - 40 C + 65 C M12 67.8 mm x 92.7 mm x 33.2 mm Bluetooth IEEE 802.11
Ezurio 多协议模块 Module, Sona NX611, 2 x RF Trace, MIMO, SIP, Cut Tape
数据表

Sona NX611 2.4 GHz, 5 GHz UART 1.8 V 3.3 V - 40 C + 85 C MHF4 Bluetooth 5.4, Bluetooth LE WiFi 6 Cut Tape
Ezurio 多协议模块 Module, Sona NX611, 1 x RF Trace, MIMO, SIP, Cut Tape
数据表

Sona NX611 2.4 GHz, 5 GHz UART 1.8 V 3.3 V - 40 C + 85 C MHF4 Bluetooth 5.4, Bluetooth LE WiFi 6 Cut Tape
Fanstel 多协议模块 Mini nRF52811 BLE 5.4 module, 192KB flash,24KB RAM, high performance PCB antenna, approtect
数据表

BM833 2.4 GHz I2S 1.7 V 3.6 V - 40 C + 85 C 10.2 mm x 20.6 mm x 1.9 mm Reel, Cut Tape

Intel 多协议模块 Intel Dual Band Wireless-AC 9260 Industrial IoT Kit, No vPro, Extended temp
数据表
更多信息可用

2.4 GHz, 5 GHz PCIe, USB - 40 C + 85 C 22 mm x 30 mm x 2.4 mm Bluetooth 5.1 802.11 ac
Espressif Systems 多协议模块 ESP32-C5-WROOM-1 and ESP32-C5-WROOM-1U are two general-purpose 2.4 and 5 GHz dual-band Wi-Fi 6(802.11ax), Bluetooth 5 (LE), Zigbee, and Thread (802.15.4) modules.
数据表
更多信息可用

2.4 GHz, 5 GHz GPIO, I2C, SPI, UART 3 V 3.6 V - 40 C + 85 C 27.5 mm x 18 mm x 3.3 mm Bluetooth WiFi Thread, Zigbee
GigaDevice 多协议模块 RISC-V with BLE 5.2 and WiFi 6 certified module / 15 x 12.4 / 21 GPIO / -40-105 degC / onboard PCB antenna
数据表
更多信息可用

RISC-V 2.412 GHz to 2.484 GHz 23.4 dBm UART 3 V 3.6 V - 40 C + 105 C 15 mm x 12.4 mm x 2.4 mm BLE WiFi
Ezurio 多协议模块 Module, Veda IF912, SIP, Dual Band, No Memory, RF Trace Pin, Cut Tape
数据表
更多信息可用

IF912 32.768 kHz 3.13 V 4.8 V - 40 C + 85 C 11 mm x 7 mm x 1.4 mm Bluetooth LE WiFi 6, 802.11 a/b/g/n/ax/ac Cut Tape
Ezurio 多协议模块 Module, Veda IF912, SIP, Dual Band, 8M PSRAM, 8M Flash, RF Trace Pin, Cut Tape
数据表
更多信息可用

IF912 32.768 kHz 3.13 V 4.8 V - 40 C + 85 C 11 mm x 7 mm x 1.4 mm Bluetooth LE WiFi 6, 802.11 a/b/g/n/ax/ac Cut Tape
Ezurio 多协议模块 Module, Veda IF913, SIP, Tri Band, No Memory, RF Trace Pin, Cut Tape
数据表
更多信息可用
IF913 32.768 kHz 3.13 V 4.8 V - 40 C + 85 C 11 mm x 7 mm x 1.4 mm Bluetooth LE WiFi 6, 802.11 a/b/g/n/ax/ac Cut Tape
GigaDevice 多协议模块 RISC-V with BLE 5.2 and WiFi 6 certified module / 9.5 x 12.4 / 21 GPIO / -40-85 degC / external IPEX connection
数据表
更多信息可用

RISC-V 2.412 GHz to 2.484 GHz 23.4 dBm UART 3 V 3.6 V - 40 C + 85 C 12.4 mm x 9.6 mm x 2.4 mm BLE WiFi
GigaDevice 多协议模块 RISC-V with BLE 5.2 and WiFi 6 certified module / 15 x 12.4 / 21 GPIO / -40-85 degC / onboard PCB antenna
数据表
更多信息可用

RISC-V 2.412 GHz to 2.484 GHz 23.4 dBm UART 3 V 3.6 V - 40 C + 85 C 15 mm x 12.4 mm x 2.4 mm BLE WiFi
GigaDevice 多协议模块 RISC-V with BLE 5.2 and WiFi 6 certified module / 24 x 16 / 18 GPIO / -40-105 degC / external IPEX connection
数据表
更多信息可用

RISC-V 2.412 GHz to 2.484 GHz 23.2 dBm UART 3 V 3.6 V - 40 C + 105 C 24 mm x 16 mm x 2.2 mm BLE WiFi
GigaDevice 多协议模块 RISC-V with BLE 5.2 and WiFi 6 certified module / 24 x 16 / 18 GPIO / -40-105 degC / onboard PCB antenna
数据表
更多信息可用

RISC-V 2.412 GHz to 2.484 GHz 23.2 dBm UART 3 V 3.6 V - 40 C + 105 C 24 mm x 16 mm x 2.2 mm BLE WiFi
Telit Cinterion 多协议模块
更多信息可用

1.4 MHz 23 dBm I2C, SPI, UART 2.2 V 4.5 V - 40 C + 85 C 18 mm x 15 mm NBIoT, LTE GPS, GLONASS Tray
NXP Semiconductors 多协议模块 IW610BHN/A1ZDI
数据表
更多信息可用

IW610BHN 2.4 GHz, 5 GHz 23 dBm SDIO, SPI, UART, USB 3.14 V 3.46 V - 40 C + 125 C Bluetooth, BLE WiFi 6 Tray
NXP Semiconductors 多协议模块 IW610BUK/A1ZDI
数据表
更多信息可用

IW610BUK 2.4 GHz, 5 GHz 23 dBm SDIO, SPI, UART, USB 3.14 V 3.46 V - 40 C + 125 C Bluetooth, BLE WiFi 6 Reel, Cut Tape
NXP Semiconductors 多协议模块 IW610CHN/A1ZDI
数据表
更多信息可用

IW610CHN 2.4 GHz, 5 GHz 23 dBm SDIO, SPI, UART, USB 3.14 V 3.46 V - 40 C + 125 C Bluetooth, BLE - 802.15.4 WiFi 6 Tray
NXP Semiconductors 多协议模块 IW610CUK/A1ZDI
数据表
更多信息可用

IW610CUK 2.4 GHz, 5 GHz 23 dBm SDIO, SPI, UART, USB 3.14 V 3.46 V - 40 C + 125 C Bluetooth, BLE - 802.15.4 WiFi 6 Reel, Cut Tape
NXP Semiconductors 多协议模块 IW610FHN/A1ZDI
数据表
更多信息可用

IW610FHN 2.4 GHz, 5 GHz 23 dBm SDIO, SPI, UART, USB 3.14 V 3.46 V - 40 C + 125 C Bluetooth, BLE WiFi 6 Reel, Cut Tape