SMD/SMT 多协议模块

结果: 312
选择 图像 零件编号 制造商 描述 数据表 供货情况 单价(含13%增值税) 根据您的数量,按照单价筛选表格中的结果。 数量 RoHS ECAD模型 系列 频率 输出功率 接口类型 电源电压-最小 电源电压-最大 最小工作温度 最大工作温度 天线连接器类型 尺寸 协议 - 蓝牙、BLE - 802.15.1 协议 - 蜂窝、Nbiot、LTE 协议 - GPS、GLONASS 协议 - Sub GHz 协议 - WiFi - 802.11 协议 - ANT、Thread、Zigbee - 802.15.4 封装
Quectel 多协议模块 Embedded, 1559-1606, GNSS L1, Ceramic, -, -, Pin Mounting, 25 25 4 2库存量
最低: 1
倍数: 1

21 dBm GPIO, I2C, UART, USB 2.6 V 4.8 V - 35 C + 75 C Integrated 23.6 mm x 19.9 mm x 2.2 mm LTE Cat M1 BDS, Galileo, GLONASS, GPS
Quectel 多协议模块 Embedded, 1710-2700, 3300-5000, 5G, FPC with holder, -, Spring contact, Screw, 37.25 9.6 10.1 1库存量
最低: 1
倍数: 1

21 dBm GPIO, I2C, UART, USB 2.6 V 4.8 V - 35 C + 75 C Integrated 23.6 mm x 19.9 mm x 2.2 mm LTE Cat M1/NB2 BDS, Galileo, GLONASS, GPS
Telit Cinterion 多协议模块
180预期 2026/7/10
最低: 1
倍数: 1

I2C, SPI, UART 3.4 V 4.2 V - 40 C + 85 C 28.2 mm x 28.2 mm x 2.2 mm Bluetooth LTE WiFi Tray
u-blox 多协议模块 ESP32, 802.11bgn+BT, metal antenna, u-connectXpress
4,000在途量
最低: 1
倍数: 1
: 500

NINA-W15 2.4 GHz 8 dBm, 18 dBm GPIO, I2C, I2S, SPI, UART 3 V 3.6 V - 40 C + 85 C u.FL Bluetooth 802.11 b/g/n Reel, Cut Tape
Silicon Labs 多协议模块 802.15.4 and Bluetooth Low Energy 5.4 Multiprotocol Wireless Module
8,000预期 2026/10/8
最低: 1
倍数: 1
: 1,000

MGM240P 2.4 GHz 20 dBm I2C, USART 1.8 V 3.8 V - 40 C + 105 C 12.9 mm x 15 mm Bluetooth, BLE 802.15.4 (ANT, Thread, Zigbee) Reel, Cut Tape, MouseReel
Nordic Semiconductor 多协议模块 Low Power Cellular IoT SIP, LTE-M, NB-IoT, GNSS wireless modem
2,488预期 2026/12/25
最低: 1
倍数: 1
: 2,500

700 MHz to 2.2 GHz 23 dBm I2C, I2S, SPI, UART 3 V 5.5 V - 40 C + 85 C 16 mm x 10.5 mm x 1.04 mm DECT NR+, LTE Cat-M1/NB1/NB2 GPS, QZSS Reel, Cut Tape
CEL 多协议模块 ZB/Thread/BT, +20dBm, 1.64Mb, Antenna BULK 3库存量
最低: 1
倍数: 1

2.4 GHz 20 dBm ADC, GPIO, I2C, QSPI, SPI, UART, USB 3.3 V 3.3 V - 40 C + 85 C PCB 16.7 mm x 26.3 mm Bluetooth 5.0 Thread, Zigbee Bulk
Ezurio 多协议模块 BL651 Series - Bluetooth v5 Module, Int. Antenna (Nordic nRF52810) Tape & Reel
1,998预期 2026/9/8
最低: 1
倍数: 1
: 1,000

BL651 2.4 GHz 4 dBm GPIO, I2C, SPI, UART 1.7 V 3.6 V - 40 C + 85 C PCB 14 mm x 10 mm x 2.1 mm Bluetooth LE Reel, Cut Tape, MouseReel
Ezurio 多协议模块 Module, Sona NX611, MIMO, M.2 2230, 2 x MHF4, Tray
107预期 2026/7/3
最低: 1
倍数: 1

Sona NX611 2.4 GHz, 5 GHz UART 1.8 V 3.3 V - 40 C + 85 C MHF4 Bluetooth 5.4, Bluetooth LE WiFi 6 Tray
Ezurio 多协议模块 Module, Sona IF513, Antenna Diversity, M.2, Key E, SDIO, UART
200预期 2026/8/17
最低: 1
倍数: 1

Sona IF513 2.4 GHz, 5 GHz, 6 GHz 17 dBm SDIO, UART 3.13 V 3.5 V - 40 C + 85 C MHF4L 30 mm x 22 mm x 3.1 mm Bluetooth 5.4, Bluetooth LE WiFi 6E, 802.11 a/b/g/n/ax Tray
Ezurio 多协议模块 Module, Sona TI351, M.2, Key E, SDIO, UART
387在途量
最低: 1
倍数: 1

Sona TI351 2.4 GHz, 5 GHz SDIO, UART - 40 C + 85 C MHF4L 30 mm x 22 mm x 3.1 mm Bluetooth 5.4, Bluetooth LE WiFi 6, 802.11 a/b/g/n/ax Tray
Quectel 多协议模块 Cat M1/Cat NB2, Power Class 5, 450 MHz Supported + GNSS (w/o WWAN concurrency) 34库存量
最低: 1
倍数: 1
: 250

26 dBm GPIO, I2C, UART, USB 2.6 V 4.8 V - 35 C + 75 C Integrated 23.6 mm x 19.9 mm x 2.2 mm LTE Cat M1/NB2 BDS, Galileo, GLONASS, GPS Reel, Cut Tape
u-blox 多协议模块 IW611, 802.11ax+BT, 2 antenna pins
1,000预期 2026/8/6
最低: 1
倍数: 1
: 500

MAYA-W2 18 dBm SPI - 40 C + 85 C 14.3 mm x 10.4 mm x 1.9 mm Reel, Cut Tape
u-blox 多协议模块 IW612, 802.11ax+BT+802.15.4, 2 antenna pins
500预期 2026/6/3
最低: 1
倍数: 1
: 500

MAYA-W2 18 dBm SPI - 40 C + 85 C 14.3 mm x 10.4 mm x 1.9 mm Reel, Cut Tape
u-blox 多协议模块 IW612, 802.11ax+BT+802.15.4, 1 PCB antenna or ant. pin
977在途量
最低: 1
倍数: 1
: 500

MAYA-W2 18 dBm SPI - 40 C + 85 C PCB Antenna 14.3 mm x 10.4 mm x 1.9 mm Reel, Cut Tape, MouseReel
Microchip Technology 多协议模块 Wi-Fi + Bluetooth LE Module, Chip Antenna
500在途量
最低: 1
倍数: 1
: 500

2.4 GHz 18.3 dBm I2C, SPI, UART 2.7 V 3.6 V - 40 C + 85 C Chip 22.43 mm x 14.73 mm x 2 mm Bluetooth 5.0 802.11 b/g/n Reel, Cut Tape
Silicon Labs 多协议模块 802.15.4 and Bluetooth Low Energy 5.4 Multiprotocol Wireless Module
500预期 2026/6/19
最低: 1
倍数: 1

MGM240P 2.4 GHz 20 dBm I2C, USART 1.8 V 3.8 V - 40 C + 105 C 12.9 mm x 15 mm Bluetooth, BLE 802.15.4 (ANT, Thread, Zigbee) Cut Tape
Silicon Labs 多协议模块 802.15.4 and Bluetooth Low Energy 5.4 Multiprotocol Wireless Module 交货期 20 周
最低: 1
倍数: 1

MGM240P 2.4 GHz 20 dBm I2C, USART 1.8 V 3.8 V - 40 C + 105 C 12.9 mm x 15 mm Bluetooth, BLE 802.15.4 (ANT, Thread, Zigbee) Cut Tape
Microchip Technology 多协议模块 Bluetooth Low Energy/15.4 Combo Module with PCB Antenna and extended temperature
144预期 2026/7/24
最低: 1
倍数: 1

2.4 GHz 12 dBm 1.9 V 3.6 V - 40 C + 125 C 7 mm x 7 mm x 0.9 mm Bluetooth Zigbee Tray
NXP Semiconductors 多协议模块 IW611HN/A1C
25预期 2026/8/21
最低: 1
倍数: 1
: 2,000

IW611HN GPIO, I2S, SDIO, UART - 40 C + 85 C Bluetooth 5.2 802.11 az Reel, Cut Tape
NXP Semiconductors 多协议模块 IW612HN/A1I
100预期 2026/8/21
最低: 1
倍数: 1
: 2,000

IW612HN 2.4 GHz, 5 GHz I2S Bluetooth 5.2 Reel, Cut Tape
Murata Electronics 多协议模块 Shielded Small Wi-Fi 11a/b/g/n/ac/ax + Bluetooth 5.3 Module Type 2EL
3,993在途量
最低: 1
倍数: 1
: 1,000

2EL 2.4 GHz, 5.8 GHz 20 dBm SPI 1.71 V 3.46 V - 40 C + 85 C 8.8 mm x 7.7 mm x 1.3 mm Bluetooth 5.3 802.11 a/b/g/n/ac/ax Reel, Cut Tape, MouseReel
Murata Electronics 多协议模块 Type 2FY Infineon CYW55513 ShieldedSmall WiFi 11a/b/g/n/ac/ax SISO+BT 5.4 Module
984预期 2026/9/18
最低: 1
倍数: 1
: 1,000

2FY 2.4 GHz, 5 GHz, 6 GHz GPIO, UART 3 V 4.8 V - 40 C + 85 C 7.9 mm x 7.3 mm x 1.1 mm Bluetooth WiFi - 802.11 Reel, Cut Tape
Murata Electronics 多协议模块 Type 2FR module
975预期 2026/11/3
最低: 1
倍数: 1
: 1,000

2FR 2.484 GHz 18 dBm SPI 3.14 V 3.46 V - 40 C + 85 C 12 mm x 11 mm x 1.5 mm Reel, Cut Tape
Quectel 多协议模块 Cat M1/Cat NB2 - Standard version + GNSS (w/o WWAN concurrency)
741在途量
最低: 1
倍数: 1
: 500

21 dBm ADC, GPIO, I2C, PCM, USB 2.0, UART 2.6 V 4.8 V - 35 C + 75 C RP-SMA 14.9 mm x 12.9 mm x 1.7 mm LTE Cat-M1/NB2 GLONASS, GPS Reel, Cut Tape, MouseReel