3.3 V 多协议模块

结果: 217
选择 图像 零件编号 制造商 描述 数据表 供货情况 单价(含13%增值税) 根据您的数量,按照单价筛选表格中的结果。 数量 RoHS ECAD模型 系列 频率 输出功率 接口类型 电源电压-最小 电源电压-最大 最小工作温度 最大工作温度 天线连接器类型 尺寸 协议 - 蓝牙、BLE - 802.15.1 协议 - 蜂窝、Nbiot、LTE 协议 - GPS、GLONASS 协议 - WiFi - 802.11 协议 - ANT、Thread、Zigbee - 802.15.4 资格 封装
Ezurio 多协议模块 BL5340PA Series Multi-Core / Protocol (Nordic nRF5340) Integrated antenna (Cut Tape) 246库存量
最低: 1
倍数: 1

BL5340PA 2.402 GHz to 2.48 GHz I2C, SPI, UART 3 V 3.6 V - 40 C + 105 C MHF4 21 mm x 10 mm x 2.55 mm Bluetooth LE 802.15.4 Cut Tape
Ezurio 多协议模块 BL5340PA Series Multi-Core / Protocol (Nordic nRF5340) Trace pin (Cut Tape) 127库存量
最低: 1
倍数: 1

BL5340PA 2.402 GHz to 2.48 GHz I2C, SPI, UART 3 V 3.6 V - 40 C + 105 C MHF4 21 mm x 10 mm x 2.55 mm Bluetooth LE 802.15.4 Cut Tape
Microchip Technology 多协议模块 ATWILC3000 802.11 b/g/n + Bluetooth 5 Module Chip Antenna 2,220库存量
最低: 1
倍数: 1

2.4 GHz 18.5 dBm SDIO, SPI, UART 1.62 V 3.6 V - 40 C + 85 C Chip 22.4 mm x 14.7 mm x 2 mm Bluetooth 5.0 802.11 b/g/n Tray
Advantech 多协议模块 802.11ax+BT5.3, NXP 88W9098, PCIe-UART, 215库存量
最低: 1
倍数: 1
AIW-165 2.4 GHz, 5 GHz UART 3.3 V 3.3 V - 40 C + 85 C Without Antenna 28 mm x 30 mm x 3.95 mm Bluetooth 5.3
Signetik 多协议模块 Nordic Cellular CAT M-1 GNSS/GPS Intelligent IoT Low Profile Connector 371库存量
最低: 1
倍数: 1

SigCell 700 MHz to 2.2 GHz GPIO, I2C, I2S, PWM, SPI, UART 2.5 V 5.5 V - 40 C + 85 C u.FL 32.8 mm x 24.5 mm x 4.5 mm Cellular, NBIoT, LTE GNSS, GPS

Ezurio 多协议模块 2.4GHz + 5GHz WiFi AC module + BT5.0
2.4 GHz, 5 GHz SDIO, UART 3.135 V 3.465 V - 20 C + 70 C u.FL 13 mm x 18 mm Bluetooth 4.1 802.11 a/b/g/n/ac
Inventek 多协议模块 802.11a/b/g/n serial-to-WiFi and BT 4.0 combo module with integrated TCP/IP stack. 2.4 and 5 GHz Chip Antenna. 2MB External Flash. Inventek AT Commands (IWIN) firmware and Cypress WICED compatible. Certified FCC/IC/CE 213库存量
最低: 1
倍数: 1

ISM43340 2.4 GHz, 5 GHz 19 dBm SPI, UART 3.3 V 3.3 V - 40 C + 85 C Chip 14.5 mm x 34 mm x 2.5 mm Bluetooth 802.11 a/b/g/n Tray
Ezurio 多协议模块 Sterling LWB+, Chip Antenna, CutTape 1,152库存量
最低: 1
倍数: 1

Sterling-LWB+ 2.4 GHz 18 dBm SDIO, UART 3.2 V 4.8 V - 40 C + 85 C Chip 21 mm x 15.5 mm x 4 mm Bluetooth 5.2 WiFi 4, 802.11 b/g/n Cut Tape
Advantech 多协议模块 6E AX210 (Vpro) -40 85 degree wireless k 55库存量
最低: 1
倍数: 1
2.4 GHz, 5 GHz, 6 GHz PCIe, USB - 40 C + 85 C 22 mm x 30 mm x 2.4 mm Bluetooth 5.3 802.11 a/b/g/n/ac/ax
Ezurio 多协议模块 Module, Sterling LWB5+, Chip Antenna 614库存量
最低: 1
倍数: 1

Sterling-LWB5+ 2.4 GHz, 5 GHz Serial, SDIO, USB 3.3 V 3.3 V - 40 C + 85 C Chip 12 mm x 17 mm x 2.2 mm Bluetooth 5.2, Bluetooth LE WiFi 5, 802.11 ac Cut Tape
Advantech 多协议模块 AX210 6E 802.11ax+BT5.2 vpo module+anten 290库存量
最低: 1
倍数: 1
AIW-166K 2.4 GHz, 5 GHz, 6 GHz PCIe, USB 3.3 V 3.3 V 0 C + 70 C 22 mm x 30 mm x 2.4 mm Bluetooth 5.2
Telink 多协议模块 Telink Semiconductor is a fabless IC design company of state-of-the art wireless connectivity SoCs. Through years of research and development, Telink has built a comprehensive product portfolio and become one of the world-leading IC suppliers in this 2库存量
最低: 1
倍数: 1

ML3 2.4 GHz to 2.483 GHz 8.4 dBm I2C, SPI, UART 1.8 V 4.3 V - 40 C + 125 C 26 mm x 11.3 mm x 2.6 mm Zigbee Reel
Pulse Electronics 多协议模块 USB 802.11 b/g/n BT module 746库存量
最低: 1
倍数: 1

TWR 2.4 GHz 14 dBm, 16 dBm USB 2.0 3 V 3.6 V - 5 C + 60 C 14.7 mm x 10.8 mm x 3.2 mm BLE, Bluetooth 802.11 b/g/n Tray
Silex Technology 多协议模块 [Sample Pack] Low power version SMT type 802.11ah SDIO Wi-Fi HaLow module using MM6108. 15库存量
最低: 1
倍数: 1

23 dBm SPI - 40 C + 85 C MHF1 18 mm x 17 mm x 2.65 mm 802.11 ah Cut Tape
Ezurio 多协议模块 Sterling-LWB SIP, Cut Tape 474库存量
最低: 1
倍数: 1

Sterling-LWB 2.4 GHz 14 dBm UART 1.8 V 3.6 V - 40 C + 85 C RF 15.5 mm x 21 mm x 2 mm Bluetooth LE 802.11 b/g/n Cut Tape
Ezurio 多协议模块 Module, Sona IF573, MIMO, MHF4, Cut Tape 4库存量
250预期 2026/7/15
最低: 1
倍数: 1

Sona IF573 2.4 GHz, 5 GHz, 6 GHz UART 3.13 V 3.47 V - 40 C + 85 C Bluetooth Core 6.0, Bluetooth LE WiFi 6E, 802.11 a/b/g/n/ax Cut Tape
Espressif Systems 多协议模块 SMD Module, ESP32-H2FH2S, Chip revision v1.2 and above, 2 MB SPI flash, PCB antenna, -40 C +105 C Required ESP-IDF version: v5.1.6 and v5.2.5, v5.3.3 (expected on 3/27), v5.4.1 (expected on 4/4), and above 3,280库存量
最低: 1
倍数: 1

2.402 GHz to 2.48 GHz 20 dBm SPI 3 V 3.6 V - 40 C + 105 C 16.6 mm x 13.2 mm x 2.4 mm Bluetooth, BLE 802.15.4 (ANT, Thread, Zigbee)
Espressif Systems 多协议模块 SMD Module, ESP32-H2FH4S, Chip revision v1.2 and above, 4 MB SPI flash, PCB antenna, -40 C +105 C. Required ESP-IDF version: v5.1.6 and v5.2.5, v5.3.3 (expected on 3/27), v5.4.1 (expected on 4/4), and above 811库存量
1,950预期 2026/8/24
最低: 1
倍数: 1

2.402 GHz to 2.48 GHz 20 dBm SPI 3 V 3.6 V - 40 C + 105 C 16.6 mm x 13.2 mm x 2.4 mm Bluetooth, BLE 802.15.4 (ANT, Thread, Zigbee)
Silex Technology 多协议模块 2x2 Dual Band 802.11 ac WLAN+BT PCIe 88库存量
最低: 1
倍数: 1

SX-PCEAC2 2.4 GHz, 5 GHz PCIe, USB 3.135 V 3.465 V - 20 C + 70 C MHF4 30 mm x 26.8 mm x 3.4 mm Bluetooth 5.0 802.11 a/b/g/n/ac Bulk
Silex Technology 多协议模块 [Sample Pack] SX-PCEAX-SMT-SP is a sample pack SKU ideal for small quantities used for small pilot builds. SX-PCEAX-SMT-SP is a 2.4 GHz/5 GHz /6 GHz Tri-band IEEE802.11 ax WLAN, Bluetooth 5.2 BR/EDR/HS/LE module in an M.2 LGA Type 1418 Surface Mount 75库存量
678预期 2026/7/30
最低: 1
倍数: 1

SX-PCEAX 2.4 GHz, 5 GHz, 6 GHz PCIe, USB 3.135 V 3.465 V - 20 C + 65 C MHF4 14 mm x 18 mm x 1.9 mm Bluetooth 5.2 802.11 a/b/g/n/ac/ax Bulk
Silex Technology 多协议模块 [Sample Pack] SX-PCEAX-M2-SP is a sample pack SKU ideal for small quantities used for evaluation and small pilot builds. SX-PCEAX-M2-SP is a 2.4 GHz/5 GHz /6 GHz Tri-band IEEE802.11 ax WLAN, Bluetooth 5.2 BR/EDR/HS/LE module in an M.2 Card Type 2230 96库存量
106预期 2027/3/29
最低: 1
倍数: 1

SX-PCEAX 2.4 GHz, 5 GHz, 6 GHz PCIe, USB 3.135 V 3.465 V - 20 C + 65 C MHF4 22 mm x 30 mm x 2.7 mm Bluetooth 5.2 802.11 a/b/g/n/ac/ax Bulk
Sierra Wireless 多协议模块 5G RedCap module, industrial grade, LTE and GNSS based on Qualcomm's SDX35 197库存量
1,000预期 2026/9/4
最低: 1
倍数: 1

USB 3.135 V 4.4 V Tray

Murata Electronics 多协议模块 Type 1LD Shielded ultra-small dual bandWi-Fi 11a/b/g/n/ac Bluetooth 4.2 845库存量
最低: 1
倍数: 1
: 1,000

1LD 2.4 GHz 17 dBm GPIO, I2C, SPI, UART 1.8 V 3.6 V - 40 C + 85 C External 8.9 mm x 7.8 mm x 1.2 mm Bluetooth 4.2 802.11 a/b/g/n/ac AWS Reel, Cut Tape
Quectel 多协议模块 Cat 4 + 3G, 4Gbit ROM+2Gbit RAM, voice + data application, North America, mPCIe form factor 59库存量
最低: 1
倍数: 1

I2C, PCIe, PCM, UART, USB 2.0 3 V 3.6 V - 35 C + 75 C SMA 51 mm x 30 mm x 4.9 mm LTE Cat 4 GNSS Tray
Quectel 多协议模块 Cat 4 + 3G, 1Gbit ROM+1Gbit RAM, voice + data application, North America, mPCIe form factor 101库存量
最低: 1
倍数: 1
: 100

824 MHz to 960 MHz, 1.561 GHz, 1.57542 GHz, 1.71 GHz to 2.69 GHz, 2.4 GHz to 2.5 GHz I2C, PCIe, PCM, UART, USB 2.0 3 V 3.6 V - 35 C + 75 C SMA 51 mm x 30 mm x 4.9 mm LTE Cat 4 GNSS Reel, Cut Tape