多协议模块

结果: 245
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描述 数据表 供货情况 单价（含13%增值税） 根据您的数量，按照单价筛选表格中的结果。
数量 RoHS ECAD模型 系列
频率
输出功率
接口类型
电源电压-最小
电源电压-最大
最小工作温度
最大工作温度
天线连接器类型
尺寸
协议 - 蓝牙、BLE - 802.15.1
协议 - 蜂窝、Nbiot、LTE
协议 - GPS、GLONASS
协议 - Sub GHz
协议 - WiFi - 802.11
协议 - ANT、Thread、Zigbee - 802.15.4
封装
Inventek ISM43439-WBP-L54C
Inventek 多协议模块

Tray
Inventek ISM43439-WBP-L54U
Inventek 多协议模块

Tray
u-blox M2-JODY-W683-10C
u-blox 多协议模块 M.2 card with JODY-W683, single package

Bulk
u-blox M2-MAYA-W381-00C
u-blox 多协议模块 M.2 card with MAYA-W381, in tray

Tray
CEL 多协议模块 CMP9670 Tri-Band Wi-Fi 6e 2x2 MU-MIMO DBS BT5.2 M.2 Card
数据表

CMP9670 PCIe, USB Bluetooth Bulk
CEL 多协议模块 CMP9670 Tri-Band Wi-Fi 6e 2x2 MU-MIMO DBS BT5.2 Half-size Mini-PCIe Card
数据表

CMP9670 PCIe, USB Bluetooth Bulk
Silex Technology 多协议模块 [Bulk SKU] SX-PCEBE-M2 is a Wi-Fi7 2x2 Tri-band IEEE802.11 be WLAN, Bluetooth 5.3 BR/EDR/HS/LE module in a M.2 card form factor (M.2 Card Type 2230-S3-A-E). It is based on Qualcomm's QCC2076 chipset.
数据表

SX-PCEBE 2.4 GHz, 5 GHz, 6 GHz Bluetooth, USB, UART 3.3 V - 40 C + 85 C MHF4 Tray
Silex Technology 多协议模块 [Sample Pack] SX-PCEBE-M2-SP is a Wi-Fi7 2x2 Tri-band IEEE802.11 be WLAN, Bluetooth 5.3 BR/EDR/HS/LE module in a M.2 card form factor (M.2 Card Type 2230-S3-A-E). It is based on Qualcomm's QCC2076 chipset. This is ideal for low quantity purchases fo
数据表

SX-PCEBE 2.4 GHz, 5 GHz, 6 GHz USB - 40 C + 85 C MHF4 Bluetooth WiFi Bulk
Quectel 多协议模块 Cat 1 + 2G, 8M, w/ GNSS, w/ BT4.2, EMEA/ Australia/ New Zealand
数据表
Tray
Quectel 多协议模块 Wi-Fi 6, 802.11a/ b/ g/ n/ ac/ ax, 2 2 (2T2R), 2.4/ 5 GHz dual-band, PCIe interface, 2 antennas (BT 5.2 shares 1 Wi-Fi antenna), -20 C to +70 C, M.2 FF
数据表
2.4 GHz, 5 GHz PCIe, UART 3 V 3.6 V - 20 C + 70 C 22 mm x 30 mm x 2.85 mm Bluetooth 5.2 802.11a/b/g/n/ac/ax Tray
Quectel 多协议模块 Wi-Fi 6, 802.11a/ b/ g/ n/ ac/ ax, 2 2 (2T2R), 2.4/ 5 GHz dual-band, PCIe interface, 2 antennas (BT 5.2 shares 1 Wi-Fi antenna), -40 C to +85 C, M.2 FF
数据表
2.4 GHz, 5 GHz PCIe, UART 3 V 3.6 V - 40 C + 85 C 22 mm x 30 mm x 2.85 mm Bluetooth 5.2 802.11a/b/g/n/ac/ax Tray
Quectel 多协议模块 Wi-Fi 6, 802.11a/ b/ g/ n/ ac/ ax, 2 2 (2T2R), 2.4/ 5 GHz dual-band, PCIe interface, 3 antennas (BT 5.2 via separate antenna), -20 C to +70 C, M.2 FF
数据表
2.4 GHz, 5 GHz PCIe, UART 3 V 3.6 V - 20 C + 70 C 22 mm x 30 mm x 2.85 mm Bluetooth 5.2 802.11a/b/g/n/ac/ax Tray
Quectel 多协议模块 Wi-Fi 6, 802.11a/ b/ g/ n/ ac/ ax, 2 2 (2T2R), 2.4/ 5 GHz dual-band, PCIe interface, 3 antennas (BT 5.2 via separate antenna), -40 C to +85 C, M.2 FF
数据表
2.4 GHz, 5 GHz PCIe, UART 3 V 3.6 V + 85 C 22 mm x 30 mm x 2.85 mm Bluetooth 5.2 802.11a/b/g/n/ac/ax Tray
Quectel 多协议模块 Wi-Fi 6, 802.11a/ b/ g/ n/ ac/ ax, 2 2 + 2 2, 2.4/ 5 GHz dual-band, Bluetooth 5.2, DBS, M.2 FF
数据表
Tray
Quectel 多协议模块 5G R17 Redcap, 5G SA only, LTE CAT4, miniPCIe FF, Global version (newer PCB revision)
数据表
PCIe, PCM, USB 2.0 3.135 V 4.4 V - 30 C + 75 C 5G BDS, Galileo, GLONASS, GPS, QZSS Tray
Quectel 多协议模块 Cat 4 + 3G + 2G, Cost down version of EG25-G, data only, MINIPCIE form factor, Global
数据表
ADC, GPIO, PCM, UART, USB 2.0 3.3 V 4.3 V - 35 C + 75 C Pad 51 mm x 30 mm x 4.9 mm LTE Cat 4 GNSS Tray
Quectel 多协议模块 Wi-Fi 6, 802.11a/ b/ g/ n/ ac/ ax, 2 2 + 2 2, 2.4/ 5 GHz dual-band, Bluetooth 5.2, DBS, M.2 FF, Co-existence with Cellular
数据表
2.4 GHz, 5 GHz PCIe 3 V 3.6 V - 30 C + 65 C 22 mm x 30 mm x 4 mm Bluetooth 5.3 802.11a/b/g/n/ac/ax Tray
Quectel 多协议模块 Wi-Fi 7, 802.11a/b/g/n/ac/ax/be, 2.4/ 5/ 6 GHz, DBS, Bluetooth 5.4, PCle, PCM/I2S, USB, -10 +65 , M.2 FF
数据表
2.4 GHz, 5 GHz, 6 GHz 3 V 3.6 V - 10 C + 65 C 30 mm x 22 mm x 2.2 mm Bluetooth 5.4 802.11a/b/g/n/ac/ax/be Tray
Quectel 多协议模块 Wi-Fi 7 + BLE 5.4, 802.11a/ b/ g/ n/ ac/ ax/ be, 2.4/ 5/ 6 GHz, 2x2 MIMO, 4K QAM, 160MHz bandwidth, WPA3, STA/AP -10C + 70C, M.2 FF
2.4 GHz, 5 GHz, 6 GHz BLE 5.4 802.11a/b/g n/ac/ax/be Tray
Quectel FME166QAAMD
Quectel 多协议模块 Wi-Fi 6E, 802.11a/ b/ g/ n/ ac/ ax, 2 2 + 2 2, 2.4/ 5/ 6 GHz triple-band, Bluetooth 5.2, DBS, M.2 FF
2.4 GHz, 5 GHz, 6 GHz Bluetooth 5.2 802.11a/b/g n/ac/ax/be Tray