Cut Tape 多协议模块

结果: 428
选择 图像 零件编号 制造商 描述 数据表 供货情况 单价(含13%增值税) 根据您的数量,按照单价筛选表格中的结果。 数量 RoHS ECAD模型 系列 频率 输出功率 接口类型 电源电压-最小 电源电压-最大 最小工作温度 最大工作温度 天线连接器类型 尺寸 协议 - 蓝牙、BLE - 802.15.1 协议 - 蜂窝、Nbiot、LTE 协议 - GPS、GLONASS 协议 - Sub GHz 协议 - WiFi - 802.11 协议 - ANT、Thread、Zigbee - 802.15.4 资格 封装
NXP Semiconductors 多协议模块 IW610GHN/A1ZDI

IW610GHN 2.4 GHz, 5 GHz 23 dBm SDIO, SPI, UART, USB 3.14 V 3.46 V - 40 C + 125 C Bluetooth, BLE - 802.15.4 WiFi 6 Reel, Cut Tape
Telit Cinterion 多协议模块 WE310F5-I (Wi-Fi b/g/n + BLE) 39.00.008
2.4 GHz 8 dBm, 18 dBm SPI, UART 3.3 V - 40 C + 85 C 18 mm x 15 mm x 2.6 mm Bluetooth 802.11 b/g/n Reel, Cut Tape
Telit Cinterion 多协议模块 WE310F5-P (Wi-Fi b/g/n + BLE) 39.00.008
2.4 GHz 8 dBm, 18 dBm SPI, UART - 40 C + 85 C 14.3 mm x 13.1 mm x 2.6 mm Bluetooth 802.11 b/g/n Reel, Cut Tape
Telit Cinterion 多协议模块 WE310G4-I (Wi-Fi a/b/g/n+BLE) 47.00.003
5 GHz 8 dBm, 18 dBm, 19 dBm I2C, SPI, UART - 40 C + 85 C 14.3 mm x 13.1 mm x 2.6 mm Bluetooth 5.0 802.11 a/b/g/n Reel, Cut Tape
Telit Cinterion 多协议模块 WE310G4-P (Wi-Fi a/b/g/n+BLE) 47.00.003
5 GHz 8 dBm, 18 dBm, 19 dBm I2C, SPI, UART - 40 C + 85 C 18 mm x 15 mm x 2.6 mm Bluetooth 5.0 802.11 a/b/g/n Reel, Cut Tape
Texas Instruments 多协议模块 SimpleLink Wi-Fi 6 c ompanion module
CC3300MOD 2.412 GHz to 2.472 GHz 18.4 dBm SPI, UART 1.62 V, 2.97 V 1.98 V, 3.63 V - 40 C + 85 C 11 mm x 11 mm Bluetooth Wi-Fi 6, 802.11ax Reel, Cut Tape, MouseReel
Texas Instruments 多协议模块 SimpleLink dual-band (2.4GHz and 5GHz) W
CC3351MOD 2.41 GHz to 2.47 GHz 18.3 dBm SPI - 40 C + 85 C 10.9 mm x 10.9 mm x 2.1 mm Bluetooth WiFi Reel, Cut Tape, MouseReel
Silicon Labs RS916NS00AC0A3
Silicon Labs 多协议模块

Cut Tape
Silicon Labs RS916NS00AC1A3
Silicon Labs 多协议模块

Cut Tape
Silicon Labs RS916WS00AC0A3
Silicon Labs 多协议模块

Cut Tape
Silicon Labs RS916WS00AC1A3
Silicon Labs 多协议模块

18 dBm USB, SDIO 1.75 V 3.63 V - 40 C + 85 C Cut Tape
Silicon Labs RS916WS00AC1A3R
Silicon Labs 多协议模块

Reel, Cut Tape
Silex Technology 多协议模块 IM-100 is a small, stand-alone, dual-band Wi-Fi 6 and Bluetooth Low Energy

260 MHz I2C, SPI, UART - 40 C + 85 C MHF 18 mm x 17 mm x 2.65 mm 802.11 a/b/g/n/ac/ax Cut Tape
Silex Technology 多协议模块 the option to attach an antenna via a trace does not include the u.Fl connector

260 MHz I2C, SPI, UART - 40 C + 85 C 18 mm x 17 mm x 2.65 mm 802.11 a/b/g/n/ac/ax Cut Tape
Silex Technology 多协议模块 [Sample Pack] SX-PCEBE-SMT-SP is a Wi-Fi 7 2x2 Tri-band IEEE802.11 be WLAN, Bluetooth 5.3 BR/EDR/HS/LE module in an M.2 LGA Type 1620 Surface Mount form factor. It is based on Qualcomm's QCC2076 chipset. This is ideal for low quantity purchases for e

SX-PCEBE 2.4 GHz, 5 GHz, 6 GHz USB - 40 C + 85 C MHF4 Bluetooth WiFi Cut Tape
Quectel 多协议模块 LTE Cat 1 + 2G, global, VoLTE, w/ GNSS, w/ BT

ADC, GPIO, I2C, PCM, UART, USB 2.0 3.3 V 4.3 V - 35 C + 75 C 29 mm x 25 mm x 2.4 mm Bluetooth LTE Cat 1 GNSS Reel, Cut Tape
Quectel 多协议模块 cloud enabled, Wi-Fi 4, 2.4GHz, BLE 5.2, Antenna: IPEX-1, -40 85C, 2MB flash
2.4 GHz UART 3 V 3.6 V - 40 C + 85 C IPEX-1 24 mm x 16 mm x 2.6 mm BLE 5.2 802.11 b/g/n Reel, Cut Tape
Quectel 多协议模块 cloud enabled, Wi-Fi 4, 2.4GHz, BLE 5.2, Antenna: PCB, -40 85C, 2MB flash
2.4 GHz UART 3 V 3.6 V - 40 C + 85 C PCB 24 mm x 16 mm x 2.6 mm BLE 5.2 802.11 b/g/n Reel, Cut Tape
Quectel 多协议模块 cloud enabled, Wi-Fi 4, 2.4GHz, BLE 5.2, Antenna: PCB, extended temp -40 105C, 4MB flash
2.4 GHz UART 3 V 3.6 V - 40 C + 105 C PCB 24 mm x 16 mm x 2.6 mm BLE 5.2 802.11 b/g/n Reel, Cut Tape
Quectel 多协议模块 Wi-Fi 4, 2.4GHz, BLE 5.2, Antenna: PCB, extended temp -40 105C, 2MB flash
2.4 GHz - 40 C + 105 C Reel, Cut Tape
Quectel 多协议模块 Wi-Fi 4, 2.4GHz, BLE 5.2, Antenna: PCB, -40 105C, 2MB flash

Reel, Cut Tape
Quectel 多协议模块 Wi-Fi 4, 2.4GHz, BLE 5.2, Antenna: PCB, -40 105C, 4MB flash

Reel, Cut Tape
Quectel 多协议模块 Wi-Fi 4, 2.4GHz, BLE 5.2, Antenna: RF coax conn, -40 105C, 2MB flash

Reel, Cut Tape
Quectel 多协议模块 Wi-Fi 4, 2.4GHz, BLE 5.2, Antenna: RF coax conn, -40 105C, 4MB flash

Reel, Cut Tape
Quectel 多协议模块 Cat M/ NB/ EGPRS/ NTN module
- 40 C + 85 C 23.6 mm x 19.9 mm x 2.2 mm EGPRS, LTE Cat M1/NB2 GNSS Reel, Cut Tape