WIRE 多协议模块

结果: 1,654
选择 图像 零件编号 制造商 描述 数据表 供货情况 单价(含13%增值税) 根据您的数量,按照单价筛选表格中的结果。 数量 RoHS ECAD模型 系列 频率 输出功率 接口类型 电源电压-最小 电源电压-最大 最小工作温度 最大工作温度 天线连接器类型 尺寸 协议 - 蓝牙、BLE - 802.15.1 协议 - 蜂窝、Nbiot、LTE 协议 - GPS、GLONASS 协议 - Sub GHz 协议 - WiFi - 802.11 协议 - ANT、Thread、Zigbee - 802.15.4 资格 封装
Espressif Systems 多协议模块 SMD module, ESP32-S3, 8 MB SPI flash, IPEX antenna connector 1,533库存量
6,500预期 2026/8/10
最低: 1
倍数: 1

2.4 GHz 20.5 dBm GPIO, I2C, I2S, SPI, UART 3 V 3.6 V - 40 C + 85 C PCB 19.2 mm x 18 mm x 3.2 mm Bluetooth 5.0 802.11 b/g/n Bulk
Espressif Systems 多协议模块 SMD module, ESP32-S3R8 with 8 MB Octal PSRAM die inside, 16 MB Quad SPI flash, IPEX antenna connector 2,573库存量
7,150预期 2026/7/14
最低: 1
倍数: 1

2.4 GHz 20.5 dBm GPIO, I2C, I2S, SPI, UART 3 V 3.6 V - 40 C + 65 C PCB 19.2 mm x 18 mm x 3.2 mm Bluetooth 5.0 802.11 b/g/n Bulk
Embedded Artists 多协议模块 2XS M.2 Wi-Fi 6 a/b/g/n/ac/ax MIMO, Bluetooth 5.3 with 88W9098 and LBEE5ZZ2XS 4库存量
最低: 1
倍数: 1

2.4 GHz, 5 GHz UART, USB 3.14 V 3.46 V - 40 C + 85 C u.FL 22 mm x 30 mm x 1.5 mm Bluetooth 5.3 802.11 a/b/g/n/ac/ax Bulk
Silicon Labs 多协议模块 Wireless gecko multi-protocol module, +10 dBm, 2.4 GHz, 1 MB Flash, -40 to 125 C, built-in antenna, certified. 1,390库存量
1,000预期 2026/9/28
最低: 1
倍数: 1
: 1,000

2.4 GHz 10 dBm I2C, USART 1.8 V 3.8 V - 40 C + 125 C Built-In, RF 12.9 mm x 15 mm x 2.2 mm Bluetooth 5.3 802.15.4 (ANT, Thread, Zigbee) Reel, Cut Tape
Embedded Artists 多协议模块 1YN M.2 Wi-Fi 4 b/g/n, Bluetooth 5.2 with CYW43439 chipset and LBEE5KL1YN 68库存量
最低: 1
倍数: 1

2.4 GHz 4-Wire UART, SDIO 3 V 3.5 V - 30 C + 85 C u.FL 22 mm x 44 mm Bluetooth 5.2 802.11 a/b/g/n Bulk


Fanstel 多协议模块 Compact nRF5340 BLE 5.4 module, dualcore MCU, 1280KB flash, 276KB RAM, pads for antenna 1,285库存量
最低: 1
倍数: 1
: 1,000
2.4 GHz 3.6 dBm I2S, QSPI, SPI, UART 1.7 V 5.5 V - 40 C + 105 C External Antenna 8.4 mm x 9 mm x 1.6 mm Bluetooth 5.2 Reel, Cut Tape
Microchip Technology 多协议模块 ATWINC3400 802.11 b/g/n + Bluetooth 5 Module Chip Antenna T&R 160库存量
最低: 1
倍数: 1
: 500

ATWINC3400 2.4 GHz 18.3 dBm I2C, SPI, UART 2.7 V 3.6 V - 40 C + 85 C Chip 22.43 mm x 14.73 mm x 2 mm Bluetooth 5.0 802.11 b/g/n Reel, Cut Tape
Fanstel 多协议模块 BLE 5.1 nRF52833 DF Long Range PCB Ant 609库存量
最低: 1
倍数: 1
: 1,000

BM833 2.4 GHz 8 dBm I2C, I2S, SPI, UART 1.7 V 5.5 V - 40 C + 105 C PCB 10.2 mm x 20.6 mm x 1.9 mm Bluetooth 5.1 802.15.4 (ANT, Thread, Zigbee) Reel, Cut Tape
Microchip Technology 多协议模块 ATWINC3400 802.11 b/g/n + Bluetooth 5 Module Chip Antenna 130库存量
最低: 1
倍数: 1

ATWINC3400 2.4 GHz 18.3 dBm I2C, SPI, UART 2.7 V 3.6 V - 40 C + 85 C Chip 22.43 mm x 14.73 mm x 2 mm Bluetooth 5.0 802.11 b/g/n Tray
Silicon Labs 多协议模块 802.15.4 and Bluetooth Low Energy 5.4 Multiprotocol Wireless Module 153库存量
最低: 1
倍数: 1

MGM260P 2.4 GHz 10 dBm ADC, GPIO, I2C, I2S, IrDA, JTAG, SPI, UART, USART 1.8 V 3.8 V - 40 C + 125 C 12.9 mm x 15 mm Bluetooth, BLE Thread, Zigbee - 802.15.4 Cut Tape
Texas Instruments 多协议模块 SimpleLink multipro tocol 2.4-GHz wirele 238库存量
最低: 1
倍数: 1
: 2,000

CC2652RSIP 2.4 GHz 5 dBm I2C, I2S, SPI, SSI, UART 1.8 V 3.8 V - 40 C + 105 C External 7 mm x 7 mm BLE ISM Thread, Zigbee Reel, Cut Tape, MouseReel
Silicon Labs 多协议模块 802.11 b/g/n dual-band (2.4/5 GHz), dual-mode Bluetooth 5 Wi-Fi Modules 744库存量
最低: 1
倍数: 1

2.4 GHz, 5 GHz 18 dBm SDIO, UART, USB 3 V 3.63 V - 40 C + 85 C External 9.1 mm x 9.8 mm x 1.6 mm Bluetooth 5.0 Tray
Ezurio 多协议模块 Sterling-LWB, U.FL, Cut Tape 749库存量
250预期 2027/1/20
最低: 1
倍数: 1

Sterling-LWB 2.4 GHz 14 dBm UART 1.8 V 3.6 V - 40 C + 85 C u.FL 15.5 mm x 21 mm x 2 mm Bluetooth LE 802.11 b/g/n Cut Tape
Espressif Systems 多协议模块 SMD module, ESP32-C3FH4, IPEX antenna connector, -40C - +105C 5,093库存量
最低: 1
倍数: 1

2.4 GHz 20.5 dBm GPIO, I2C, I2S, SPI, UART 2.7 V 3.6 V - 40 C + 105 C External 13.2 mm x 12.5 mm x 2.4 mm Bluetooth Tray
Silicon Labs 多协议模块 Multiprotocol module, 2,4 GHz w/PCB antenna, +10 dBm, 1.5MB Flash, 192kB RAM, Secure Vault Mid, Certified 182库存量
最低: 1
倍数: 1

MGM240L 2.4 GHz Cut Tape
Silicon Labs 多协议模块 Multiprotocol module, 2,4 GHz w/PCB antenna, +10 dBm, 1.5MB Flash, 256kB RAM, Secure Vault High, MVP(AI/ML), Certified 1,175库存量
最低: 1
倍数: 1
: 1,000

MGM240L 2.4 GHz Reel, Cut Tape
Silicon Labs 多协议模块 Multiprotocol module, 2,4 GHz w/PCB antenna, +10 dBm, 1.5MB Flash, 256kB RAM, Secure Vault Mid, Certified 234库存量
最低: 1
倍数: 1

MGM240L 2.4 GHz Cut Tape
Silicon Labs 多协议模块 Multiprotocol module, 2,4 GHz w/PCB antenna, +10 dBm, 1.5MB Flash, 192kB RAM, Secure Vault Mid, Certified 995库存量
最低: 1
倍数: 1
: 1,000

MGM240L 2.4 GHz Reel, Cut Tape
Silicon Labs 多协议模块 Multiprotocol module, 2,4 GHz w/PCB antenna, +10 dBm, 1.5MB Flash, 256kB RAM, Secure Vault High, MVP(AI/ML), Certified 99库存量
最低: 1
倍数: 1

MGM240L 2.4 GHz Cut Tape
Silicon Labs 多协议模块 Multiprotocol module, 2,4 GHz w/PCB antenna, +10 dBm, 1.5MB Flash, 256kB RAM, Secure Vault Mid, Certified 186库存量
1,000预期 2026/11/13
最低: 1
倍数: 1
: 1,000

MGM240L 2.4 GHz Reel, Cut Tape
DFRobot 多协议模块 The WiFi7 & Bluetooth 5.4 M.2 E Key Wireless Card offering triple-band connectivity and a maximum wireless speed of 8774Mbps. This advanced wireless module is designed to upgrade the connectivity performance of devices such as LattePanda Sigma, lapto 5库存量
13在途量
最低: 1
倍数: 1

Bluetooth WiFi Bulk
Ezurio 多协议模块 Module, Sterling LWB5+, M.2, Key E, USB, USB 89库存量
最低: 1
倍数: 1

Sterling-LWB5+ 2.4 GHz, 5 GHz USB 3.3 V 3.3 V - 40 C + 85 C External 12 mm x 17 mm x 2.2 mm Bluetooth 5.2, Bluetooth LE WiFi 5, 802.11 ac Tray
Ezurio 多协议模块 Module, Sterling LWB5+, Trace Pin 78库存量
最低: 1
倍数: 1

Sterling-LWB5+ 2.4 GHz, 5 GHz Serial, SDIO, USB 3.3 V 3.3 V - 40 C + 85 C External 12 mm x 17 mm x 2.2 mm Bluetooth 5.2, Bluetooth LE WiFi 5, 802.11 ac Cut Tape
Espressif Systems 多协议模块 SMD module, ESP32-U4WDH with 4 MB flash die inside, ESP32 ECO V3, IPEX connector 1,036库存量
最低: 1
倍数: 1
2.4 GHz 19.5 dBm I2C, I2S, SDIO, SPI, PWM, UART 3 V 3.6 V - 40 C + 85 C PCB 13.2 mm x 19 mm x 2.4 mm Bluetooth 4.2 Tray
u-blox 多协议模块 ESP32, 802.11bgn+BT, antenna pin, open CPU 1,036库存量
最低: 1
倍数: 1
: 500

NINA-W10 2.4 GHz I2C, I2S, SPI, UART 3 V 3.6 V - 40 C + 85 C 10 mm x 10.6 mm x 2.2 mm Reel, Cut Tape