WIRE 多协议模块

结果: 1,655
选择 图像 零件编号 制造商 描述 数据表 供货情况 单价(含13%增值税) 根据您的数量,按照单价筛选表格中的结果。 数量 RoHS ECAD模型 系列 频率 输出功率 接口类型 电源电压-最小 电源电压-最大 最小工作温度 最大工作温度 天线连接器类型 尺寸 协议 - 蓝牙、BLE - 802.15.1 协议 - 蜂窝、Nbiot、LTE 协议 - GPS、GLONASS 协议 - Sub GHz 协议 - WiFi - 802.11 协议 - ANT、Thread、Zigbee - 802.15.4 资格 封装
Nordic Semiconductor 多协议模块 Lower Power SIP for cellular IoT and DECT NR+
29,998在途量
最低: 1
倍数: 1
: 2,000

nRF91 23 dBm I2C, I2S, SPI, UART, USB 3 V 5.5 V - 40 C + 85 C Reel, Cut Tape, MouseReel
InnoPhase IoT 多协议模块 WiFi/BLE5/MCU Module w/ U.FL Antenna Connector 93库存量
最低: 1
倍数: 1
2.4 GHz 17.5 dBm SPI, UART 2.6 V 3.6 V - 40 C + 85 C u.FL 12.8 mm x 17 mm x 2.5 mm BLE 5.0 802.11 b/g/n Tray
Insight SiP 多协议模块 nRF52832 LoRa Transceiver & BLE 5 Module EU
1,322在途量
最低: 1
倍数: 1
ISP4520 863 MHz to 870 MHz, 2.4 GHz 14 dBm SPI 1.8 V 3.6 V - 30 C + 85 C External 9.8 mm x 17.2 mm x 1.7 mm Bluetooth 5.0 Tray
u-blox 多协议模块 IW611, 802.11ax+BT, 1 PCB antenna or antenna pin
1,500预期 2026/7/20
最低: 1
倍数: 1
: 500

MAYA-W2 18 dBm SPI - 40 C + 85 C PCB Antenna 14.3 mm x 10.4 mm x 1.9 mm Reel, Cut Tape
Espressif Systems 多协议模块 "ESP32-C5-WROOM-1 and ESP32-C5-WROOM-1U are two general-purpose 2.4 and 5 GHz dual-band Wi-Fi 6 (802.11ax), Bluetooth 5 (LE), Zigbee, and Thread (802.15.4) modules. The rich set of peripherals and high performance make the module an ideal choice for
9,734在途量
最低: 1
倍数: 1

240 MHz 20 dBm I2C, SPI, UART 3 V 3.6 V - 40 C + 85 C 27.5 mm x 18 mm x 3.3 mm
Jorjin 多协议模块 Based on TI WL1831 and supports 802.11b/g/n & BT/BLE 4.2 111库存量
最低: 1
倍数: 1
: 1,800

2.4 GHz 17 dBm SDIO, UART 2.9 V 4.8 V - 20 C + 75 C 12.8 mm x 12 mm x 1.7 mm Bluetooth 802.11 b/g/n Reel, Cut Tape, MouseReel
Espressif Systems 多协议模块 SMD module, ESP32-S3R2 with 2 MB PSRAM die inside, 16 MB SPI flash, IPEX antenna connector.
11,678预期 2026/9/18
最低: 1
倍数: 1

2.4 GHz 20.5 dBm GPIO, I2C, I2S, SPI, UART 3 V 3.6 V - 40 C + 85 C PCB 19.2 mm x 18 mm x 3.2 mm Bluetooth 5.0 802.11 b/g/n Bulk
InnoPhase IoT 多协议模块 WiFi/BLE5/MCU Module w/ RF Antenna Pin Reduced Footprint 199库存量
最低: 1
倍数: 1

2.4 GHz 17.5 dBm SPI, UART 2.6 V 3.6 V - 40 C + 85 C RF 12.8 mm x 15 mm x 2.5 mm BLE 5.0 802.11 b/g/n Tray
Espressif Systems 多协议模块 SMD module, ESP32-S3R2 with 2 MB PSRAM die inside, 8 MB SPI flash, IPEX antenna connector.
6,226预期 2026/8/11
最低: 1
倍数: 1

2.4 GHz 20.5 dBm GPIO, I2C, I2S, SPI, UART 3 V 3.6 V - 40 C + 85 C PCB 19.2 mm x 18 mm x 3.2 mm Bluetooth 5.0 802.11 b/g/n Bulk
Ezurio 多协议模块 Module, Sona IF573, MIMO, M.2, Key E, PCIe, UART
412在途量
最低: 1
倍数: 1

Sona IF573 2.4 GHz, 5 GHz, 6 GHz UART 3.13 V 3.47 V - 40 C + 85 C MHF4 Bluetooth Core 6.0, Bluetooth LE WiFi 6E, 802.11 a/b/g/n/ax Tray
Ezurio 多协议模块 BL5340 series - Multi-Core / Protocol Bluetooth + 802.15.4 + NFC Module (Nordic nRF52340) - Integrated Antenna (Tape/Reel)
5,000在途量
最低: 1
倍数: 1
: 1,000

BL5340 2.4 GHz 3 dBm ADC, GPIO, I2C, I2S, SPM, UART, USB 1.7 V 5.5 V - 40 C + 105 C Integrated 15 mm x 10 mm x 2 mm Bluetooth LE NFC 802.15.4 802.15.4 (ANT, Thread, Zigbee) Reel, Cut Tape
u-blox 多协议模块 ESP32, 802.11bgn+BT, metal antenna, u-connectXpress
3,990在途量
最低: 1
倍数: 1
: 500

NINA-W15 2.4 GHz 8 dBm, 18 dBm GPIO, I2C, I2S, SPI, UART 3 V 3.6 V - 40 C + 85 C u.FL Bluetooth 802.11 b/g/n Reel, Cut Tape

Texas Instruments 多协议模块 WL18xxMOD Dual-Band Ind Mod A 595-WL1837 A 595-WL1837MODGIMOCR
500预期 2026/11/12
最低: 1
倍数: 1
: 250

WL1837MOD 2.4 GHz, 5 GHz 17.3 dBm SDIO, UART 2.9 V 4.8 V - 40 C + 85 C RF 13.4 mm x 13.3 mm x 2 mm Bluetooth 5.1 802.11 a/b/g/n Reel, Cut Tape, MouseReel
Texas Instruments 多协议模块 SimpleLink multipro tocol 2.4-GHz wirele
2,000预期 2026/10/26
最低: 1
倍数: 1
: 2,000

CC2651R3SIPA 2.4 GHz 5 dBm I2C, I2S, SPI, SSI, UART 1.8 V 3.8 V - 40 C + 105 C External, Integrated 7 mm x 7 mm BLE Thread, Zigbee Reel, Cut Tape, MouseReel
Quectel 多协议模块 Cat M1/Cat NB2, Power Class 5, 450 MHz Supported + GNSS (w/o WWAN concurrency) 33库存量
最低: 1
倍数: 1
: 250

26 dBm GPIO, I2C, UART, USB 2.6 V 4.8 V - 35 C + 75 C Integrated 23.6 mm x 19.9 mm x 2.2 mm LTE Cat M1/NB2 BDS, Galileo, GLONASS, GPS Reel, Cut Tape

Silicon Labs 多协议模块 Wireless bluetooth SiP module, Secure Boot with Root of Trust and Secure Loader(RTSL), 78 MHz, 10 dBm
1,300预期 2026/7/22
最低: 1
倍数: 1

xGM240S 2.4 GHz 10 dBm I2C, USART 1.8 V 3.8 V - 40 C + 105 C Built-In, RF 7 mm x 7 mm x 1.18 mm Bluetooth 5.3 802.15.4 (ANT, Thread, Zigbee) Tray
Intel AX210.D2WG
Intel 多协议模块 Intel Wi-Fi 6E AX210 (Gig+), 1216, 2x2 AX R2 (6GHz)+BT, vPro 1,699库存量
最低: 1
倍数: 1

Wi-Fi 6 AX210 2.4 GHz, 5 GHz, 6 GHz PCIe, USB 0 C + 80 C 12 mm x 16 mm x 1.67 mm Bluetooth 5.3 802.11 ax
Seeed Studio 多协议模块 SenseCAP Solar Node P1 for Meshtastic
33预期 2026/7/1
最低: 1
倍数: 1

Seeed Studio 多协议模块 Seeed Studio XIAO MG24 Sense (3PCS)
50在途量
最低: 1
倍数: 1

Silicon Labs 多协议模块 802.15.4 and Bluetooth Low Energy 5.4 Multiprotocol Wireless Module
1,070预期 2026/9/4
最低: 1
倍数: 1

MGM240P 2.4 GHz 20 dBm I2C, USART 1.8 V 3.8 V - 40 C + 105 C 12.9 mm x 15 mm Bluetooth, BLE 802.15.4 (ANT, Thread, Zigbee) Cut Tape
Embedded Artists 多协议模块 2GF M.2 Module
45在途量
最低: 1
倍数: 1

2.4 GHz to 5 GHz 4-Wire UART, SDIO 3.15 V 3.46 V - 20 C + 70 C u.FL 802.11 a/b/g/n/ac Bulk
Embedded Artists 多协议模块 2EA M.2 Wi-Fi 6E a/b/g/n/ac/ax MIMO, Bluetooth 5.2 with CYW55573 and LBEE5XV2EA
62预期 2026/7/23
最低: 1
倍数: 1

2.4 GHz, 5 GHz, 6 GHz UART, USB 3.3 V 3.6 V 22 mm x 30 mm x 1.5 mm Bluetooth 5.2 802.11 a/b/g/n/ac/ax Bulk
Advantech 多协议模块 5G Sub6+GNSS M.2 3052 Key B, USB only sku
8预期 2026/7/27
最低: 1
倍数: 1

AIW-357 USB 3.1 V 3.63 V - 30 C + 70 C 30 mm x 52 mm x 2.4 mm BeiDou, Galileo, GLONASS, GNSS, GPS, LTE, QZSS, WCDMA
CEL 多协议模块 WiFi bgn BT5 BT Mesh RF Connector BULK 20库存量
最低: 1
倍数: 1

CMP4010 2.4 GHz 18 dBm GPIO, I2C, I2S, SDIO, SPI, UART, USB 3.3 V 3.3 V PCB 16.7 mm x 26.3 mm Bluetooth 5.0 Mesh 802.11 b/g/n Bulk
CEL 多协议模块 RTL8721, Dual Band, WiFi+BLE, MFH4, BULK 5库存量
最低: 1
倍数: 1

CMP4020 2.4 GHz, 5 GHz 18 dBm GPIO, I2C, I2S, SDIO, SPI, UART, USB 3 V 3.6 V - 40 C + 85 C Bluetooth 5.1 Bulk