WIRE 多协议模块

结果: 1,655
选择 图像 零件编号 制造商 描述 数据表 供货情况 单价(含13%增值税) 根据您的数量,按照单价筛选表格中的结果。 数量 RoHS ECAD模型 系列 频率 输出功率 接口类型 电源电压-最小 电源电压-最大 最小工作温度 最大工作温度 天线连接器类型 尺寸 协议 - 蓝牙、BLE - 802.15.1 协议 - 蜂窝、Nbiot、LTE 协议 - GPS、GLONASS 协议 - Sub GHz 协议 - WiFi - 802.11 协议 - ANT、Thread、Zigbee - 802.15.4 资格 封装
NXP Semiconductors IW611UK/A1IZ
NXP Semiconductors 多协议模块 IW611UK/A1I
25预期 2026/8/21
最低: 1
倍数: 1
: 2,000

IW611HN Reel, Cut Tape
NXP Semiconductors IW612UK/A1IZ
NXP Semiconductors 多协议模块 IW612UK/A1I
25预期 2026/8/21
最低: 1
倍数: 1
: 2,000

IW612HN Reel, Cut Tape

Murata Electronics 多协议模块 Type 2BP NXP SR150 UWB MODULE
999预期 2026/9/23
最低: 1
倍数: 1
: 1,000

UWB 6.25 GHz to 8.25 GHz SPI - 30 C + 85 C 6.6 mm x 5.8 mm x 1.2 mm Reel, Cut Tape
Murata Electronics 多协议模块 Type 2FY Infineon CYW55513 ShieldedSmall WiFi 11a/b/g/n/ac/ax SISO+BT 5.4 Module
1,000预期 2026/8/12
最低: 1
倍数: 1
: 1,000

2FY 2.4 GHz, 5 GHz, 6 GHz GPIO, UART 3 V 4.8 V - 40 C + 85 C 7.9 mm x 7.3 mm x 1.1 mm Bluetooth WiFi - 802.11 Reel, Cut Tape
Murata Electronics 多协议模块 Type 2DS Shielded ultra-small dual bandWi-Fi 11a/b/g/n/ac Bluetooth
1,000预期 2026/10/2
最低: 1
倍数: 1
: 500

2DS 2.4 GHz USB 3 V 3.6 V - 40 C + 85 C 25 mm x 14 mm x 2.4 mm Reel, Cut Tape
Silex Technology 多协议模块 [Sample Pack] SX-PCEAX-M2-SP is a sample pack SKU ideal for small quantities used for evaluation and small pilot builds. SX-PCEAX-M2-SP is a 2.4 GHz/5 GHz /6 GHz Tri-band IEEE802.11 ax WLAN, Bluetooth 5.2 BR/EDR/HS/LE module in an M.2 Card Type 2230
97在途量
最低: 1
倍数: 1

SX-PCEAX 2.4 GHz, 5 GHz, 6 GHz PCIe, USB 3.135 V 3.465 V - 20 C + 65 C MHF4 22 mm x 30 mm x 2.7 mm Bluetooth 5.2 802.11 a/b/g/n/ac/ax Bulk
Murata Electronics 多协议模块 Type 2FR module
975预期 2026/11/3
最低: 1
倍数: 1
: 1,000

2FR 2.484 GHz 18 dBm SPI 3.14 V 3.46 V - 40 C + 85 C 12 mm x 11 mm x 1.5 mm Reel, Cut Tape
Silex Technology 多协议模块 [Sample SKU] SX-PCEAC2 is a 2.4 GHz / 5GHz dual band IEEE802.11 a/b/g/n/ac WLAN, Bluetooth 5.0 BR/EDR/LE module based and Low power PCI express interface on Qualcomm QCA6174A-5 chipset. This SKU is the M.2 1630 PCI-E card type. Ideal for low quantity
171预期 2026/7/20
最低: 1
倍数: 1

SX-PCEAC2 2.4 GHz, 5 GHz PCIe, USB 3.135 V 3.465 V - 20 C + 70 C MHF4 30 mm x 16.5 mm x 2.34 mm Bluetooth 5.0 802.11 a/b/g/n/ac Bulk
Silex Technology 多协议模块 2x2 Dual Band 802.11 ac WLAN+BT PCIe
88预期 2026/8/3
最低: 1
倍数: 1

SX-PCEAC2 2.4 GHz, 5 GHz PCIe, USB 3.135 V 3.465 V - 20 C + 70 C MHF4 30 mm x 26.8 mm x 3.4 mm Bluetooth 5.0 802.11 a/b/g/n/ac Bulk
Murata Electronics 多协议模块 BT 5.4/WIFI 6
1,000预期 2026/10/20
最低: 1
倍数: 1
: 1,000

17 dBm SPI 1.71 V 3.46 V - 40 C + 85 C 8.8 mm x 7.7 mm x 1.3 mm 802.11 a/b/g/n/ac/ax Reel, Cut Tape
Murata Electronics 多协议模块 Type 2DL-921, Shielded Small Wi-Fi 11a/b/g/n/ac/ax + Bluetooth 5.3 Module
1,000预期 2026/11/12
最低: 1
倍数: 1
: 1,000

2DL 2.4 GHz, 5 GHz 18 dBm UART 1.71 V 3.46 V - 40 C + 85 C u.FL 8.8 mm x 7.7 mm x 1.3 mm Bluetooth 5.3 Reel, Cut Tape, MouseReel
Quectel 多协议模块 Cat 1 + 3G + 2G, 1Gbit ROM+1Gbit RAM, Global
249在途量
最低: 1
倍数: 1
: 250

33 dBm ADC, I2C, PCM, SD Card, SGMII, UART, USB 2.0 3.3 V 4.3 V - 35 C + 75 C Pad 32 mm x 29 mm x 2.4 mm LTE Cat 1 GNSS Reel, Cut Tape
Quectel 多协议模块 Cat M1/Cat NB2/EGPRS + GNSS (w/o WWAN concurrency), no VoLTE
500预期 2026/7/1
最低: 1
倍数: 1
: 250

850 MHz, 900 MHz, 1.8 GHz, 1.9 GHz 21 dBm ADC, GPIO, I2C, PCM, UART, USB 2.0 3.3 V 4.3 V - 35 C + 75 C Built-In 18.7 mm x 16 mm x 2.1 mm EGPRS, LTE Cat-M1, LTE Cat NB2 GNSS Reel, Cut Tape
Quectel 多协议模块 Wi-Fi 6E, 802.11a/ b/ g/ n/ ac/ ax, 2 2 + 2 2, 2.4/ 5/ 6 GHz triple-band, Bluetooth 5.2, DBS
100预期 2026/8/28
最低: 1
倍数: 1
: 500

2.4 GHz, 5 GHz, 6 GHz PCIe, PCM, UART 1 V 1 V - 30 C + 75 C 19.9 mm x 18 mm x 2.1 mm Bluetooth 5.2 802.11 a/b/g/n/ac/ax Reel, Cut Tape
Quectel 多协议模块 Cat 4 + 3G + 2G module, mPCIe form factor, EMEA, Thailand
97预期 2026/8/6
最低: 1
倍数: 1

Tray
Quectel 多协议模块 Cat 4 + 3G, 4Gbit ROM+2Gbit RAM, Japan only, mPCIe form factor
200在途量
最低: 1
倍数: 1
: 100

I2C, PCIe, PCM, UART, USB 2.0 3 V 3.6 V - 35 C + 75 C Patch 30 mm x 51 mm x 4.9 mm LTE Cat 4 GNSS Reel, Cut Tape
Quectel 多协议模块 Cat 4 + 3G + 2G, 4Gbit ROM+2Gbit RAM, Support B5, EMEA, South Korea, Thailand, India
250预期 2026/8/4
最低: 1
倍数: 1
: 250

700 MHz to 960 MHz 33 dBm ADC, I2C, PCM, SDIO, SGMII, UART, USB 2.0 3.8 V 3.8 V - 35 C + 75 C External 32 mm x 29 mm x 2.4 mm LTE Cat 4 GNSS Reel, Cut Tape
Quectel 多协议模块 Cat 4 + 3G, 1Gbit ROM+1Gbit RAM, data only application, North America, mPCIe form factor
100在途量
最低: 1
倍数: 1

824 MHz to 960 MHz, 1.71 GHz to 2.17 GHz I2C, PCIe, PCM, UART, USB 2.0 3 V 3.6 V - 35 C + 75 C SMA 51 mm x 30 mm x 4.9 mm LTE Cat 4 GNSS Tray
Murata Electronics 多协议模块 Type 1XK Shielded ultra-small dual bandWi-Fi 11a/b/g/n/ac Bluetooth 5.2
972预期 2026/12/24
最低: 1
倍数: 1
: 500

1XK 2.4 GHz, 5 GHz UART 2.7 V 5.5 V - 40 C + 85 C u.FL 9.1 mm x 8.3 mm x 1.3 mm Bluetooth 5.2 Reel, Cut Tape
Quectel 多协议模块 Wi-Fi 4, 2.4GHz, BLE 5.2, Antenna: LCC(ANT_WIFI/BT), 2MB flash
100预期 2026/8/28
最低: 1
倍数: 1
: 500

Reel, Cut Tape
Lantronix 多协议模块 TRACKER FOX3-4G-C1-EU-BLE-EUROPE - 4G CAT1 20, 3, 7 -2G FB BAND 8, 3 - GNSS - ACCELEROMETER, INT & EXT ANT - BT LE 4.1 - MINI SIM - 2 X RS232 - 3 I/O - I2C - RTC - 1 WIRE - MINI USB - AVL SOFTWARE 无库存交货期 8 周
最低: 1
倍数: 1

FOX 3 Bulk
HMS Networks 多协议模块 Wireless Bolt-Serial Interface 无库存
最低: 1
倍数: 1

Anybus Wireless 2.4 GHz, 5 GHz 18 dBm Bluetooth, Ethernet, Serial, WiFi 9 V 30 V - 40 C + 65 C Built-In 68 mm x 75 mm Bluetooth 2.1 802.11 a/b/g/n/d Bulk
Silicon Labs 多协议模块 MGM220P wireless gecko 无库存交货期 20 周
最低: 1,000
倍数: 1,000
: 1,000

2.4 GHz 8 dBm Bluetooth, GPIO, I2C, UART 1.8 V 3.8 V - 40 C + 105 C Built-In 15 mm x 12.9 mm Bluetooth 5.2, Bluetooth Mesh Zigbee Reel
HMS Networks 多协议模块 Wireless Bolt-CAN Interface (Sunbolt) 无库存
最低: 1
倍数: 1

Anybus Wireless 2.4 GHz, 5 GHz 18 dBm CAN, Ethernet, WiFi 9 V 30 V - 40 C + 65 C Built-In 68 mm x 75 mm Bluetooth 2.1 802.11 a/b/g/n/d Bulk
Sierra Wireless 多协议模块 Optimized 4G Cat-4 connectivity with 3G fallback for EMEA and Australia 无库存
最低: 500
倍数: 500
: 500

RC Series 900 MHz, 1.8 GHz GPIO, I2C, UART, USB - 40 C + 85 C 22 mm x 23 mm x 2.5 mm 4G, 3G, 2G BeiDou, Galileo, Glonass, GPS, QZSS Reel