CA 多协议模块

结果: 1,524
选择 图像 零件编号 制造商 描述 数据表 供货情况 单价(含13%增值税) 根据您的数量,按照单价筛选表格中的结果。 数量 RoHS ECAD模型 系列 频率 输出功率 接口类型 电源电压-最小 电源电压-最大 最小工作温度 最大工作温度 天线连接器类型 尺寸 协议 - 蓝牙、BLE - 802.15.1 协议 - 蜂窝、Nbiot、LTE 协议 - GPS、GLONASS 协议 - Sub GHz 协议 - WiFi - 802.11 协议 - ANT、Thread、Zigbee - 802.15.4 资格 封装
Ezurio 多协议模块 RF Module, Chip Ant Sterling-LWB CYW4343W 913库存量
最低: 1
倍数: 1

Sterling-LWB 2.4 GHz 14 dBm UART 1.8 V 3.6 V - 40 C + 85 C Chip 15.5 mm x 21 mm x 2 mm Bluetooth LE 802.11 b/g/n Cut Tape

Ezurio 多协议模块 2.4GHz + 5GHz WiFi AC module + BT5.0
2.4 GHz, 5 GHz SDIO, UART 3.135 V 3.465 V - 20 C + 70 C u.FL 13 mm x 18 mm Bluetooth 4.1 802.11 a/b/g/n/ac
Espressif Systems 多协议模块 SMD module, ESP32-U4WDH with 4 MB flash die inside, ESP32 ECO V3, IPEX connector 1,087库存量
最低: 1
倍数: 1
2.4 GHz 19.5 dBm I2C, I2S, SDIO, SPI, PWM, UART 3 V 3.6 V - 40 C + 85 C PCB 13.2 mm x 19 mm x 2.4 mm Bluetooth 4.2 Tray
Espressif Systems 多协议模块 2.4 GHz, Wi-Fi and Bluetooth 5, 14 GPIOs, QFN-24, RISC-V Single-Core CPU 4,930库存量
最低: 1
倍数: 1

Telit Cinterion 多协议模块 170库存量
最低: 1
倍数: 1

I2C, SPI, UART 3.4 V 4.2 V - 40 C + 85 C 28.2 mm x 28.2 mm x 2.2 mm Bluetooth LTE WiFi Tray
Espressif Systems 多协议模块 SMD module, ESP32-S3R2 with 2 MB PSRAM die inside, 4 MB SPI flash, IPEX antenna connector.

2.4 GHz 20.5 dBm GPIO, I2C, I2S, SPI, UART 3 V 3.6 V - 40 C + 85 C PCB 19.2 mm x 18 mm x 3.2 mm Bluetooth 5.0 802.11 b/g/n Bulk

Silicon Labs 多协议模块 Wireless bluetooth SiP module, Secure Boot with Root of Trust and Secure Loader(RTSL), 78 MHz, 10 dBm 1,296库存量
最低: 1
倍数: 1

xGM240S 2.4 GHz 10 dBm I2C, USART 1.8 V 3.8 V - 40 C + 105 C Built-In, RF 7 mm x 7 mm x 1.18 mm Bluetooth 5.3 802.15.4 (ANT, Thread, Zigbee) Tray
Microchip Technology 多协议模块 ATWINC3400 802.11 b/g/n + Bluetooth 5 Module Chip Antenna 133库存量
最低: 1
倍数: 1

ATWINC3400 2.4 GHz 18.3 dBm I2C, SPI, UART 2.7 V 3.6 V - 40 C + 85 C Chip 22.43 mm x 14.73 mm x 2 mm Bluetooth 5.0 802.11 b/g/n Tray
Ezurio 多协议模块 BLE module BL653 (Nordic nRF52833) Trace pin 1,757库存量
最低: 1
倍数: 1

BL653 2.4 GHz 8 dBm GPIO, I2C, I2S, SPI, UART, USB 1.7 V 5.5 V - 40 C + 105 C External 15 mm x 10 mm x 2.2 mm Bluetooth LE NFC 802.15.4 Thread Cut Tape
Texas Instruments 多协议模块 TI WiLink8 SGL-Band Combo Mod A 595-WL18 A 595-WL1831MODGBMOCR 340库存量
最低: 1
倍数: 1
卷轴: 250

WL1831MOD 2.4 GHz 17.3 dBm SDIO, UART 2.9 V 4.8 V - 20 C + 70 C RF 13.4 mm x 13.3 mm x 2 mm BLE, Bluetooth 5.1 802.11 a/b/g/n Reel, Cut Tape, MouseReel
Intel 多协议模块 Intel Wi-Fi 6 AX201 (Gig+), 1216, 2x2 AX+BT, vPro 755库存量
最低: 1
倍数: 1

Wi-Fi 6 AX201 2.4 GHz, 5 GHz Bluetooth, M.2, WiFi 0 C + 80 C 12 mm x 16 mm x 1.65 mm Bluetooth 5.2 802.11 ax
Renesas / Dialog 多协议模块 Wi-Fi/BLE Combo Module (Chipset antenna) 839库存量
最低: 1
倍数: 1
卷轴: 500

DA16600 2.4 GHz 18 dBm I2C, I2S, PWM, SPI, SWD, JTAG, UART 1.8 V 3.3 V - 40 C + 85 C Chip 14.3 mm x 24.3 mm x 3 mm Bluetooth 5.1 802.11 b/g/n Reel, Cut Tape

Silicon Labs 多协议模块 Wireless bluetooth SiP module, Secure Boot with Root of Trust and Secure Loader(RTSL), MVP, 78 MHz, 10 dBm 1,369库存量
最低: 1
倍数: 1

xGM240S 2.4 GHz 10 dBm I2C, USART 1.8 V 3.8 V - 40 C + 105 C Built-In, RF 7 mm x 7 mm x 1.18 mm Bluetooth 5.3 802.15.4 (ANT, Thread, Zigbee) Tray
Silex Technology 多协议模块 [Sample Pack] SX-SDMAX-2530C is a board-to-board connector type board implementing the SX-SDMAX-2530S. It is a 2.4 GHz/5 GHz dual-band Wi-Fi 6 plus Bluetooth v5.3 BR/EDR/LE SDIO 3.0 module using the NXP IW611 chipset.It includes an MHF-I connector f 10库存量
最低: 1
倍数: 1

SX-SDMAX 2.4 GHz/5 GHz Bluetooth, WiFi, UART 3.14 V 3.46 V - 40 C + 85 C 24 mm x 24 mm x 4.45 mm Bulk
Espressif Systems 多协议模块 SMD module, ESP32-PICO-V3 with 4MB flash die inside, ESP32 ECO V3, PCB antenna, for Alexa Connect Kit (ACK). 483库存量
最低: 1
倍数: 1
卷轴: 650

ESP32 2.4 GHz 19.5 dBm GPIO, I2C, I2S, SDIO, SPI, UART 3 V 3.6 V - 40 C + 85 C PCB 16 mm x 23 mm x 2.3 mm BLE, Bluetooth 4.2 802.11 b/g/n Reel, Cut Tape
Murata Electronics 多协议模块 Type 1XL Shielded ultra-small dual bandWi-Fi 11a/b/g/n/ac Bluetooth 5.1 1,830库存量
最低: 1
倍数: 1
卷轴: 1,000

1XL 2.4 GHz, 5 GHz 18 dBm PCIe, SDIO, UART 1.71 V 3.46 V - 40 C + 60 C Without Antenna 19.1 mm x 16.5 mm x 2.1 mm Bluetooth 5.3 802.11 a/b/g/n/ac/ax Reel, Cut Tape
Ezurio 多协议模块 BLE v4.2 Module NFC Integrated Ant. (Nordic nRF52832) 906库存量
最低: 1
倍数: 1

BL65x 2.4 GHz 4 dBm GPIO, I2C, SPI, UART 1.8 V 3.6 V - 40 C + 85 C Chip 14 mm x 10 mm x 2.1 mm Bluetooth LE NFC Cut Tape
Ezurio 多协议模块 BLE module BL653 (Nordic nRF52833) Trace pin 967库存量
最低: 1
倍数: 1
卷轴: 1,000

BL653 2.4 GHz 8 dBm GPIO, I2C, I2S, SPI, UART, USB 1.7 V 5.5 V - 40 C + 105 C External 15 mm x 10 mm x 2.2 mm Bluetooth LE NFC 802.15.4 Thread Reel, Cut Tape
Ezurio 多协议模块 BL651 Series - Bluetooth v5 Module, Int. Antenna (Nordic nRF52810) Cut Tape 477库存量
最低: 1
倍数: 1

BL651 2.4 GHz 4 dBm GPIO, I2C, SPI, UART 1.7 V 3.6 V - 40 C + 85 C PCB 14 mm x 10 mm x 2.1 mm Bluetooth LE Cut Tape
Ezurio 多协议模块 Wi-Fi Module, Sterling LWB5+, Chip Antenna CYW4373E 640库存量
最低: 1
倍数: 1

Sterling-LWB5+ 2.4 GHz, 5 GHz Serial, SDIO, USB 3.3 V 3.3 V - 40 C + 85 C Chip 12 mm x 17 mm x 2.2 mm Bluetooth 5.2, Bluetooth LE WiFi 5, 802.11 ac Cut Tape
Microchip Technology 多协议模块 ATWINC3400 802.11 b/g/n + Bluetooth 5 Module U.FL Antenna 840库存量
最低: 1
倍数: 1
2.4 GHz 18.3 dBm I2C, SPI, UART 2.7 V 3.6 V - 40 C + 85 C u.FL 22.43 mm x 14.73 mm x 2 mm Bluetooth 5.0 Tray

Texas Instruments 多协议模块 WL18xxMOD Dual-Band Ind Mod A 595-WL1807 A 595-WL1807MODGIMOCR 282库存量
最低: 1
倍数: 1
卷轴: 250

WL1807MOD 2.4 GHz, 5 GHz 17.3 dBm SDIO, UART 2.9 V 4.8 V - 40 C + 85 C RF 13.4 mm x 13.3 mm x 2 mm BLE, Bluetooth 5.1 802.11 a/b/g/n Reel, Cut Tape, MouseReel
Intel AX210.NGWG.NVX
Intel 多协议模块 Intel Killer Wi-Fi 6E AX1675 x (Gig+), 2230, 2x2 AX R2 (6GHz)+BT, No vPro 397库存量
最低: 1
倍数: 1

2.4 GHz, 5 GHz, 6 GHz PCIe, USB 0 C + 80 C 30 mm x 22 mm x 2.4 mm Bluetooth 5.3 802.11 a/b/g/n/ac/ax
Intel AX210.NGWGIE.NV99ARN4
Intel 多协议模块 Intel Wi-Fi 6E AX210 (Gig+), 2230, 2x2 AX R2 (6GHz)+BT, Embedded, No vPro 152库存量
最低: 1
倍数: 1

Intel AX211.NGWG.NV
Intel 多协议模块 Intel Wi-Fi 6E AX211 (Gig+), 2230, 2x2 AX R2 (6GHz)+BT, No vPro 423库存量
最低: 1
倍数: 1

Wi-Fi 6 AX211 2.4 GHz, 5 GHz, 6 GHz PCIe, USB 0 C + 80 C 22 mm x 30 mm x 2.4 mm Bluetooth 5.3 802.11 ax